A kind of pcb printed circuit board silver paste and preparation method thereof

Abstract

A PCB printed circuit board silver paste, made of the following raw materials in parts by weight: glass powder 8‑10, 10‑15 μm flake silver powder 40‑50, nanoscale flake silver powder 15‑20, silver-coated nickel powder 10‑15 , bisphenol F epoxy resin 8-12, isopropyl myristate 1-2, tartaric acid 1-2, sebacic acid 2-3, nano-chitin 0.3-0.5, polyvinyl alcohol 1-2, pine oil Alcohol 4-6, 2-methylimidazole 0.3-0.5, butacarbitol 4-6, methyl cellosolve 3-5, butacarbitol acetate 3-5; diameter flake silver powder, so that the contact is tight and the conductivity is good; by using silver-coated nickel powder, the cost is saved; the production process of the silver paste of the present invention is unique, which can prevent the silver powder from agglomerating and affecting the conductivity; the printing performance of the silver paste of the present invention Well, the circuit board has a high yield rate, is not easy to fall off, and has a long service life.

Description

technical field [0001] The invention belongs to the technical field of electronic paste, in particular to a PCB printed circuit board silver paste and a preparation method thereof. Background technique [0002] In the modern microelectronics industry, people have higher and higher requirements for electronic components, and the production is mostly carried out by process and standardization to reduce costs. The printed circuit board (PCB) was born to meet the needs of the microelectronics industry. Correspondingly, conduct research on new conductive pastes to match electronic pastes such as conductive pastes, electrode pastes, dielectric pastes, resistor pastes, and hole filling pastes with printed circuit boards (PCBs) that require new requirements. It is imperative. [0003] Generally speaking, the main components of electronic paste include functional phases such as metal, noble metal powder, etc., inorganic binders such as glass powder, oxide powder, etc., organic binde...

AI Technical Summary

Problems solved by technology

[0005] The binder in the conductive silver paste has a great influence on the yield of circuit printing, such as viscosity, cohesiveness, adhesion, leveling, film formation, solvent volatility, etc. will affect the printing performance of the circuit , there are pores, open circuits, etc., and sometimes the glass phase has not yet begun to melt after the organic matter has volatilized, resulting in the phenomenon that the conductive line falls off from the substrate, and the conductive line is scrapped. Therefore, the performance of the organic binder needs to be improved.

[0006] At present, many inorganic binders use glass powder. Glass powder is made of metal oxides, silicon oxide and other materials. If the melting point is too high, the glass phase has not yet started to melt after the volatilization of organic matter is completed, resulting in conductive lines obtained from conductive silver paste. The phenomenon of falling off from the substrate makes the conductive circuit scrapped; and many of the current glass powders contain harmful substances such as lead, which is not good for the environment, so it is necessary to develop glass powders with better performance