Light high heat conducting nano composite material and preparation thereof

Abstract

The invention discloses a light high-heat conducive nano composite material and a preparation method thereof; wherein, the composite material is formed by mixing 50 to 99 wt (weight percent) percent of black lead powder basic body material and 1 to 50 wt percent of nano materials with high-heat conducive performance. The preparation method comprises: a. selecting the black lead powder with a granularity between 0.1 and 100 microns and the nano carborundum powder and nano silicon powder with a granularity between 10 and 500 nanometers; b. mixing the black lead powder, the carborundum powder and the silicon powder materials under a stirring condition; simultaneously adding a macromolecular caking agent and obtaining the precursor powder of the composite material by carrying out drying and dispersing to the mixed materials; and c. thermosetting and shaping the precursor powder under an oxygen-free atmosphere. The composite material of the invention has the characteristics of easily-obtained and cheap materials, low production cost, light weight, and good heat radiation effect, and can partially or completely replace a metal heat radiating material.

Description

【Technical field】 [0001] The invention relates to heat-conducting materials, in particular to a light-weight high-heat-conducting nano-composite material with low production cost, light weight and good heat dissipation effect and a preparation method thereof. 【Background technique】 [0002] As the complexity and functionality of microelectronics has increased at an alarming rate, their power has continued to increase while their size has continued to shrink. Since electronic components themselves are also heat sources, they are at the highest point of the temperature of the entire electronic equipment, and their excessive temperature rise is often a fatal factor leading to failure and failure of electronic systems. In order to make electronic systems (especially sensitive circuits and components) work continuously and stably, it is obviously very important to dissipate them reliably and effectively. Therefore, it is urgent to research and develop high-efficiency electronic ...

AI Technical Summary

Problems solved by technology

Among metal heat-conducting materials, gold and silver with high thermal conductivity cannot be widely used due to their soft texture, high density, and high price; iron, due to its low thermal conductivity and high density, cannot meet the needs of high heat density occasions, and is not suitable for use in Make computer air-cooling heat sinks, etc.; although copper has a high thermal conductivity, it is rarely used in heat sinks of computer equipment due to unfavorable factors such as high density, high cost, and difficult processing; aluminum is the metal with the highest content in the earth's crust Elements are favored because of their high thermal conductivity, low density, and low price. However, due to the low hardness of pure aluminum, other metal materials are usually added to make aluminum alloys in various application fields, so as to obtain many pure aluminum It has the characteristics that it does not have, so it becomes the first choice for heat sink processing materials