Water-base cutting liquid for hard and brittle materials and preparation method and application thereof

A technology of hard and brittle materials and cutting fluid, which is applied in the field of compound water-based cutting fluid and its preparation. It can solve the problems of sandy bottom, not easy to stir and redisperse, etc., and achieve low electrical conductivity and anti-sedimentation redispersion ability. Strong, strong heat carrying effect

Active Publication Date: 2011-01-05
LIAONING OXIRANCHEM INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Due to the nature of the sand and liquid commonly used at the present stage, for the waste mortar that has been placed for a long time, there will be problems that the sand will sink to the bottom and it is extremely difficult to stir and disperse

Method used

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  • Water-base cutting liquid for hard and brittle materials and preparation method and application thereof
  • Water-base cutting liquid for hard and brittle materials and preparation method and application thereof
  • Water-base cutting liquid for hard and brittle materials and preparation method and application thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0059] 1) Polycarboxylate polymer ether ester monomer A 1 Preparation of:

[0060] Add 58Kg propenyl alcohol, 1Kg potassium hydroxide catalyst into a 1.5 vertical high-pressure reactor, seal the equipment, then replace with nitrogen, raise the temperature, and feed a small amount of ethylene oxide when the temperature reaches 80°C. When the temperature rises and the pressure drops, continue Feed 880Kg of ethylene oxide, control the reaction temperature at 100-120°C and the reaction pressure of 0.5Mpa, after the completion of the reaction of ethylene oxide, heat preservation and aging for 30 minutes, feed a small amount of propylene oxide, when the temperature rises and the pressure drops , continue to feed 116Kg of propylene oxide, control the reaction temperature at 110-130°C and the reaction pressure of 0.4Mpa, after the reaction of propylene oxide is completed, after the heat preservation and aging for 30 minutes, adjust the pH value of the product to 5-7 with glacial aceti...

Embodiment 2

[0067] 1) Polycarboxylate polymer ether ester monomer A 2 Preparation of:

[0068] Add 25Kg propylene alcohol, 2Kg potassium hydroxide catalyst in 1.5 vertical high-pressure reactors, seal equipment, nitrogen replacement afterwards, heat up. 855Kg of ethylene oxide and 200Kg of propylene oxide are fully mixed in advance in the epoxy compound metering tank. When the temperature of the reactor reaches 80°C, feed a small amount of ethylene oxide and propylene oxide mixture. When the temperature rises and the pressure drops, continue to feed 1055Kg of epoxy mixture, and control the reaction temperature at 100-120°C and the reaction pressure at 0.4Mpa , after the reaction of the epoxy mixture is completed, after heat preservation and aging for 30 minutes, the pH value of the product is adjusted to 5-7 with lactic acid, and the temperature is lowered to discharge the material to obtain the polycarboxylate high polymer ether ester monomer A 2 .

[0069] 2) Anti-sedimentation redis...

Embodiment 3

[0075] 1) Polycarboxylate polymer ether ester monomer A 3 Preparation of:

[0076] Add 20g of allyl alcohol and 0.1g of potassium hydroxide catalyst into the high-pressure reactor, seal the equipment, replace with nitrogen, and raise the temperature. When the temperature reaches 80°C, a small amount of ethylene oxide is fed, and when the temperature rises and the pressure drops, 91g of ethylene oxide is continuously fed, and the reaction temperature is controlled at 100-120°C and the reaction pressure is 0.5Mpa, and the ethylene oxide reacts After the completion, heat preservation and aging for 30 minutes, adjust the pH value of the product to 5-7 with phosphoric acid, cool down and discharge, and obtain polycarboxylic acid high polymer ether ester monomer A 3 .

[0077] 2) Anti-sedimentation redispersant B 3 Preparation of:

[0078] Add 30g of monomer A in the normal pressure reactor 3 , 50g monomer A 1 , 5g maleic anhydride, 1g methacrylic acid, 86g water, stir to diss...

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PUM

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Abstract

The invention provides a water-base cutting liquid for hard and brittle materials. The liquid is characterized by comprising the following components in percentage by weight: 70 to 95 percent of poly-alkoxy compound, 0 to 5 percent of extreme-pressure resistant chelating agent, 0.001 to 5 percent of anti-settling re-dispersing agent and 4 to 20 percent of deionized water. The cutting liquid of the invention has the characteristics of no pollution and low metal impurity content; at the same time, the stability of a motar formed by mixing the cutting liquid and grinding material carborundum is high and grinding material carborundum re-dispersing capacity is high; and the cut product has the advantages of high yield, high qualification rate, high surface cleanliness, easy cleaning and the like. The invention also relates to the application of the cutting liquid to processing monocrystalline silicon, polycrystalline silicon, germanium, gallium arsenide, quartz, gallium indium nitride or precious stones.

Description

technical field [0001] The invention relates to a water-based cutting fluid, in particular to a composite water-based cutting fluid for (multi-) wire cutting of hard and brittle materials, a preparation method and application thereof. Background technique [0002] In recent years, as countries around the world attach great importance to solar energy, a green resource, the solar photovoltaic power generation industry has become the focus of common attention worldwide. With the rapid development of multi-wire cutting technology for hard and brittle materials such as polysilicon, monocrystalline silicon, germanium, and gallium arsenide, especially in the solar energy industry, the wafer products of polysilicon materials have transitioned from a buyer's market to a seller's market, and the price of wafer products has gradually increased. As a result, slicing manufacturers are paying more and more attention to costs. Improving product quality, reducing process consumption, increa...

Claims

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Application Information

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IPC IPC(8): C10M173/02C10M169/04
Inventor 朱建民刘兆滨董振鹏仲崇纲宋恩军富扬
Owner LIAONING OXIRANCHEM INC
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