Preparation method of matrix surface nano compound Me-Si-N superhard coating

A nano-composite, me-si-n technology, applied in the field of preparation of nano-composite Me-Si-N superhard coating on the surface of the substrate, can solve the problems of rough film surface, low film hardness and low metal ionization rate

Active Publication Date: 2013-11-06
NINGBO INST OF MATERIALS TECH & ENG CHINESE ACADEMY OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Magnetron sputtering technology has many advantages such as low-temperature deposition, smooth surface, and no particle defects, but most of the sputtered metals exist in the atomic state, and the metal ionization rate is low (~1%), resulting in low film hardness (less than 25GPa)
Arc ion plating technology has the advantages of high metal ionization rate and s...

Method used

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  • Preparation method of matrix surface nano compound Me-Si-N superhard coating
  • Preparation method of matrix surface nano compound Me-Si-N superhard coating
  • Preparation method of matrix surface nano compound Me-Si-N superhard coating

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Embodiment 1

[0032] In this embodiment, the high-speed steel is used as the substrate, and the TiSiN nanocomposite coating is deposited on the surface of the substrate by using high-power pulsed magnetron sputtering technology. The specific preparation process is as follows.

[0033] (1) Put the cleaned and dried substrate into the vacuum chamber until the air pressure in the chamber is 3×10 -3 At Pa, argon gas was introduced into the vacuum chamber so that the chamber pressure was 8.0mTorr, the substrate pulse negative bias was -400V, and the substrate was etched for 20 minutes by glow discharge;

[0034] (2) After the etching is completed, Ar is introduced into the cavity, so that the cavity pressure is 2mTorr, the high-power pulse magnetron sputtering source is turned on, and the alloy target TiSi target is deposited by high-power pulse magnetron sputtering to deposit the TiSi transition layer , the substrate negative bias voltage is -300V, the sputtering DC current is 2A, the pulse con...

Embodiment 2

[0040] In this embodiment, the substrate is exactly the same as that in Embodiment 1, and a TiSiN nanocomposite coating is deposited on the surface of the substrate by high-power pulse magnetron sputtering technology, and the specific preparation process is as follows.

[0041] (1) Exactly the same as step (1) in Example 1;

[0042] (2) It is basically the same as step (2) in Example 1, the difference is: when using the high-power pulse magnetron sputtering alloy target TiSi target to deposit the TiSi transition layer, the negative bias of the substrate is -300V, and the sputtering The DC current is 1A, the pulse constant voltage is 450V, the pulse frequency is 40Hz, and the pulse width is 80 microseconds;

[0043] (3) It is basically the same as step (2) in Example 1, the difference is: use high-power pulse magnetron sputtering alloy target TiSi target to deposit TiSiN nanocomposite coating; substrate negative bias is -100V, sputtering The pulse constant current is 1A, the p...

Embodiment 3

[0048] In this embodiment, the high-speed steel is used as the substrate, and the CrSiN nano-composite coating is deposited on the surface of the substrate by high-power pulsed magnetron sputtering technology, and the specific process is as follows.

[0049] (1) Put the cleaned and dried substrate into the vacuum chamber until the air pressure in the chamber is 3×10 -3 At Pa, argon gas was introduced into the vacuum chamber so that the chamber pressure was 8.0mtorr, the substrate pulse negative bias was -400V, and the substrate was etched for 20 minutes by glow discharge;

[0050] (2) After the etching is completed, Ar is introduced into the cavity, so that the cavity pressure is 2mTorr, the high-power pulse magnetron sputtering source is turned on, and the CrSi transition layer is deposited by using the high-power pulse magnetron sputtering metal target CrSi target, The substrate negative bias is -300V, the sputtering pulse constant current is 2A, the pulse constant voltage i...

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Abstract

The invention provides a preparation method of matrix surface nano compound Me-Si-N (Me=Ti, Cr, Zr, W or the like) superhard coating. The preparation method utilizes the high-power pulse magnetron sputtering (HIPIMS) technology, through optimizing technology parameters, to prepare the Me-Si-N nano compound superhard coating by magnetron sputtering reactions. Compared to the prior art, the technology can obtain a superhard Me-Si-N nano compound coating with low surface roughness, and the preparation method is a preparation technology with a good application prospect.

Description

technical field [0001] The invention belongs to the technical field of substrate surface treatment, in particular to a method for preparing a nanocomposite Me-Si-N superhard coating on the surface of a substrate. Background technique [0002] With the advancement of modern industry, the cutting technology is developing rapidly, so cutting tools have higher and higher performance requirements to adapt to the increasing processing of difficult-to-cut materials and harsh processing conditions, such as high-speed cutting, dry cutting, etc. . [0003] Coating the surface of the cutting tool with a hard coating can not only realize the processing of difficult-to-cut materials, such as aerospace titanium alloys, high-silicon aluminum alloys, carbon fiber composite materials and other difficult-to-cut materials, but also improve the cutting accuracy and give full play to The film has the advantages of superhardness, toughness, wear resistance and self-lubrication, so it is consider...

Claims

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Application Information

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IPC IPC(8): C23C14/35C23C14/06
Inventor 汪爱英王振玉张栋柯培玲
Owner NINGBO INST OF MATERIALS TECH & ENG CHINESE ACADEMY OF SCI
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