Method for improving metalized surface performance of ceramic workpiece

A technology for metallized surface and workpiece surface, applied in the field of functional ceramic materials, can solve problems such as affecting product quality, easy oxidation, poor adhesion of film layers, etc., to achieve consistency and large-scale production convenience, chemical ratio is not easy to imbalance, A wide range of effects

Inactive Publication Date: 2013-10-23
SOUTHWEST JIAOTONG UNIV
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

These methods will encounter a series of problems such as poor adhesion of the film layer, low density, light transmission on the metallized surface, and easy oxidation [[2] Liu Zheng, Huang Yigong, Chen Xinhui, Cai Anfu, Wang Hongjun, Huang Hao, Aluminum oxide ceramic metal Improvement of chemical process, V

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  • Method for improving metalized surface performance of ceramic workpiece
  • Method for improving metalized surface performance of ceramic workpiece
  • Method for improving metalized surface performance of ceramic workpiece

Examples

Experimental program
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Effect test

Embodiment 1

[0031] A specific embodiment of the present invention is as follows: the equipment is shown as figure 1 As shown, it is mainly composed of three parts: high-power pulse magnetron sputtering power supply system, gas flow and pressure control system, and vacuum system. The ceramic workpiece that needs surface metallization is fixed on the sample stage. The specific steps are:

[0032] A. Ultrasound the alumina ceramic workpiece in acetone and absolute ethanol for 10 minutes and take it out, then dry it for use;

[0033] B. Immerse the dried alumina ceramic workpiece in molten sodium hydroxide for 10 minutes, and adjust the temperature at a constant temperature of 500 degrees Celsius; ultrasonically clean and dry the etched alumina ceramic workpiece in absolute ethanol;

[0034] C. Fix the alumina ceramic workpiece on the stainless steel substrate and put it into the vacuum chamber of the high-power pulse magnetron sputtering equipment, and the vacuum chamber is evacuated to 2×10...

Embodiment 2

[0040] A. Ultrasound the silicon dioxide ceramic workpiece for 40 minutes in acetone and absolute ethanol respectively, take it out, and then dry it for use;

[0041] B. Immerse the dried silicon dioxide ceramic workpiece in 30wt% sodium hydroxide for 40 minutes, adjust the constant temperature at 80 degrees Celsius; ultrasonically clean and dry the etched alumina ceramic workpiece in absolute ethanol;

[0042] C. Fix the silicon dioxide ceramic workpiece on the stainless steel substrate and put it into the vacuum chamber of the high-power pulse magnetron sputtering equipment, and the vacuum chamber is evacuated to 0.5×10 -3 Pa; adjust the distance between copper target and ceramic workpiece to 100mm;

[0043] D. Introduce argon gas into the vacuum chamber to a pressure of 2.8Pa, apply a DC voltage of -1450V, glow discharge to form a plasma, and perform sputter cleaning on the silicon dioxide ceramic workpiece for 40 minutes, then turn off the argon gas and DC power supply;

...

Embodiment 3

[0047] A. Put the fluorphlogopite ceramic workpiece in acetone and absolute ethanol respectively, ultrasonically take it out for 15 minutes, and then dry it for use;

[0048] B. Immerse the dried fluorphlogopite ceramic workpiece in 0.1g / L tin chloride solution for 40 minutes, and adjust the temperature at a constant temperature of 50 degrees Celsius; ultrasonically clean and dry the etched fluorphlogopite ceramic workpiece in absolute ethanol Dry;

[0049] C. Fix the fluorine phlogopite ceramic workpiece on the stainless steel substrate and put it into the vacuum chamber of the high-power pulse magnetron sputtering equipment, and the vacuum chamber is evacuated to 1.5×10 -3 Pa; adjust the distance between the titanium target and the ceramic workpiece to 75mm;

[0050] D. Introduce argon gas into the vacuum chamber to a pressure of 3.0Pa, apply a DC voltage of -1450V, glow discharge to form plasma, and sputter and clean the fluorphlogopite ceramic workpiece for 40 minutes, t...

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Abstract

The invention provides a method for improving the metalized surface performance of a ceramic workpiece. A metalized layer with good combining force, high density and strong corrosion resistance of a surface prepared film base is obtained on the ceramic workpiece surface by applying a high-power pulse magnetron sputtering technology. According to the invention, the process is environment-friendly; the controllability is good and a plated film layer can meet European Union RoHS (Restriction of Hazardous Substances) standards; the metalized layers of different materials can be obtained according to requirements and the adaptability of sputtering materials is wide without limitation by high and low smelting points of the material; the high ionization rate of the sputtering materials can greatly improve the combining strength, the density and the uniformity of the film base of the metalized layer, and the electric performance and the corrosion resistance of a ceramic workpiece are improved.

Description

technical field [0001] The invention belongs to the technical field of functional ceramic materials, in particular to a method for metallizing the surface of a ceramic workpiece to improve its surface performance. Background technique [0002] Ceramic surface metallization [[1] Dong Xiaoyu, Gu Xianlin, Fan Aihua, Wang Juan, Wang Changfen. On the reliability control of ceramic metallization quality, Vacuum Electronics Technology, 2006, (4): 17-19.] A layer of metal film that is firmly bonded to ceramics and is not easily melted. Metallized ceramic workpieces can be more easily welded with other metals to form high-performance composite ceramic parts with strong connection, good air tightness, reliable and stable quality, and are widely used in ceramic-based printed circuit boards, multi-layer chip packaging, microelectronics and precision instrument manufacturing. The bonding strength between the metallized layer and the ceramic substrate is one of the key technical indicat...

Claims

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Application Information

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IPC IPC(8): C04B41/88
Inventor 冷永祥吴保华黄楠
Owner SOUTHWEST JIAOTONG UNIV
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