Silicon-containing polyimide coating adhesive with high adhesion and preparation method of silicon-containing polyimide coating adhesive
A polyimide coating, high-adhesion technology, applied in the field of microelectronic information, can solve the problems of high cost, lack of extensiveness, large amount of double-ended aminotetramethylsiloxane added, etc., and achieve excellent adhesion , the effect of product cost reduction
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[0026] Example 1
[0027] Dissolve 7.7 parts of 4,4'-diaminodiphenyl ether in 55.5 parts of N-methylpyrrolidone at 10-30℃, add 0.3 part of 1,3-bis(3-aminopropyl)-1 after all is dissolved ,1,3,3-Tetramethyldisiloxane. Then add 0.6 parts of 1,3-bis(3,4-dicarboxyphenyl)-1,1,3,3-tetramethyldisiloxane dianhydride and 0.4 parts of uniformity at 0-10℃ in batches. Pyromellitic dianhydride, 2 parts of 3,3',4,4'-benzophenone tetracarboxylic dianhydride and 9.7 parts of 3,3',4,4'-benzophenone tetracarboxylic dianhydride Copolymerization, continue to add 23.8 parts of solvent, and react for 3 hours under vigorous stirring. The obtained yellow homogeneous viscous liquid is silicon-containing polyimide coating glue. Apply the coating glue to aluminum, copper, nickel, monocrystalline silicon wafers, glass or Al 2 O 3 , AlN, BeO, SiC and Si 3 N 4 Wait for the surface of the ceramic material, put it in a vacuum oven at 80℃, 0MPa, 120℃, -0.02MPa, 150℃, -0.04MPa for 1 hour, and then place it in a...
Example Embodiment
[0028] Example 2
[0029] Dissolve 8.4 parts of 4,4'-diaminodiphenyl ether in 54 parts of N-methylpyrrolidone at 10-30℃, add 0.3 part of 1,3-bis(3-aminopropyl)-1 after all is dissolved , 1,3,3-tetramethyldisiloxane and 0.3 parts of 1,3-bis(3-aminobutyl)-1,1,3,3-tetramethyldisiloxane. Then 0.5 parts of 1,3-bis(3,4-dicarboxyphenyl)-1,1,3,3-tetramethyldisiloxane dianhydride and 2.2 parts of 3 ,3',4,4'-benzophenone tetracarboxylic dianhydride and 11.2 parts of 3,3',4,4'-benzophenone tetracarboxylic dianhydride mixture was copolymerized, and then 23.1 parts of solvent was added, vigorously The reaction was carried out for 6 hours under stirring, and the obtained yellow homogeneous viscous liquid was the silicon-containing polyimide coating glue. Apply the coating glue to aluminum, copper, nickel, monocrystalline silicon wafers, glass or Al 2 O 3 , AlN, BeO, SiC and Si 3 N 4 The heat treatment steps are the same as in Example 1 to obtain silicon-containing polyimide composite boards ...
Example Embodiment
[0030] Example 3
[0031] Dissolve 8 parts of 4,4'-diaminodiphenyl ether in 52.3 parts of N,N-dimethylacetamide at 10-30℃, add 0.3 parts of 1,3-bis(3-aminopropyl) Base)-1,1,3,3-tetramethyldisiloxane and 0.3 parts of 1,3-bis(3-aminopropyl)-1,1,3,3-tetramethylpolysiloxane ( n=4). Then add 0.3 parts of 1,3-bis(3,4-dicarboxyphenyl)-1,1,3,3-tetramethyldisiloxane dianhydride and 16.4 parts in batches at 0-10℃ 3,3',4,4'-triphenyldiether tetracarboxylic dianhydride was polymerized, and 22.4 parts of solvent was added, and the reaction was carried out for 8 hours under vigorous stirring. The resulting yellow homogeneous viscous liquid was silicon-containing polyimide Coating glue. Apply the coating glue to aluminum, copper, nickel, monocrystalline silicon wafers, glass or Al 2 O 3 , AlN, BeO, SiC and Si 3 N 4 The heat treatment steps are the same as in Example 1 to obtain silicon-containing polyimide composite boards with different substrates. After the adhesion test, the adhesion bet...
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