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Cooling fluid containing solid hollow particle

A technology of hollow particles and cooling fluid, applied in the direction of heat exchange materials, chemical instruments and methods, etc., can solve the problems that the geometric structure and scale of nano-fluids are not easy to control, the thermal conductivity of the fluid has no obvious contribution, and the heat carried by the fluid is increased. It is not easy to achieve Settling or build-up problems, enhanced liquid convective heat transfer, enhanced fluid turbulence effects

Active Publication Date: 2013-12-04
TECHNICAL INST OF PHYSICS & CHEMISTRY - CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, the geometric structure and scale of nanofluids are not easy to control, and problems such as sedimentation or aggregation are prone to occur.
The purpose of phase change microcapsules is mainly to increase the heat capacity of the working fluid, increase the ability to carry heat, and have no significant contribution to the heat conductivity of the fluid.

Method used

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  • Cooling fluid containing solid hollow particle
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Examples

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Effect test

Embodiment 1

[0027] gallium indium alloy Ga 80 In 20 For solvent 1, copper / aluminum double-layer solid hollow particles are uniformly dispersed in gallium indium alloy, see figure 1 .

[0028] The copper 2 is deposited on the surface of the aluminum 3 by spraying to form a double-coated particle structure. The outer diameter of the particles in this example is 1 mm, and the shell thickness is 1 μm. The density of the particles is 6.5g / cm 3 , gallium indium alloy density is 6.6g / cm 3 .. The volume fraction of the particles in the gallium-indium alloy is 5%, and the thermal conductivity of the obtained cooling fluid is 45W / mK.

[0029] Because both copper and aluminum have extremely high thermal conductivity, the thermal conductivity of the composite liquid is effectively enhanced. At the same time, the composite of copper / aluminum can make the density of the particles consistent with that of gallium indium alloy. Finally, the outer copper clad layer can isolate the contact between a...

Embodiment 2

[0031] Water is used as a solvent, and aluminum solid hollow particles are uniformly dispersed in cooling fluid in water. The volume fraction of particles in water is 10%.

[0032] figure 2 It is the structural diagram of aluminum solid hollow particles in this embodiment. The aluminum hollow particles in this embodiment are made by cold extrusion process. The diameter of the solid hollow particle is 100 μm, and the thickness of the aluminum shell 4 is 20 μm. The density of hollow particles is 1.2g / cm 3 . The thermal conductivity of the resulting cooling fluid was 1.2 W / mK. The composite coating of aluminum 4 and air 5 can ensure that the density of the particles is consistent with that of water, and the particles can be stably suspended in the solvent.

Embodiment 3

[0034] A cooling fluid in which copper / silicon dioxide double-layer solid hollow particles are uniformly dispersed in gallium indium tin alloy.

[0035] In this embodiment, the cooling fluid structure and figure 1 Similar, but its multi-layer particles use sol-gel method to deposit silicon dioxide (non-metal) on the surface of copper hollow particles to form a double-layer coating structure. In this embodiment, the copper / silicon dioxide double-layer solid hollow particles have a diameter of 10 μm. Among them, the core diameter of the copper hollow particles is 6 μm, and the thickness of the silicon dioxide layer is 2 μm. The overall density of the particles is 6.7g / cm 3 , suspended in the gallium indium tin alloy, the volume fraction of the particles in the gallium indium tin alloy is 50%, and the thermal conductivity of the obtained cooling fluid is 200W / mK.

[0036] Because silicon dioxide has a strong affinity for gallium indium tin alloy, the copper particles coated wi...

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Abstract

The invention provides a cooling fluid containing solid hollow particles. Solid hollow particles disperse in a liquid state fluid to form the cooling fluid; and the solid hollow particles have an overall density 80-120% of that of the liquid state fluid. The cooling fluid provided by the invention has the following advantages: on the one hand, the particles cladded by a material with high thermal conductivity can reinforce thermal conductivity of the cooling liquid; on the other hand, the solid hollow particles promote generation of turbulent flow pulses during a flow process, thereby further reinforcing convective heat transfer of liquid. As the particles cladded by multiple layers are in the hollow structure and have overall density consistent with that of a solvent, the particles hardly generate settlement or aggregation during the flow process. Therefore, the cooling fluid can guarantee stable and safe operation of a heat radiation system.

Description

technical field [0001] The invention belongs to the field of heat exchange materials, in particular to a cooling fluid containing solid hollow particles, a preparation method and application thereof. Background technique [0002] With the continuous increase of chip integration, heat dissipation has become an important bottleneck restricting the development of modern information industry. At present, various cooling technologies can be divided into four generations according to the heat flux density that the workpiece can withstand, namely: fin air cooling, heat pipe, water cooling and liquid metal cooling. Among them, water cooling and liquid metal cooling are currently the mainstream technologies for high-end cooling needs. However, water and liquid metal are used as cooling working fluids, and their thermal conductivity is still limited. The cooling capacity of the heat dissipation system can be further improved by improving the working fluid. [0003] In a conventional...

Claims

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Application Information

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IPC IPC(8): C09K5/10
Inventor 刘静邓月光
Owner TECHNICAL INST OF PHYSICS & CHEMISTRY - CHINESE ACAD OF SCI
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