Electronic circuit surface assembling water-soluble soldering flux and preparing method thereof

An electronic circuit, water-soluble technology, used in welding equipment, welding media, manufacturing tools, etc., can solve the problems of low cost and high residue, and achieve the effect of less residue, low residue and less corrosion

Inactive Publication Date: 2014-12-10
YANTAI HENGDIKE ENERGY TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] In the soldering process of electronic products, rosin resin flux mainly composed of rosin, resin, halide-containing active agent, additive and organic solvent is generally used. Although this type of flux has good solderability and low cost , but high post-soldering residue

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0016] A water-soluble flux for electronic circuit surface assembly includes the following raw materials in parts by mass: 4 kg of citric acid, 1 kg of DL-malic acid, 2 kg of triisopropanolamine, 0.5 kg of alkyl glycoside, 65 kg of mixed solvent, diethyl 8 kilograms of glycol butyl ether, 17 kilograms of water-soluble acrylic resins, 0.8 kilograms of 2-mercaptobenzothiazole, 0.12 kilograms of 3-tert-butyl-4-methoxyphenol; wherein, the mixed solvent is water-soluble anhydrous methanol, Propylene glycol and glycerol are solvents prepared in a mass ratio of 1:1:0.8.

[0017] The preparation method is: in a container with a stirrer and a thermometer, after mixing 4 kg of citric acid, 1 kg of DL-malic acid and 2 kg of triisopropanolamine in parts by mass, add 1 kg of water , react at 50-60°C for 2 hours, then add 17 kg of water-soluble acrylic resin in parts by mass, rapidly raise the temperature to 80-90°C, stir thoroughly for 3 hours, cool, filter, dry, and grind into white powde...

Embodiment 2

[0020] A water-soluble flux for electronic circuit surface assembly includes the following raw materials in parts by mass: 5 kg of citric acid, 2 kg of DL-malic acid, 1 kg of glycolic acid, 3 kg of triethanolamine, 1.0 kg of fatty alcohol polyoxyethylene ether, mixed solvent 70 kg, 5 kg of triethylene glycol butyl ether, 21 kg of water-soluble acrylic resin, 1.2 kg of 1-hydroxybenzotriazole, 0.1 kg of 2-tert-butylhydroquinone; wherein, the mixed solvent is a water-soluble anhydrous Ethanol, propylene glycol and butanetriol are solvents prepared in a mass ratio of 1:1:1.

[0021] The preparation method is: in a container with a stirrer and a thermometer, after mixing 5 kg of citric acid, 2 kg of DL-malic acid, 1 kg of glycolic acid and 3 kg of triethanolamine in parts by mass, add 1.5 Kg of water, react at 50-60°C for 1.5 hours, then add 21 kg of water-soluble acrylic resin, rapidly heat up to 80-90°C, stir thoroughly for 3.5 hours, cool, filter, dry, and grind Become white po...

Embodiment 3

[0024] A water-soluble flux for electronic circuit surface assembly includes the following raw materials in parts by mass: 4 kg of citric acid, 0.5 kg of tartaric acid, 2.5 kg of DL-malic acid, 1 kg of glycolic acid, 2.6 kg of triisopropanolamine, alkylphenol poly 0.7 kg of oxyethylene ether, 67 kg of mixed solvent, 6 kg of dipropylene glycol propyl ether, 18 kg of water-soluble acrylic resin, 1.0 kg of methylene benzotriazole, 0.15 kg of 2,6-di-tert-butyl-p-cresol; The mixed solvent is a solvent prepared from water-soluble absolute ethanol, ethylene glycol and glycerol in a mass ratio of 1:0.9:1.

[0025] Its preparation method is: in a container with a stirrer and a thermometer, the mass parts are 4 kg of citric acid, 2.5 kg of DL-malic acid, 0.5 kg of tartaric acid, 1 kg of glycolic acid, 1 kg and 2.6 kg of three After mixing isopropanolamine, add 0.8 kg of water and react at 50-60°C for 1 hour, then add 18 kg of water-soluble acrylic resin in parts by mass, rapidly raise t...

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PUM

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Abstract

The invention discloses electronic circuit surface assembling water-soluble soldering flux and a preparing method thereof. The electronic circuit surface assembling water-soluble soldering flux comprises the following raw materials, by weight part, of 5-8 parts of hydroxyl organic acid, 2-3 parts of alcohol amine, 0.5-1 part of surface active agent, 65-70 parts of mixed solvent, 5-8 parts of cosolvent, 17-21 parts of water-soluble acrylic resin, 0.8 part-1.2 parts of corrosion inhibitor and 0.1-0.15 part of antioxidant. The water-soluble hydroxyl organic acid with high activity, little residue and low corrosion is compounded with alcohol amine to form active material compound, a method that the surface active agent, the corrosion inhibitor, the acrylic resin, the antioxidant and the cosolvent are matched with each other is supplemented, and the active material compound is dissolved into the mixed solvent. The soldering flux is low in corrosion, a little in corrosion, easy to rinse, free of lead and halogen and used for welding electronic circuit surface assembling electronic components.

Description

technical field [0001] The invention relates to the technical field of flux, in particular to a water-soluble flux for electronic circuit surface assembly and a preparation method thereof. Background technique [0002] In the soldering process of electronic products, rosin resin flux mainly composed of rosin, resin, halide-containing active agent, additive and organic solvent is generally used. Although this type of flux has good solderability and low cost , but the residue after welding is high. Its residues contain halogen ions, which will gradually cause problems such as electrical insulation performance decline and short circuit. To solve this problem, it is necessary to clean the rosin resin-based flux residues on the electronic printed board, and clean the rosin resin-based flux residues. The cleaning agent used is mainly fluorine and chlorine compounds. This compound is a depleting substance of the atmospheric ozone layer. Moreover, it is also required to be clean a...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/36
CPCB23K35/3618B23K35/40
Inventor 修建东刘方旭
Owner YANTAI HENGDIKE ENERGY TECH
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