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Lead-free environment-friendly electronic Ag/Al (silver/aluminum) paste and preparation method thereof

A silver-aluminum paste, environmentally friendly technology, applied in the manufacture of cables/conductors, conductive materials dispersed in non-conductive inorganic materials, circuits, etc., can solve the problems of poor weldability and environmental pollution, and achieve good weldability, The effect of good compatibility and simple preparation process

Inactive Publication Date: 2011-01-19
ZHEJIANG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In most electronic pastes, the inorganic binder is mainly lead-containing glass powder with a low melting point, and its main defects are large environmental pollution and poor solderability

Method used

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  • Lead-free environment-friendly electronic Ag/Al (silver/aluminum) paste and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0049] First, add the mass of SiO to the V-shaped mixer respectively: 2 30.0g, Al 2 o 3 15.0g, B 2 o 3 40.0g, and 15.0g of tin-bismuth-silver alloy powder (Sn63Bi36.7Ag0.3), mix well; then put the mixed material in a crucible, heat in a muffle furnace at 1000°C for 3h; take out the molten material and pour it into Quenching in cold water, putting it into a ball mill and milling for 3 hours until the average fineness is 10-12 μm. After drying the material, a lead-free inorganic binder can be obtained, which is ready for use.

[0050]Add 40.0g of diethylene glycol butyl ether to a reactor equipped with a condenser, start the agitator and heat for standby; then add 36.0g of methyl methacrylate, 5.0g of isooctyl acrylate, 15.0g of methyl Add glycidyl acrylate and 3.8g of N-methylolacrylamide into the mixing kettle, add 0.2g of benzoyl peroxide and stir evenly, and set aside; Add the above mixed monomers dropwise into the kettle, control all the mixed monomers to be added w...

Embodiment 2

[0053] First, add the mass percentage in the V-type mixer as follows: SiO 2 45g, Al 2 o 3 10g, B 2 o 3 35g, and 10g of tin-bismuth-silver alloy powder (Sn63Bi36.7Ag0.3), mix well; then put the mixed material in a crucible, heat it in a muffle furnace at 1100°C for 2 hours; take out the molten material and quickly pour it into cold water Quenching, putting into a ball mill and ball milling for 4 hours, until the average fineness is 8-10 μm, and the lead-free inorganic binder is obtained after discharging and drying, which is ready for use.

[0054] Add 84g of diethylene glycol ethyl ether acetate in a reactor equipped with a condenser, start the agitator and heat it for standby; then add 5.5g of ethyl acrylate, 6g of butyl acrylate, and 4.4g of glycidyl methacrylate into the mixing tank Add 0.1g of azobisisobutyronitrile, stir evenly, and set aside; when the diethylene glycol ethyl ether acetate in the reaction kettle is heated to 85°C, add the above mixed monomers dropw...

Embodiment 3

[0057] First, add the mass percentage in the V-type mixer as follows: SiO 2 50g,Al 2 o 3 20g, B 2 o 3 25g, and 5g of tin-bismuth-silver alloy powder (Sn63Bi36.7Ag0.3), mix well; then put the mixed material in a crucible, heat it in a muffle furnace at 1200°C for 2 hours; take out the molten material and pour it into cold water quickly Quenching, putting into a ball mill and ball milling for 5 hours until the average fineness is 5-7 μm, and after discharging and drying, a lead-free inorganic binder is obtained, which is ready for use.

[0058] Add 25.0g of diethylene glycol dibutyl ether, 25.0g of diethylene glycol methyl ether acetate in the reactor with condenser, start the stirrer and heat for standby; then 28.0g of methyl methacrylate, 5.0 g of ethyl acrylate, 5.0 g of isooctyl acrylate, 9.5 g of glycidyl methacrylate, 1.0 g of N-methylol acrylamide, and 1.0 g of hydroxypropyl acrylate were added to the mixing tank, and 0.5 g Stir the benzoyl peroxide evenly and set...

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Abstract

The invention discloses a lead-free environment-friendly electronic Ag / Al (silver / aluminum) paste, which comprises the following raw materials in percentage by mass: 3 to 10 percent of inorganic binder, 10 to 20 percent of self-crosslinking acrylic resin, 50 to 60 percent of silver powder, 10 to 20 percent of aluminium powder, 0.5 to 5 percent of surface modifier, 0.5 to 5 percent of auxiliaries and 0.1 to 0.5 percent of defoaming agent. The invention also discloses a method for preparing the lead-free environment-friendly electronic Ag / Al paste, which comprises the following steps: evenly mixing the silver powder, the aluminium powder and the inorganic binder; adding the surface modifier, then evenly stirring the obtained mixture; adding the self-crosslinking acrylic resin, the auxiliaries and the defoaming agent into the obtained mixture, then grinding the obtained product for 5 to 8 hours; and filtrating the obtained product so as to obtain the lead-free environment-friendly electronic Ag / Al paste. The method for preparing the lead-free environment-friendly electronic Ag / Al paste has the advantages of lead-free environmental protection, simple process, convenient and easy operation, no required special equipment, small investment, and easy controlling on product performance.

Description

technical field [0001] The invention belongs to the technical field of electronic fine chemicals, in particular to a lead-free and environment-friendly electronic silver-aluminum paste and a preparation method thereof. Background technique [0002] Electronic paste is one of the important electronic fine chemicals. It can be widely used in many industries such as electronics, information, communication, precision components and solar energy. It is a high-tech product supported by the state. [0003] In recent years, with the increasing shortage of conventional energy sources such as coal, oil, and natural gas, it is imminent to develop renewable new energy sources. Countries have invested huge sums of money to develop various new energy sources. The solar photovoltaic industry has emerged as the times require and has developed rapidly. Among them High-temperature sintered thick-film electronic silver-aluminum paste is one of the pastes used for the back electrode of solar ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01B1/22H01B13/00H01L31/0224
Inventor 宋锡瑾王杰王锦凯
Owner ZHEJIANG UNIV
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