Preparation method for three-dimensional metal micro-nanometer device

A micro-nano, metal technology, applied in the field of manufacturing micro-nano devices, can solve the problems of inability to flexibly design metal structures, limit the diversity of metal structures, limit the scope of application, etc., and achieve the effect of improving strength, low cost, and expanding functions
CN102951604BActive Publication Date: 2015-06-10TECHNICAL INST OF PHYSICS & CHEMISTRY - CHINESE ACAD OF SCI
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
TECHNICAL INST OF PHYSICS & CHEMISTRY - CHINESE ACAD OF SCI
Publication Date
2015-06-10

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Abstract

The invention relates to a preparation method for a three-dimensional metal micro-nanometer device. The method comprises the steps: forming a first structure of a polymer in a first photoresist by utilizing femtosecond laser beam; activating the surface of the first structure of the polymer; covering the activated first structure of the polymer by a second photoresist; forming a second structure partially contacted with the first structure in the second photoresist by utilizing femtosecond laser beam to obtain a complex of the partially exposed and activated surface of the first structure; and carrying out electrodeless plating to the complex in electroplate solution, and forming a metal thin membrane on the exposed surface of the first structure to obtain the three-dimensional metal micro-nanometer device. The first structure and the second structure are respectively machined so as to accurately align on three dimensions, selective electroplating of micro-nanometer structure can be realized by combining electrodeless electroplating technique, and the three-dimensional metal micro-nanometer device with any three-dimensional metal micro-nanometer structure can be obtained.
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Description

technical field

[0001] The invention relates to a method for manufacturing a micro-nano device, in particular to a method for manufacturing a three-dimensional metal micro-nano device by combining a laser direct writing technique and an electrodeless electroplating process. Background technique

[0002] With the in-depth research on micro-nano processing technology, three-dimensional micro-nano structure devices have gradually attracted the interest of more and more researchers in this field. The existing three-dimensional micro-nano structure processing methods mainly include self-assembly method, hierarchical assembly method, phase mask method, etc., but these existing methods have defects such as inability to process any three-dimensional micro-nano structure, complicated manufacturing process, and high cost. Therefore, there is a need for a three-dimensional micro-nano structure processing method that can realize true three-dimensionality, high efficiency and low cost. ...

Claims

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