Light high heat conducting nano composite material and preparation thereof

A nano-composite material and nano-material technology, applied in the field of light-weight and high-thermal-conductivity nano-composite materials and their preparation, can solve problems such as inability to meet the needs of high heat density occasions, low thermal conductivity, and difficult processing, and achieve low production costs and prices , Simple preparation process, good heat dissipation effect

Inactive Publication Date: 2009-07-22
深圳市东维丰电子科技股份有限公司 +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Among metal heat-conducting materials, gold and silver with high thermal conductivity cannot be widely used due to their soft texture, high density, and high price; iron, due to its low thermal conductivity and high density, cannot meet the needs of high heat density occasions, and is not suitable for use in Make computer air-cooling heat sinks, etc.; although copper has a high thermal conductivity, it is rarely used in heat sinks of computer equipment due to unfavorable factors such as high den

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0024] Take natural flake graphite powder, nano-silicon carbide and nano-silicon powder in a weight ratio of 70:15:15 and place them in a closed container, and mix them under stirring conditions, and the speed of the agitator is 10,000 rpm. While mixing, add polymer binder methyl cellulose with 5% of the total weight of the mixed material, and the concentration of the methyl cellulose aqueous solution is 10%. After stirring and mixing for 1 hour, the mixed material is dried at a temperature of 120°C. Disperse, and then press and sinter the powder under a vacuum of 300 degrees and a pressure of 30 MPa to obtain a light-weight and high-thermal-conductivity nanocomposite material.

[0025] It was measured that the thermal conductivity of the composite material along the hot-pressing direction was 6.1 W / m·K, and the thermal conductivity perpendicular to the hot-pressing direction was 190 W / m·K.

Embodiment 2

[0027] Pyrolytic graphite powder and nano-silicon carbide powder were placed in a closed container at a weight ratio of 85:15, and mixed under stirring conditions, and the speed of the stirrer was 11000 rpm. While mixing, add polymer binder methylcellulose with a total weight of 5% of the mixed material, and the concentration of the methylcellulose aqueous solution is 5%. After stirring and mixing for 1 hour, the mixed material is dried at a temperature of 100 ° C. Disperse, and then heat-extrude the powder in an argon atmosphere at 300 degrees and a pressure of 30 MPa to obtain a light-weight and high-thermal-conductivity nanocomposite material.

[0028] It was measured that the composite material had a thermal conductivity of 6.0 W / m·K along the extrusion direction and a thermal conductivity of 188 W / m·K along the extrusion direction.

Embodiment 3

[0030] The expanded graphite powder and nano-silicon powder are placed in a closed container in a weight ratio of 90:10, and mixed under stirring conditions, and the speed of the stirrer is 10,000 rpm. While mixing, add polymer binder polyacrylamide with a total weight of 2% of the mixed material, and the concentration of the polyacrylamide aqueous solution is 5%. After mixing and stirring for 2 hours, dry the mixed material at a temperature of 130°C, and disperse it. Then, the powder is sintered and molded under ultra-high pressure under a vacuum of 600 degrees and a pressure of 50 MPa to obtain a light-weight and high-thermal-conductivity nanocomposite material.

[0031] After measurement, the thermal conductivity of the composite material along the direction of hot pressing is 6.5W / m·K, and the thermal conductivity perpendicular to the direction of hot pressing is 228W / m·K.

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Abstract

The invention discloses a light high-heat conducive nano composite material and a preparation method thereof; wherein, the composite material is formed by mixing 50 to 99 wt (weight percent) percent of black lead powder basic body material and 1 to 50 wt percent of nano materials with high-heat conducive performance. The preparation method comprises: a. selecting the black lead powder with a granularity between 0.1 and 100 microns and the nano carborundum powder and nano silicon powder with a granularity between 10 and 500 nanometers; b. mixing the black lead powder, the carborundum powder and the silicon powder materials under a stirring condition; simultaneously adding a macromolecular caking agent and obtaining the precursor powder of the composite material by carrying out drying and dispersing to the mixed materials; and c. thermosetting and shaping the precursor powder under an oxygen-free atmosphere. The composite material of the invention has the characteristics of easily-obtained and cheap materials, low production cost, light weight, and good heat radiation effect, and can partially or completely replace a metal heat radiating material.

Description

【Technical field】 [0001] The invention relates to heat-conducting materials, in particular to a light-weight high-heat-conducting nano-composite material with low production cost, light weight and good heat dissipation effect and a preparation method thereof. 【Background technique】 [0002] As the complexity and functionality of microelectronics has increased at an alarming rate, their power has continued to increase while their size has continued to shrink. Since electronic components themselves are also heat sources, they are at the highest point of the temperature of the entire electronic equipment, and their excessive temperature rise is often a fatal factor leading to failure and failure of electronic systems. In order to make electronic systems (especially sensitive circuits and components) work continuously and stably, it is obviously very important to dissipate them reliably and effectively. Therefore, it is urgent to research and develop high-efficiency electronic ...

Claims

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Application Information

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IPC IPC(8): C04B35/52C04B35/565C04B35/622
Inventor 程继鹏黄国清
Owner 深圳市东维丰电子科技股份有限公司
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