Novel electronic-grade polyimide film with low linear expansion coefficient and production method thereof

A polyimide film, low linear expansion coefficient technology, applied in the low linear expansion coefficient polyimide film and its production field, can solve the problem that can not meet the needs of high-end electronic products, the polyimide linear expansion coefficient is large, High dimensional stability and other issues, to achieve the effects of large-scale industrial production, low linear expansion coefficient and low cost

Active Publication Date: 2014-01-22
宏威高新材料有限公司 +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0013] The purpose of the present invention is to overcome the large linear expansion coefficient of existing polyimide, which cannot meet the needs of high-end electronic products, and provide a polyimide with extremely low linear expansion coefficient, high dimensional stability, low moisture absorption rate, excellent High-end polyimide with excellent adhesive properties, good mechanical properties and electrical properties and production method thereof

Method used

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  • Novel electronic-grade polyimide film with low linear expansion coefficient and production method thereof
  • Novel electronic-grade polyimide film with low linear expansion coefficient and production method thereof
  • Novel electronic-grade polyimide film with low linear expansion coefficient and production method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0062] Put 500 liters of DMF into the dissolving kettle, add 1.00 molar ratio of ODA, start the mixer to stir and dissolve, the dissolution time is 1 hour, after the diamine monomer is completely dissolved in the polar solvent, stop the stirring, and use compressed air to separate the diamine The body solution is pressed into the stainless steel polymerization reactor through the filter, the mixer is started, the cooling water is passed through, and then the dianhydride monomers (PMDA, BPDA, BTDA and their combinations) with a total molar ratio of 1.010~1.015 are gradually added in 8 times . For the 1st to 4th times, the amount of dianhydride added is controlled at equal and uniform intervals. The first 4 times add 50wt% of the total amount of dianhydride. From the 5th to 8th times, each addition is 50wt% of the total balance. Put in, and check the resin viscosity after 5-10 minutes of stirring and reaction after each feeding. When the polyamic acid resin glue with a solid cont...

Embodiment 2

[0066] Refer to the solution polycondensation method of Example 1, using DMF as the solvent, polycondensation of the dianhydride and diamine in the same molar ratio to obtain a polyamic acid solution with a solid content of 15-20%, which is filtered and vacuum degassed. The mixed polyamic acid solution is cast on an endless steel belt through an extrusion die to form a film, which is chemically imidized to form a gel film with a solid content of 22.5% to 55%, and then the steel belt is peeled off by a peeling roller and sent by a silicone roller To the longitudinal stretching machine and the transverse stretching machine, the biaxial stretching is carried out at a stretching ratio of 1.10 to 1.35 at a temperature of 125~185℃, and the biaxial stretching film is then subjected to a high temperature of 15min~25min in an infrared box at 350~450℃ Fully imidized, heat setting in a high temperature box at 250-300℃ for 5min-8min, corona surface modification, natural cooling, edge trimmi...

Embodiment 3

[0073] Referring to Example 1, a multi-component blended polyamic acid was synthesized by a stepwise feeding method.

[0074] Anhydrous N,N'-dimethylformamide 85% (parts by weight) and 15% (parts by weight) of anhydrous N,N'-dimethylformamide purified and pre-measured in a solvent tank with a mass of 4 times the total amount of dianhydride and diamine monomers ) Put the mixed solvent into the dissolving kettle, put 108kg of high-purity p-phenylenediamine and 367kg of APDS into the dissolving kettle through the automatic metering system, start the mixer to stir and dissolve, the dissolution time is not less than 1.0 hour, and the diamine monomer is completely dissolved After the polar solvent, stop stirring, use compressed air to press the diamine monomer solution into the stainless steel polymerization reactor through the filter, start its agitator, pass cooling water, and then gradually add the total amount in 8 batches under stirring 294kg of pyromellitic dianhydride, control t...

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Abstract

The invention relates to a preparation method of an electronic-grade polyimide film with low linear expansion coefficient. The method comprises the following steps that (1) the step-by-step condensation polymerization technology is used for obtaining polybasic block copolymerization polyamide acid glue solutions comprising one or more bar-shaped rigid chain sections containing para-benzene or biphenyl and one or more soft chain sections containing ether bonds or silicon-oxygen bonds and the like; (2) polyamide acid comprising one or more bar-shaped rigid chain structures containing para-benzene or biphenyl and polyamide acid comprising one or more soft chain structures containing ether bonds or silicon-oxygen bonds are independently compounded, and the two or more polyamide acid glue solutions different in rigidity and softness are mixed and compounded; (3) the compounded glue solutions are subjected to filtration, vacuum defoamation, casting filming, bidirectional stretching, chemical amidization or thermal amidization, infrared complete amidization, high-temperature thermal forming processing, corona processing and a reeling process, and therefore the electronic-grade polyimide film with the thickness being 7.5-125 micrometers, the linear expansion coefficient being 5-18ppm / DEG C, and good physical mechanical performance is obtained.

Description

Technical field [0001] The invention relates to a low linear expansion coefficient polyimide film and a production method thereof, belonging to the technical field of high-performance engineering plastic films, and capable of meeting the requirements of high-end flexible printed circuit boards. Background technique [0002] Polyimide (PI) refers to a class of aromatic heterocyclic polymers containing imide rings in the main chain. It has excellent mechanical, dielectric, radiation resistance, and corrosion resistance at high temperatures. It is an organic polymer One of the materials with the best comprehensive performance. It is known as the "jewel in the crown" of high-tech materials and the "master" in solving microelectronics technologies such as VLSI in the 21st century. It is used in aerospace, electronic information, automotive Industry and other fields have broad application space. [0003] With the development of electronic products in the direction of multi-function, net...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08J5/18C08L79/08C08G73/10
Inventor 李晓敏袁萍黄渝鸿韩青霞袁彬彬杨帆陈凤阳龑黄小诚
Owner 宏威高新材料有限公司
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