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High dielectric constant polyimide film and its preparation method and application

A technology of polyimide film and polyamic acid, which is applied in the field of high strength, high dielectric constant, high temperature resistant polyimide film and low dielectric loss, and can solve the problems of complex and expensive synthesis of new monomers , to achieve the effect of high strength, low dielectric loss and high dielectric constant

Active Publication Date: 2016-03-30
SHENZHEN HIFUTURE ELECTRIC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although the dielectric constant of polyimide can be improved to some extent by changing its chemical structure, the synthesis of new monomers is very complicated and expensive.

Method used

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  • High dielectric constant polyimide film and its preparation method and application
  • High dielectric constant polyimide film and its preparation method and application
  • High dielectric constant polyimide film and its preparation method and application

Examples

Experimental program
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Effect test

specific Embodiment approach

[0037] The preparation method and performance characterization of polyimide film of the present invention:

[0038] (1) Configuration of polyimide prepolymer (polyamic acid) solution: use aromatic diamine and aromatic dianhydride as condensation polymerization monomer, soluble polyaniline (Pn) as end-capping agent, according to molar ratio [0.7- 0.95 moles of diamine] / [1.0 moles of dianhydride] / [0.6-0.1 moles of soluble polyaniline], mixed with a certain amount of solvent, the solvent is N,N-dimethylformamide (DMF), N-methylpyrrolidone (NMP), N,N-dimethylacetamide (DMAC) or dimethyl sulfoxide (DMSO) or two mixed solvents, polymerize at -5°C to 10°C for 1-6 hours, A polyamic acid solution terminated with polyaniline is obtained, and the intrinsic viscosity of the polymer is 0.6-3.5dl / g. Add solvents such as tetrahydrofuran, and adjust the solution obtained from the polycondensation reaction to a polymer solution with an absolute viscosity of 0.5-3.5 Pa.S.

[0039] (2) Prepara...

Embodiment example 1

[0045] Implementation case 1: Preparation of polyaniline / / biphenyldianhydride / / diphenyl ether diamine (Pn / / BPDA / / ODA) high dielectric constant polyimide film

[0046] Mix the capping agent Pn with a number average molecular weight of 4000-5000, the diamine monomer ODA and the dianhydride monomer BPDA synthesized by the emulsion polymerization method of 3-methylaniline in the reactor at a molar ratio of 0.4:0.8:1 , add N,N-dimethylacetamide (DMAC) as a solvent, control the reaction temperature at 10°C, stir and react for 6 hours to obtain a polyamic acid viscous solution with a polymer intrinsic viscosity of 2.9dl / g, add an appropriate amount of Tetrahydrofuran was used as a diluent to adjust the absolute viscosity of the polyamic acid solution to 2.6Pa·S. Pour an appropriate amount of the obtained solution on a clean glass plate, and use a squeegee with a 0.3mm groove to scrape the solution on the glass plate to form a layer of solution film on the glass plate, and then dry it...

Embodiment example 2

[0048] Example 2: Preparation of Polyaniline / / Biphenyldianhydride / / Triphenylene Diether Diamine (Pn / / BPDA / / TPE-Q) High Dielectric Constant Polyimide Film

[0049] Mix the same end-capping agent Pn, diamine monomer TPE-Q and dianhydride monomer BPDA as in Example 1 in the reactor at a molar ratio of 0.6:0.7:1, and add N,N-dimethylacetamide (DMAC) as a solvent, control the reaction temperature at 10°C, and stir for 6 hours to obtain a polyamic acid viscous solution with a polymer intrinsic viscosity of 2.2dl / g. Add an appropriate amount of tetrahydrofuran as a diluent to adjust the polyamic acid solution. The absolute viscosity is up to 2.3Pa·S. Pour an appropriate amount of the obtained solution on a clean glass plate, and use a squeegee with a 0.3mm groove to scrape the solution on the glass plate to form a layer of solution film on the glass plate, and then dry it at 80°C 30min to form a polyamic acid film supported by a glass plate. The latter is placed in a high-temperatu...

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Abstract

The invention provides a polyimide film. Polyamide acid with a structure shown in formula (I) forms a polyamide acid film, then imidization is carried out to obtain the high-dielectric-constant polyimide film with a structure shown in formula (III), wherein R1 is aromatic ring-containing dianhydride residue, R2 is aromatic ring-containing diamine residue, Pn is a chain segment structure of polyaniline, n is number of polymer repeating units and is from 100 to 500. The polyimide film has high dielectric constant, low dielectric loss, high temperature resistance, high intensity and high chemical stability, and is suitable for dielectric layers of electronic devices with high storage energy. Flexible polyimide material has good electrostrictive response, so as to realize conversion of electrical energy and mechanical energy. The high-dielectric-constant polyimide film can be widely applied to the fields of electronics, electric motors, electric energy delivery industry and the electromechanical energy conversion technology.

Description

technical field [0001] The invention relates to a polyimide film with high dielectric constant, in particular to a polyimide film with high dielectric constant, low dielectric loss, high strength and high temperature resistance, and a preparation method thereof. Background technique [0002] Due to its good performance of storing electric energy and uniform electric field, high dielectric materials are widely used in industries such as electronics, motors, and electric energy transmission. With the rapid development of science and technology, all walks of life have higher and higher requirements for materials. Polymer materials with high dielectric constant, low dielectric loss and light weight have become a hot spot in the field of electric energy storage and uniform electric field technology. As a carrier for charge storage, polymer dielectric materials with low density, high dielectric constant, and low dielectric loss are used to manufacture high-power capacitors with hi...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08G73/10C08J5/18
Inventor 侯豪情吕晓义何平
Owner SHENZHEN HIFUTURE ELECTRIC