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Method for preparing tool and mold hard coating with binary evaporation source

A technology of hard coating and mold, which is applied in the field of hard coating preparation of tools and molds. It can solve the problems of narrow range of reactive evaporation materials, low ionization rate of reactive substances, low relative ionization rate, etc., and achieve high hardness. , solve the effect of narrow selection range and dense film structure

Inactive Publication Date: 2012-02-01
SICHUAN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] Although the cathodic arc method has the characteristics of high ionization rate, deposition rate, and excellent film-base binding force, it has a "droplet" phenomenon, and the obtained film structure is coarse, and the surface particles are 2 to 5 μm; in addition, for multi-element alloys For coating, there is also the problem of composition deviation, which is an important factor affecting the performance of the film layer, especially under the condition of high substrate bias
[0006] Although the magnetron sputtering method is beneficial to the evaporation of various simple substances and compounds, and the deviation of components is small, it is more suitable for the preparation of multi-element alloy composite reaction films, but it also has low ionization rate of reaction substances and low ion energy. The technology of balanced magnetic field and auxiliary ion source can make up for these defects to a certain extent, but it is not ideal, which makes the problems of low relative ionization rate and poor coating wrapping performance affect the application and development of this technology to a certain extent.
[0007] Although the ion evaporation method has a suitable ionization rate and ion energy, the density of the prepared thin film is similar to that of magnetron sputtering, while the uniformity and film-substrate bonding force are better than those of magnetron sputtering. The range of reactive evaporation materials is narrow, which greatly limits the film systems that can be prepared

Method used

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  • Method for preparing tool and mold hard coating with binary evaporation source
  • Method for preparing tool and mold hard coating with binary evaporation source
  • Method for preparing tool and mold hard coating with binary evaporation source

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0039] Clean the M3 high-speed steel hob with CR metal degreasing agent and absolute alcohol in the ultrasonic wave, and then dry it; place the cleaned and dried mold in the coating chamber and vacuumize it to 5×10 -3 Pa; then at 3.5×10 -1 Under the protection of Pa argon gas, the heating power is 9KW, and the heating time is 120min; finally, the plasma power is 4KW, 2.0×10 -1 Argon gas of Pa, under the condition of substrate negative bias voltage 500V, clean for 20min.

[0040] Put the cleaned M3 high speed steel hob in 1.5×10 -1 Under the protection of Pa argon gas, the following steps and conditions are used to coat films sequentially: Heating with 1.2KW electron beam, using Ti as the evaporation source, at 10KW power, substrate negative bias voltage 400V, plating for 8min; passing through 0.4×10 -1 Pa nitrogen, continue to work together with the Ti evaporation source at a power of 10KW, the substrate negative bias is 200V, and plate for 10min; continue to heat the Ti eva...

Embodiment 2

[0042] The tungsten carbide CNC indexable inserts are first cleaned with CR metal degreasing agent and anhydrous alcohol in ultrasonic wave, and then dried; the cleaned and dried tools and molds are placed in the coating chamber and vacuumed to 4×10 -3 Pa; then at 2.5×10 -1 Under the protection of Pa argon gas, the heating power is 9KW, and the heating time is 100min; finally, the plasma power is 4KW, 1.8×10 -1 Argon gas of Pa, under the condition of substrate negative bias voltage 300V, clean for 10min.

[0043] Put the cleaned cemented carbide CNC indexable insert in 1.2×10 -1 Under the protection of Pa argon gas, the following steps and conditions are used to coat films sequentially: heating with a 1.2KW electron beam, using Ti as an evaporation source, at a power of 10KW, and a substrate negative bias of 200V, plating for 8min; passing through 0.3×10 -1 Pa nitrogen, continue to work with the Ti evaporation source at a power of 10KW, the substrate negative bias voltage 13...

Embodiment 3

[0045] Clean the tungsten carbide PCB drill bit with CR metal degreasing agent and anhydrous alcohol in ultrasonic wave, and then dry it; place the cleaned and dried mold in the coating chamber and vacuumize it to 3×10 -3 Pa; then at 2.5×10 -1 Under the protection of Pa argon gas, the heating power is 7KW, heating for 40min; finally, the plasma power is 4KW, 1.8×10 -1 Argon gas of Pa, under the condition of substrate negative bias voltage 200V, clean for 5 minutes.

[0046] Put the cleaned hard alloy PCB drill bit in 1.5×10 -1 Under the protection of Pa argon gas, the following steps and conditions are used to coat films sequentially: Heating with 1.2KW electron beam, using Ti as the evaporation source, at 7.5KW power, substrate negative bias voltage 100V, plating for 5min; passing through 0.2×10 -1 Pa nitrogen, continue to work together with the Ti evaporation source at a power of 7.5KW, a negative substrate bias of 100V, and plate for 5 minutes; continue to heat the Ti eva...

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Abstract

The method disclosed by the present invention prepares the hard coating of tools and molds with a binary evaporation source. After cleaning the conventional tools and molds, then cool them after coating in the following order under the protection of argon: 1) Heating Ti with an electron beam first Evaporation source is carried out plating system, then pass into nitrogen gas to continue plating system together; 2) Ti evaporation source is heated with electron beam, Zr is sputtered with magnetron sputtering method, pass into nitrogen gas to carry out plating system at the same time; 3) Use magnetron sputtering Sputter Zr by sputtering method, and at the same time pass through nitrogen gas for plating. Since the present invention adopts the binary evaporation source technology of vacuum ion evaporation plating and magnetron sputtering ion plating, it not only avoids the problems existing in the prior art, but also makes up for the ionization rate of reaction substances when the magnetron sputtering method is used alone. It also solves the problem of narrow selection range of reactive evaporation materials in the simple ion evaporation plating method, which can meet the requirements of industrial production, and endows tools with better film-base bonding force, higher Excellent hardness, toughness and oxidation resistance, greatly improving its service life.

Description

technical field [0001] The invention belongs to the technical field of preparation methods of hard coatings of tools and molds, and in particular relates to a method for preparing hard coatings of tools and molds by using the binary evaporation source technology of vacuum ion evaporation plating plus magnetron sputtering ion plating, especially directly For coating of cutting tools. Background technique [0002] Surface coating technology is one of the new technologies applied to modern cutting tools. The micro-nano-scale film obtained on the surface of the tool through chemical or physical methods has the characteristics of high hardness, good lubricity, and excellent high-temperature performance. The cutting tool obtains excellent comprehensive mechanical properties, which effectively prolongs the service life of the tool, improves the cutting performance of the tool, and improves the machining efficiency. [0003] After 1980, TiN coating technology of physical vapor depo...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C23C14/24C23C14/06C23C14/14
Inventor 赵海波梁红樱王辉冯浩
Owner SICHUAN UNIV