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A kind of preparation method and equipment of nano-silver with high conductivity for PCB

A nano-silver, high-conductivity technology, applied in nanotechnology and other directions, can solve the problems of narrow substrate selection, wide screen printing pitch, high sintering temperature, and meet the requirements of wide screen printing pitch and productive equipment. The effect of lowering, lower sintering temperature

Active Publication Date: 2017-02-22
KUNMING UNIV OF SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] The purpose of the present invention is to provide a method for preparing high-conductivity nano-silver used in PCBs. The method adopts the liquid-phase chemical reduction method to integrate the produced nano-silver powder into the existing advanced electronic circuit printing technology, which embodies excellent conductivity agent resistance. Oxidation, which solves the problems of micron silver powder paste: (1) large amount and high cost; (2) high sintering temperature and narrow selection of substrates; (3) wide screen printing pitch

Method used

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  • A kind of preparation method and equipment of nano-silver with high conductivity for PCB
  • A kind of preparation method and equipment of nano-silver with high conductivity for PCB

Examples

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Comparison scheme
Effect test

Embodiment 1

[0031] Embodiment 1: This is used for the preparation method of PCB highly conductive nano-silver, and concrete steps are as follows:

[0032] (1) Dissolve 170g of industrial silver nitrate and 176g of sodium hypophosphite in 1L of deionized water respectively, add ammonia water (0.1% of the mass of silver nitrate) to complex silver ions to achieve the effect of controlling the reaction speed, and at the same time, divalent copper and Precipitation and removal of ferric ions;

[0033] (2) Add 4.25g of dispersant succinic acid to the purified silver nitrate solution and sodium hypophosphite solution respectively, and stir at normal pressure and 20°C to prepare silver nitrate dispersion system and sodium hypophosphite dispersion system;

[0034] (3) Add the auxiliary agent carboxymethyl cellulose to the sodium hypophosphite dispersion system, and treat the sodium hypophosphite dispersion system at normal pressure and 20°C, wherein the amount of the auxiliary agent added is 3% of...

Embodiment 2

[0040]Embodiment 2: This is used for the preparation method of PCB high conductivity nano-silver, and concrete steps are as follows:

[0041] (1) Dissolve 100kg of industrial silver nitrate and 22.3kg of sodium borohydride in 58.2L and 22.3L of deionized water, respectively, and add ammonia water (1% of the mass of silver nitrate) to complex silver ions to achieve the effect of controlling the reaction speed and at the same time Precipitate and remove divalent copper and ferric ions;

[0042] (2) Add 1 kg of dispersant gum arabic to the purified silver nitrate solution, add 1 kg of gum arabic to the sodium borohydride solution, and stir under normal pressure and 30°C to prepare silver nitrate dispersion system and sodium borohydride dispersion system;

[0043] (3) Add 1 kg of auxiliary agent carboxymethyl cellulose to the sodium borohydride dispersion system, and treat the sodium hypophosphite dispersion system at normal pressure and 30°C;

[0044] (4) After adjusting the pH ...

Embodiment 3

[0048] Embodiment 3: This is used for the preparation method of PCB high conductive nano-silver, and concrete steps are as follows:

[0049] (1) Dissolve 250kg of industrial silver perchlorate and 60.2L of hydrazine hydrate (50% by mass) in 603L and 60.2L of deionized water respectively, add ammonia water (2% of the mass of silver perchlorate) to complex silver ions , to achieve the effect of controlling the reaction speed, and at the same time, it can precipitate and remove divalent copper and ferric ions;

[0050] (2) Add 1.25kg of dispersant polyethylene glycol to the purified silver perchlorate solution, add 1.25kg of polyethylene glycol to the hydrazine hydrate solution, and stir under normal pressure and 40°C to prepare silver perchlorate Dispersion system and hydrazine hydrate dispersion system;

[0051] (3) Add auxiliary agent carboxymethyl cellulose to the hydrazine hydrate dispersion system, and treat the hydrazine hydrate dispersion system under normal pressure and...

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Abstract

The invention discloses a preparation method and equipment for high-conductivity nano silver for a PCB. With adoption of the preparation method, high-conductivity nano silver is prepared through adopting silver nitrate or silver perchlorate as a silver source and adopting the liquid phase reduction method. The prepared nano silver is excellent in conductivity, has an electrical resistivity of 2* 10<-3> omega. cm-6.5* 10<-3> omega. cm, and can be used for the PCB. The equipment comprises a dissolution kettle I, a dissolution kettle II, a silver salt compound purifying column, a reducing agent purifying column, a silver salt compound dissolution kettle, a reducing agent dissolution kettle, a silver salt compound liquid storage tank, a reducing agent liquid storage tank, a temperature control anti-corrosion reaction still, a high-efficient feeding device, a centrifugal separator, a silver recycling device, a temperature control forced air drying box, a tail gas collection treatment device, an effluent treatment device and a water ion exchange device. The preparation method is simple and fewer in working procedures; the equipment is simple in structure, requires less for large-scale production equipment, and facilitates industrialization.

Description

technical field [0001] The invention belongs to the technical field of nano-material synthesis, and in particular relates to a preparation method and equipment of highly conductive nano-silver. Background technique [0002] Printed electronics technology is a new technology for manufacturing electronic devices based on traditional printing methods, which can be widely used in various electronic or optoelectronic products with large area, flexibility and low cost. In August 2014, in the "13th Five-Year Plan" scientific and technological development forecast issued by the Ministry of Science and Technology, printed electronic materials and technology were listed as one of the forecast areas for the first time. In 2002, my country replaced the United States as the world's third largest circuit board producer. In 2003, my country's production and export volume reached 6 billion US dollars. The growth rate from 2007 to 2011 reached 9.6%, which was 2.5% higher than that of the wor...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B22F9/24B82Y40/00
Inventor 郜华萍郭忠诚王钲源潘明熙董国丽王翠翠何文豪郜烨
Owner KUNMING UNIV OF SCI & TECH