Diamine monomer containing asymmetric and non-coplanar structure, and preparation method of diamine monomer

A non-coplanar, diamine monomer technology, applied in the field of aromatic diamine monomer and its preparation, can solve the problems of reducing the thermal stability of polyimide, and achieve the effect of low cost, simple operation and high purity
CN103483206AInactive Publication Date: 2014-01-01GUILIN UNIVERSITY OF TECHNOLOGY
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Patent Information

Authority / Receiving Office
CN · China
Current Assignee / Owner
GUILIN UNIVERSITY OF TECHNOLOGY
Publication Date
2014-01-01
Estimated Expiration
Not applicable · inactive patent

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Abstract

The invention discloses diamine monomer containing an asymmetric and non-coplanar structure, and a preparation method of diamine monomer. The structural general formula of the diamine monomer containing the asymmetric and non-coplanar structure is shown in the specification, wherein R represents an alkyl substituent, and Ar represents an aromatic substituent; under nitrogen protection, 2-alkyl substituted aniline and aromatic substitution substituted formaldehyde are heated, in an acidic condition, to obtain a crude product; the obtained crude product is further subject to purification through the silica column chromatography separation method, so that the diamine monomer containing the asymmetric and non-coplanar structure is obtained. The diamine monomer prepared through the invention has a high purity, is stable at normal temperature, has a simple synthesis method, and is suitable for industrial production; the obtained monomer has the asymmetric and non-coplanar structure, so that the prepared poly imide has excellent solubility, excellent thermostability, high optical transparency, low dielectric constant, and other excellent comprehensive properties.
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Description

technical field

[0001] The invention belongs to the technical field of aromatic diamine monomer and its preparation, and in particular relates to a diamine monomer with an asymmetric non-coplanar structure and a preparation method thereof. Background technique

[0002] Polyimide materials are widely used in high-tech fields such as aerospace, machinery, electronics, and automobiles because of their excellent thermal stability, mechanical properties, dielectric properties, chemical resistance, and corrosion resistance. Due to the unique rigid main chain structure of polyimide, most polyimides have disadvantages such as high processing temperature, insolubility and poor processing performance, which further limit their wide application in related fields. In order to meet the development needs of modern high-tech fields, overcome the above-mentioned shortcomings of polyimide materials, and prepare polyimide materials with good solubility and excellent comprehensive properties, ...

Claims

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