Halogen-free flame retardant epoxy resin composite and flexible copper clad laminate prepared with same

A technology of epoxy resin and hydantoin epoxy resin, applied in the direction of circuit substrate materials, improvement of metal adhesion of insulating substrates, layered products, etc., can solve the problem of carcinogenic dioxins, unsatisfactory flame retardant effect, substrate Susceptible to heat damage and other issues, to achieve excellent dimensional stability, outstanding corrosion resistance, and high heat resistance

Active Publication Date: 2010-01-27
PANYU NANSHA YAN TIN CHEM
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the synthetic resin material used as the substrate is easy to burn, so it is necessary to add flame retardant materials to enhance its flame retardancy
The existing flame retardant method is to add brominated epoxy resin with high bromine content to achieve the purpose of flame retardant. Although it has a good flame retardant effect, it will produce corrosive and toxic hydrogen halide gas during the combustion process, and the The amount of smoke is large, and carcinogenic dioxins may be produced during incomplete combustion; in addition, the coefficient of thermal expansion (CTE) of brominated ep

Method used

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  • Halogen-free flame retardant epoxy resin composite and flexible copper clad laminate prepared with same
  • Halogen-free flame retardant epoxy resin composite and flexible copper clad laminate prepared with same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0034] Halogen-free flame-retardant epoxy resin composition, composed of solid components and organic solvents, the weight of each component is as follows: 8 grams of phosphorus-containing epoxy resin, 6 grams of synthetic rubber, 4 grams of hydantoin epoxy resin, two curing agents 2 grams of cyanamide, 0.5 grams of curing accelerator 2-methylimidazole, 10 grams of inorganic filler aluminum hydroxide, 4.5 grams of flame retardant triphenyl phosphate, and 65 grams of solvent butanone.

[0035] Among the above components, imidazole compounds used as curing accelerators are not particularly limited, and 2-methylimidazole, 1-methylimidazole, 2-ethyl-4-methylimidazole, 1 -cyanoethyl-2-ethyl-4-methylimidazole, 2-phenylimidazole, 2-undecylimidazole, 2-phenyl-4-methylimidazole, these imidazoles can be used alone or in two or in multiple combinations.

[0036] The curing agent contains one or more of dicyandiamide, diaminodiphenylmethane, diaminodiphenylsulfone, phthalic anhydride, me...

Embodiment 2

[0041] The content percentage of each component is as shown in Table 1, and the weight of each component is as follows: 4 grams of phosphorus-containing epoxy resin, 10 grams of synthetic rubber, 2.4 grams of hydantoin epoxy resin, 3.2 grams of curing agent dicyandiamide, and curing accelerator 0.8 grams of 2-phenylimidazole, 13 grams of inorganic filler silicon dioxide, 6.6 grams of flame retardant triphenyl phosphate, and 60 grams of solvent ethanol.

[0042] The thickness of the coating is 30um, the thickness of the polyimide flexible board is 35um, the thickness of the copper foil is 25um, and the rest are the same as in Example 1.

Embodiment 3

[0044] The content percentage of each component is as shown in Table 1, and the weight of each component is as follows, 6 grams of phosphorus-containing epoxy resin, 4.8 grams of synthetic rubber, 2.4 grams of hydantoin epoxy resin, 0.6 grams of curing agent diaminodiphenyl sulfone, curing Accelerator 2-phenylimidazole 0.2 grams, inorganic filler magnesium hydroxide 8 grams, flame retardant tricumyl phosphate 8 grams, solvent ethyl acetate 70 grams.

[0045] The thickness of the coating is 25um, the thickness of the polyimide flexible board is 35um, the thickness of the copper foil is 25um, and the rest are the same as in Example 1.

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Abstract

The invention discloses a halogen-free flame retardant epoxy resin composite and a flexible copper clad laminate prepared from same. The invention is characterized that hydantoin epoxy resin is added in the existing composite and the hydantoin epoxy resin has the advantage that the viscosity is low, the manufacturability is good; the thermal stability is good, the thermostability is high; the weather resistance is good, the hydantoin epoxy resin can be shined by sunlight and ultraviolet light without yellowing and chalking; the hydantoin epoxy resin can be is resistant to salt fog, the corrosion resistance is outstanding, the product has low toxicity and good flame retardant and the like. Therefore the hydantoin epoxy resin is very applicable to being used to prepare the halogen-free flame retardant epoxy resin composite. In addition, the invention also provides a polyimide copper clad laminate prepared by adopting the composite as adhesive, and the prepared copper clad laminate has the advantage of good flame retardant performance, high peel strength, good folding endurance and the like and can increase the electrical property of the copper clad laminate.

Description

technical field [0001] The invention relates to a halogen-free flame-retardant epoxy resin composition and a flexible copper-clad board made of the halogen-free flame-retardant epoxy resin composition. Background technique [0002] Copper clad laminate is a main material for manufacturing printed circuit boards. The materials for manufacturing copper clad laminates include substrates, copper foil and copper clad laminate adhesives. The manufacturing process is to use adhesives to bond the substrate and copper foil firmly together through bonding and hot extrusion processes. The insulating laminate composed of polymer synthetic resin and reinforcing material can be used as the substrate of the copper clad laminate. There are many kinds of synthetic resins, commonly used are phenolic resin, epoxy resin, polytetrafluoroethylene, etc., which have the advantages of good mechanical and electrical properties. However, the synthetic resin material used as the substrate is easy to ...

Claims

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Application Information

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IPC IPC(8): C08L63/00C08L13/00C08K3/22C08K5/523C08K3/36C08K3/26C08K5/3492B32B15/08B32B15/20B32B7/12H05K1/03H05K3/38
Inventor 李兆辉藤川昇周平白浪全政玲
Owner PANYU NANSHA YAN TIN CHEM
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