Flexible copper clad laminate

A technology of copper clad laminates and copper foils, applied in the direction of layered products, metal layered products, circuit substrate materials, etc., can solve the problems of reduced circuit peel strength, circuit floating, disconnection, etc., and achieve excellent adhesive strength. , the effect of excellent processability

Active Publication Date: 2009-09-30
NIPPON STEEL CHEMICALL &MATERIAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in the copper-clad laminate made of the above-mentioned roughened copper foil, especially in the flexible printed circuit board obtained after the circuit processing of the copper-clad laminate, if such a chemical Grinding, the chemical polishing liquid will seep into the edge of the circuit, which will easily cause the peeling strength of the circuit to decrease, and if the circuit line is refined, the circuit will float and cause disconnection due to circuit peeling, so it must be improved.

Method used

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Examples

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Embodiment

[0041] Hereinafter, the present invention will be described in more detail based on examples. In addition, in the following examples, unless otherwise specified, various evaluations were measured by the following methods.

[0042] Determination of Adhesion

[0043] Adhesion between copper foil and polyimide resin layer is for a flexible copper-clad laminate obtained by forming an insulating layer composed of polyimide resin on copper foil, and performing circuit processing to a line width of 1mm , was measured by peeling off the copper foil in the direction of 180° C. using a tensile tester (Strograph M1) manufactured by Toyo Seiki Co., Ltd.

[0044] Determination of the amount of metal in the surface treatment layer

[0045] The measurement of the metal content of the surface metal layer of copper foil was performed by ICP-AES (Optima 4300DV by PerkinElmer). The measurement takes copper foil with a surface treatment layer as a sample, and after decomposing 2g of the sample...

Synthetic example 1

[0049] Charge N,N-dimethylacetamide into a reaction vessel equipped with a thermocouple and a stirrer and capable of introducing nitrogen. In this reaction container, 2,2'-dimethyl-4,4'-diaminobiphenyl (m-TB) was dissolved in the container while stirring. Next, 3,3',4,4'-biphenyltetracarboxylic dianhydride and pyromellitic dianhydride (PMDA) were added. The way of adding is such that the total amount of monomer added is 15% by weight, and the molar ratio (BPDA:PMDA) of each acid anhydride is 20:80. Thereafter, the stirring was continued for 3 hours to obtain a resin solution a of polyamic acid. The solution viscosity of the resin solution a of polyamic acid was 20000 cps. The polyimide obtained by this polyamic acid shows 25×10 -6 (1 / K) below the low coefficient of linear expansion, which has non-thermoplastic properties.

Synthetic example 2

[0051] Charge N,N-dimethylacetamide into a reaction vessel equipped with a thermocouple and a stirrer and capable of introducing nitrogen. 2,2-bis[4-(4-aminophenoxy)phenyl]propane was dissolved in the reaction vessel with stirring. Next, pyromellitic dianhydride was added so that the total amount of monomers added would be 12% by weight. Thereafter, stirring was continued for 3 hours to obtain a resin solution b of polyamic acid. The solution viscosity of resin solution b of polyamic acid was 3000 cps. The polyimide obtained by the polyamic acid shows more than 30×10 -6 (1 / K) coefficient of linear expansion, which has thermoplastic properties.

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Abstract

The present invention provides a flexible copper clad laminate, which excellent thermal stability and size stability etc., capable satisfying requirement of high-integration and high-intensity, and capable of improving bonding reliability between a copper foil and a polyimide resin layer, and restraining circuit removal in chemical grinding. In the copper clad laminate with copper foil on single side or both sides of the polyimide resin layer, the copper foil contacts with a surface treating layer formed with a plurality of treating layers containing silane coupling treating layer on copper foil layer of the polyimide resin layer, the surface treating layer contains copper, cobalt, nickel and zinc, and ratio of the nickel / (nickel+cobalt+zinc) is higher than 0.23 (measured by ICP-AES), content of zinc is 0.2 to 0.6 mg / dm2, the silane coupling treating layer is formed with silane coupling agent having amidogen.

Description

technical field [0001] The present invention relates to an insulating layer made of polyimide resin and a flexible copper-clad laminate with copper foil on one or both sides. Background technique [0002] In recent years, as mobile phones, digital cameras, digital video cameras, PDAs, car navigators, hard disks, and other electronic devices have become more functional, smaller, and lighter, flexi- Examples of flexible printed circuit boards replacing rigid substrates hitherto used as substrate materials for such electronic circuits are increasing. Furthermore, with regard to flexible printed circuit boards used in such devices that are becoming more sophisticated, there are increasing demands for smaller and higher density, multilayer, miniaturization, and high heat resistance. [0003] In order to meet such requirements, in Patent Document 1, Japanese Patent Publication No. 6-93537, etc., a polyimide resin layer is directly coated on a conductor, and a plurality of polyimi...

Claims

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Application Information

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IPC IPC(8): H05K1/03H05K3/38B32B15/08B32B15/20B32B7/04
CPCB32B15/088B32B15/20B32B27/34B32B2307/3065B32B2311/12B32B2311/22B32B2457/08
Inventor 高尾康幸真田计古川晓子
Owner NIPPON STEEL CHEMICALL &MATERIAL CO LTD
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