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Preparation method of boron-doped diamond film/carbon film composite electrode material

A boron-doped diamond and composite electrode technology, which is applied in the field of preparation of conductive diamond electrodes, can solve the problems of high signal-to-noise ratio and poor charge storage capacity

Active Publication Date: 2014-04-02
SICHUAN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The characteristics of diamond electrodes include high signal-to-noise ratio, excellent response repeatability and resistance to deactivation and electrode contamination caused by molecular adsorption. It is an excellent recording electrode material, but its charge storage capacity is relatively poor, and it is used as a stimulating electrode. Still need to modify

Method used

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  • Preparation method of boron-doped diamond film/carbon film composite electrode material
  • Preparation method of boron-doped diamond film/carbon film composite electrode material
  • Preparation method of boron-doped diamond film/carbon film composite electrode material

Examples

Experimental program
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Effect test

Embodiment 1

[0026] Deposit a diamond film of more than 5 μm on a 2-inch intrinsic silicon wafer. After the silicon wafer surface is cleaned by conventional methods, it is ground with diamond powder, and then the silicon wafer is cut into 15 × 5mm strips, and ultrasonically cleaned with ethanol or acetone for 5 Minutes, blow dry, place in an antenna bell jar type microwave plasma CVD reaction chamber, with the silicon side facing up, the diamond film surface is close to the abutment, the reaction chamber is evacuated, and the microwave generator is turned on. Hydrogen bubbling carries boron trioxide (B 2 o 3 ), the CH 4 / H 2 0.5vol%, B / C ratio of 1 / 100, working gas pressure of 4.3KPa, microwave output power of 1300W for 12 hours, boron-doped diamond film thickness of 5mm, four-probe test square resistance of 463Ω / □.

Embodiment 2

[0028]Deposit a diamond film of more than 5 μm on a 2-inch intrinsic silicon wafer. After the silicon wafer surface is cleaned by conventional methods, it is ground with diamond powder, and then the silicon wafer is cut into 15 × 5mm strips, and ultrasonically cleaned with ethanol or acetone for 5 Minutes, blow dry, place in an antenna bell jar type microwave plasma CVD reaction chamber, with the silicon side facing up, the diamond film surface is close to the abutment, the reaction chamber is evacuated, and the microwave generator is turned on. Hydrogen bubbling carries boron trioxide (B 2 o 3 ), the CH 4 / H 2 0.5vol%, B / C ratio of 1 / 100, working gas pressure of 4.3KPa, microwave output power of 1300W, the deposition time is extended to 20 hours, the boron-doped diamond film thickness is 9mm, and the square resistance of the four-probe test is 261Ω / □, enhanced conductivity.

Embodiment 3

[0030] Deposit a diamond film of more than 5 μm on a 2-inch intrinsic silicon wafer. After the silicon wafer surface is cleaned by conventional methods, it is ground with diamond powder, and then the silicon wafer is cut into 15 × 5mm strips, and ultrasonically cleaned with ethanol or acetone for 5 Minutes, blow dry, place in an antenna bell jar type microwave plasma CVD reaction chamber, with the silicon side facing up, the diamond film surface is close to the abutment, the reaction chamber is evacuated, and the microwave generator is turned on. Hydrogen bubbling carries boron trioxide (B 2 o 3 ), the CH 4 / H 2 0.5vol%, working gas pressure 4.3KPa, microwave output power 1300W for 12 hours, B / C ratio is 1 / 200, boron-doped diamond film thickness is 5mm, square resistance of four-probe test is 1464Ω / □, Conductivity drops.

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Abstract

The invention discloses a preparation method of a boron-doped diamond film / carbon film composite electrode material, which is characterized by adopting a conventional diamond film preparation method and comprising the following steps: preparing an insulated diamond film (3) on a non-conductive substrate (2); and preparing a boron-doped diamond film (1) on the other side of the substrate, and partially converting the insulated diamond film into a carbon film (4). Primarily in the preparation of the carbon film, the diamond of the insulated diamond film is partially converted into a non-diamond phase such as graphite and amorphous state carbon under the effect of high temperature and oxygen in a boron source; and the preparation of the carbon film and the preparation of the boron-doped diamond film are performed at the same time. When the composite plane electrode material is in use, electrical stimulation is realized by use of the advantages of low impedance and higher charge storage capacity of the carbon film; and meanwhile, the high signal-to-noise ratio of the boron-doped diamond film is more favorable for detecting electrical signals. Compared with a common electrode preparation method, two electrode materials are prepared on the substrate, and two functions can be realized.

Description

technical field [0001] The invention relates to the preparation of a conductive diamond electrode, specifically a method for preparing a conductive boron-doped diamond film on one side of a non-conductive material surface, and simultaneously preparing a conductive carbon film on the other side to obtain a composite electrode material. technical background [0002] The nervous system is a complex system. Human beings have been trying to explore its mysteries for a long time, so neural engineering is derived, which is an interdisciplinary subject of neuroscience, material science, microelectronics technology and information science. The study of neural engineering systems is of great significance for revealing the working mechanism of the nervous system and exploring the treatment and rehabilitation of neurological diseases. The most critical thing in the neural engineering system is the nerve-electronic interface, that is, the electrode, which mainly realizes the following tw...

Claims

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Application Information

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IPC IPC(8): C23C16/22C23C16/511A61N1/05
Inventor 芶立练发东
Owner SICHUAN UNIV
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