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Nuclear shell structured packing/polymer-based composite material and preparation method thereof

A core-shell structure and composite material technology, applied in fibrous fillers, chemical instruments and methods, dyed low molecular organic compound processing and other directions, can solve the problem that the dielectric constant of composite materials cannot be effectively improved, and achieve process parameters that are easy to control , The effect of increasing the dielectric constant and reducing the dielectric loss

Inactive Publication Date: 2010-05-26
XI AN JIAOTONG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Recently, C.P.Wang et al. from the Georgia Institute of Technology used Al powder with a passivation layer on the surface to form a composite material with epoxy resin. The passivation layer on the aluminum surface effectively blocked the electron migration between conductive fillers and greatly reduced percolation. The dielectric loss near the point, but the dielectric constant of the composite material cannot be effectively improved due to the existence of the barrier layer. At the test frequency of 100Hz, the maximum value of the dielectric constant is only 110

Method used

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  • Nuclear shell structured packing/polymer-based composite material and preparation method thereof
  • Nuclear shell structured packing/polymer-based composite material and preparation method thereof
  • Nuclear shell structured packing/polymer-based composite material and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0040] 1. Preparation of ceramic particles: The BST ceramic block is pulverized by a high-energy ball mill to produce ceramic particles with a particle size of 10nm-100nm.

[0041] 2. Surface treatment of ceramic particles: Take 100 parts of crushed BST particles by volume, dry them at 90°C for 36 hours, then add 5 parts of 2mol / l acrylic acid and 100 parts of absolute ethanol to the dried BST particles. The solution was sonicated for 4 hours, so that the surface of the ceramic powder was treated with acrylic acid.

[0042] 3. Preparation of core-shell structure filler: take 20 grams of acrylic acid-treated BST ceramic particles and ultrasonically disperse them in 1 liter of acetone to obtain a suspension containing BST particles; prepare a silver nitrate solution with a concentration of 0.5 mol / liter, and add a concentration of 1 mol / liter of ammonia water to make it a complex solution, add the suspension in step 3 to the complex solution, the volume ratio of the suspension t...

Embodiment 2

[0047] 1. Preparation of ceramic particles: BT ceramic blocks are pulverized by high-energy ball milling to produce ceramic particles with a particle size of 100nm-10um.

[0048] 2. Surface treatment of ceramic particles: take 100 parts of crushed BT particles by volume, dry at 150°C for 12 hours, then add 2 parts of 2mol / l acrylic acid and 50 parts of absolute ethanol to the dried BT particles and mix The surface of the ceramic powder was treated with acrylic acid by sonicating in solution for 1 hour.

[0049] 3. Preparation of core-shell structure filler: Take 20 grams of acrylic acid-treated BT ceramic particles and ultrasonically disperse them in 1 liter of acetone to obtain a suspension containing BT particles; prepare a silver nitrate solution with a concentration of 0.5 mol / liter, and add a concentration of 1 mol / liter of ammonia water to make it a complex solution, add the suspension in step 3 to the complex solution, the volume ratio of the suspension to the complex s...

Embodiment 3

[0053] 1. Preparation of ceramic particles: BT ceramic blocks are pulverized by high-energy ball milling to produce ceramic particles with a particle size of 100nm-10um.

[0054] 2. Surface treatment of ceramic particles: take 100 parts of crushed BT particles by volume, dry at 150°C for 12 hours, then add 2 parts of 2mol / l acrylic acid and 50 parts of absolute ethanol to the dried BT particles and mix The surface of the ceramic powder was treated with acrylic acid by sonicating in solution for 1 hour.

[0055] 3. Preparation of core-shell structure filler: Take 20 grams of acrylic acid-treated BT ceramic particles and ultrasonically disperse them in 1 liter of acetone to obtain a suspension containing BT particles; prepare a silver nitrate solution with a concentration of 0.5 mol / liter, and add a concentration of 1 mol / liter of ammonia water to make it a complex solution, add the suspension in step 3 to the complex solution, the volume ratio of the suspension to the complex s...

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Abstract

The invention relates to a nuclear shell structured packing / polymer-based composite material and a preparation method thereof. The nuclear shell structured packing / polymer-based composite material comprises a nuclear shell structured packing and a polymer formed by coating ceramic particles with metal, wherein the nuclear shell structured packing is coated by the polymer completely. The nuclear shell structured packing / polymer based composite material prepared by the method has the advantages of high dielectric constant, low dielectric loss, excellent dielectric property and temperature stability and the like, and the preparation method has the characteristics of simple operation, low thermal treatment temperature, low cost, suitability for industrial production, environmental protection and the like.

Description

technical field [0001] The invention belongs to the field of preparation of electronic composite materials, and in particular relates to a core-shell structure filler / polymer-based composite material in which metal-coated ceramic core-shell structure powder is used as a filler and a preparation method thereof. Background technique [0002] Polymer-based composite dielectric materials with high dielectric constant, low dielectric loss, and easy processing have broad application prospects in embedded packaging technology and electrical energy storage. Embedded packaging technology can embed discrete components inside printed circuits, which is the key to miniaturization and thinning of electronic systems. As for the embedded capacitor used in the embedded package, the capacitor material used must have a high dielectric constant and have good compatibility with the organic material used in the printed circuit board. Ordinary ceramic electric energy storage capacitors have a la...

Claims

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Application Information

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IPC IPC(8): C08L27/16C08L23/12C08L23/06C08L33/12C08L63/00C08K9/10C08K3/24C08K3/22C09C1/36C09C3/04C09C3/06C09C3/08
Inventor 向锋汪宏李可铖刘维红喻科周永存
Owner XI AN JIAOTONG UNIV
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