Glue and preparation method thereof

A glue and deionized water technology, applied in the direction of adhesive types, adhesive additives, non-polymer adhesive additives, etc., can solve problems such as the inability to realize the comprehensive application of glue, poor safety and environmental protection, and pungent odor. Achieve strong adhesion, improve high temperature resistance, and expand the application range

Inactive Publication Date: 2015-01-28
ZHONGSHAN BAOTAI CHEM
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The above glue types are highly targeted and can only be used in specific environments and working conditions. The comprehensive application of glue in electrostatic flocking, paint additives, and indoor and outdoor w

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0028] A kind of glue, comprises the component of following mass: Deionized water 175kg, potassium persulfate 1.5kg, ethoxylated nonylphenol sulfosuccinic acid half ester disodium salt 0.05kg, 1-allyloxy-3- (4-nonylphenol)-2-propanol polyoxyethylene (10) ether ammonium sulfate 1.0kg, butyl acrylate 100kg, styrene 50kg, methyl methacrylate 25kg, acrylic acid 25kg, hydroxyethyl acrylate 25kg, methyl Glycidyl acrylate 25kg, sodium bicarbonate 0.05kg, ferrous sulfate 0.15kg, tert-butyl hydroperoxide 0.25kg.

[0029] A preparation method of glue, comprising the following steps:

[0030] (1) Add the formula amount of deionized water, ethoxylated nonylphenol sulfosuccinic acid half ester disodium salt, sodium bicarbonate into the reaction kettle with agitator, fill it with nitrogen protection, and heat up to 75°C ;

[0031] (2) Add 1-allyloxy-3-(4-nonylphenol)-2-propanol polyoxyethylene (10) ether ammonium sulfate, butyl acrylate, styrene, methacrylic acid under stirring at 50r / min...

Embodiment 2

[0038] A kind of glue, comprising the following components of quality: deionized water 185kg, potassium persulfate 2.0kg, ethoxylated nonylphenol sulfosuccinic acid half ester disodium salt 0.25kg, 1-allyloxy-3- (4-nonylphenol)-2-propanol polyoxyethylene (10) ether ammonium sulfate 3.5kg, butyl acrylate 125kg, styrene 75kg, methyl methacrylate 65kg, acrylic acid 65kg, hydroxyethyl acrylate 65kg, methyl Glycidyl acrylate 65kg, sodium hydroxide 0.1kg, ferrous chloride 0.2kg, tert-butyl hydroperoxide 0.35kg.

[0039] A preparation method of glue, comprising the following steps:

[0040] (1) Add the formula amount of deionized water, ethoxylated nonylphenol sulfosuccinic acid half ester disodium salt, and sodium hydroxide into a reaction kettle with a stirrer, fill it with nitrogen protection, and heat up to 78°C ;

[0041] (2) Add 1-allyloxy-3-(4-nonylphenol)-2-propanol polyoxyethylene (10) ether ammonium sulfate, butyl acrylate, styrene, methyl Methyl acrylate, acrylic acid, ...

Embodiment 3

[0048] A kind of glue, comprising the following quality components: 200kg of deionized water, 2.5kg of potassium persulfate, 0.5kg of ethoxylated nonylphenol sulfosuccinic acid half ester disodium salt, 1-allyloxy-3- (4-nonylphenol)-2-propanol polyoxyethylene (10) ether ammonium sulfate 5kg, butyl acrylate 150kg, styrene 100kg, methyl methacrylate 100kg, acrylic acid 100kg, hydroxyethyl acrylate 100kg, methyl Glycidyl acrylate 100kg, sodium bicarbonate 0.15kg, ferrous chloride 0.25kg, tert-butyl hydroperoxide 0.5kg.

[0049] A preparation method of glue, comprising the following steps:

[0050] (1) Add the formula amount of deionized water, ethoxylated nonylphenol sulfosuccinic acid half ester disodium salt, and sodium bicarbonate into a reaction kettle with a stirrer, fill it with nitrogen protection, and heat up to 80°C ;

[0051] (2) Add 1-allyloxy-3-(4-nonylphenol)-2-propanol polyoxyethylene (10) ether ammonium sulfate, butyl acrylate, styrene, methyl Methyl acrylate, a...

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PUM

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Abstract

The invention relates to a glue. The glue comprises the following components in parts by mass: 35-40 parts of deionized water, 0.3-0.5 part of a polymerization accelerant, 0.01-0.10 part of an anionic-non-ionic surfactant, 0.20-1.00 part of an anionic emulsifying agent, 20-30 parts of butyl acrylate, 10-20 parts of styrene, 5-20 parts of methyl methacrylate, 5-20 parts of acrylic acid, 5-20 parts of hydroxyethyl acrylate, 5-20 parts of glycidyl methacrylate, 0.01-0.03 part of a pH value regulator, 0.03-0.05 part of a reducing agent and 0.05-0.1 part of an initiator. The invention further discloses a preparation method of the glue. The glue provided by the invention has strong adhesion to most of materials, aging resistance, resistance to high temperature and low temperature, resistance to water washing, acid and alkali resistance, safety and environmental friendliness, and can be widely used for electrostatic flocking, coating additives and indoor and outdoor waterproofing projects.

Description

technical field [0001] The invention relates to the field of glue, in particular to a glue and a preparation method thereof. Background technique [0002] Glue is mainly used to join two materials. Existing glues generally can only selectively bond certain or certain types of materials, such as rubber, paper, plastics, wood, etc., but have poor adhesion to other materials. And there are certain restrictions on the use environment and working conditions. For example, Chinese invention patent CN 101191044 proposes a kind of glue, which is composed of hot melt glue and solvent, which can be used to bond waterproof uppers. The glue is activated by heating and fills pinholes and seams to achieve the purpose of sealing and waterproofing. Chinese invention patent CN103805125A discloses a kind of construction glue, which has good cohesiveness and permeability to building materials such as cement mortar, concrete substrate, wood, pottery and glass. Chinese invention patent CN10287...

Claims

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Application Information

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IPC IPC(8): C09J133/08C09J133/02C09J125/14C09J11/06C08F220/18C08F212/08C08F220/14C08F220/06C08F220/28C08F220/32C08F2/26C08F2/30
Inventor 吴艳军
Owner ZHONGSHAN BAOTAI CHEM
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