Packaging process of light emitting diodes

A technology for light-emitting diodes and packaging technology, applied in electrical components, circuits, semiconductor devices, etc., can solve the problems affecting the performance of the cured product packaging LED reliability, incomplete resin curing, large residual stress, etc., to prevent colloid yellowing, The effect of reducing packaging time and improving production efficiency

Inactive Publication Date: 2013-09-25
HANGZHOU HANGKE OPTOELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, there are still many technical difficulties in applying UV curing technology directly to LED packaging, such as incomplete resin curing, excessive residual stress, yellowing caused by excessive irradiation during the curing process, etc., which greatly affect the performance of the cured product and the reliability of the packaged LED. sex

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0024] (1) Bisphenol A epoxy resin DER-332 80g, alicyclic epoxy resin ERL-4211 20g, diphenyliodonium hexafluorophosphate 1g, N-vinylcarbazole 2g, glycerol 5g Mix and stir evenly to form a homogeneous and transparent encapsulant;

[0025] (2) For the LED semi-finished product that has been fixed on the bracket, the light-emitting chip, the bonding and welding gold wire, and the phosphor powder, the encapsulation glue in step (1) is potted;

[0026] (3) Using 5kw high pressure mercury lamp, with 800mj / cm 2 Ultraviolet (UV) energy density, irradiate the encapsulation adhesive in step (2) for 90s to complete a curing;

[0027] (4) Use a far-infrared heating system to irradiate the encapsulant in step (3) for 10 min at 130°C to complete the LED encapsulation.

[0028] The hardness of the encapsulant after curing is 84 (Shore hardness, shore D), the light transmittance (2mm, 400nm) > 95%, and the refractive index is about 1.54.

Embodiment 2

[0036] (1) Alicyclic epoxy resin ERL-4211 70g, hydrogenated bisphenol A epoxy EP-4080E 20g, neopentyl glycol diglycidyl ether 10g, triphenylsulfur? Hexafluoroantimonate 3g, diphenyl Mix 2g of ketone, 5g of trimethylolpropane, and 1g of KH560 and stir evenly to prepare a homogeneous and transparent encapsulation glue;

[0037] (2) For the LED semi-finished products that have fixed the light-emitting chip on the bracket, bonded and welded gold wires and dotted phosphor powder, use the encapsulation glue in step (1) to seal;

[0038] (3) Using 500w electrodeless lamp, with 50mj / cm 2 The UV energy density of 5min is irradiated to the encapsulating adhesive in step (2), and completes a curing;

[0039] (4) Use a far-infrared heating system to irradiate the encapsulant in step (3) for 15 min at 150°C to complete the LED encapsulation.

[0040] The hardness of the encapsulant after curing is 88 (Shore hardness, shore D), the light transmittance (2mm, 400nm) > 95%, and the refractiv...

Embodiment 3

[0042] (1) Alicyclic epoxy resin ERL-4211 30g, alicyclic epoxy resin EHPE 3150 30g, hydrogenated bisphenol A epoxy EP-4080E 10g, silicone modified epoxy resin 25g, trimethylol propane 5g of diglycidyl ether, 5g of triphenylthio?hexafluorophosphate, 2g of benzoin dimethyl ether, and 5g of pentaerythritol were mixed and stirred evenly to prepare a homogeneous and transparent packaging glue;

[0043] (2) For LED semi-finished products that have fixed light-emitting chips on the bracket and bonded and welded gold wires, use the packaging glue in step (1) to mix phosphor powder and then dispense glue;

[0044] (3) Use 1kw high-pressure mercury lamp, with 100mj / cm 2 The UV energy density of 3min is irradiated to the encapsulation adhesive in step (2), and completes a curing;

[0045] (4) Use a far-infrared heating system to irradiate the encapsulant in step (3) for a second time at 160°C for 5 minutes to complete the LED encapsulation.

[0046] The hardness of the encapsulant aft...

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PUM

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Abstract

The invention discloses a packaging process of light emitting diodes. Packaging glue is made of epoxy resin, positive ion photoinitiator, sensitizer, chain transfer agent, epoxy reactive diluent, solvent and addition agent; primary radiation solidification is conducted on the packaging glue through an ultraviolet light source; then, secondary radiation solidification is conducted on the packaging glue through a far-infrared heating system. By the adoption of the preparation method of the packaging process, packaging time can be shortened greatly, and production efficiency is improved by dozens of times. By the adoption of the ultraviolet-infrared double solidification mode, relative strength of two types of radiation is regulated so that glue yellowing caused by excessive ultraviolet radiation can be avoided and the solidification degree can be guaranteed. In addition, residual stress caused by ultraviolet solidification can be released through infrared secondary solidification. The hardness, the refractive index, the transmittance, the temperature resistance and the like of the solidified packaging glue can be regulated through packaging glue formulas, thereby being suitable for requirements of different LED products, beneficial to protecting luminous chips better, and suitable for new development of electronic and lighting products.

Description

technical field [0001] The invention relates to a packaging method for semiconductor components, in particular to a packaging process for light emitting diodes. Background technique [0002] Semiconductor light-emitting diode (LED) lighting is considered to be one of the most promising high-tech fields in the 21st century. While it triggers a lighting revolution, it will also make a major contribution to promoting energy conservation and emission reduction and establishing a conservation-oriented society. At present, LEDs are packaged with organic resins such as epoxy and silicone rubber. The packaging process is similar to that of electronic components such as resistors and capacitors. The polymerization of organic resins and the packaging of LEDs are completed by heating and curing. [0003] The thermosetting encapsulation process has many types of organic resins available, and the resulting products have excellent performance. However, the time required for thermal curin...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/48H01L33/52
Inventor 严钱军高基伟李海国
Owner HANGZHOU HANGKE OPTOELECTRONICS
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