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Ultraviolet-cured resin composition and application thereof as solder resist

A technology for curing resins and compositions, applied in the field of solder resist, can solve the problems of customers' use troubles and narrow operating latitude, and achieve the effect of reducing the peeling phenomenon of paint film, small volume shrinkage and good adhesion

Inactive Publication Date: 2015-04-01
JIANGSU KUANGSHUN PHOTOSENSITIVITY NEW MATERIAL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] At present, this type of UV-curable solder resist resin mostly uses novolac epoxy acrylate resin as the main body, combined with acrylate monomers of different functionalities to adjust the photosensitivity of the solder resist and the flexibility of the cured paint film, but as we all know, The structural characteristics of acrylate monomers determine that the chemical resistance and heat resistance are far lower than epoxy acrylate resins, and the solder resist of this system often fails due to improper pre-treatment of the board by customers or defects in curing equipment. Makes the operation tolerance narrow during use, causing great troubles to customers

Method used

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  • Ultraviolet-cured resin composition and application thereof as solder resist
  • Ultraviolet-cured resin composition and application thereof as solder resist
  • Ultraviolet-cured resin composition and application thereof as solder resist

Examples

Experimental program
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Effect test

Embodiment 1

[0028] (1) Synthesis of novolac epoxy acrylate resin: 177 parts of novolac epoxy resin (manufactured by Changchun Artificial Resin, PNE-177) and 30 parts of trimethylolpropane triacrylate were heated to 80°C to dissolve, and then slowly dripped Add a mixture of 72 parts of acrylic acid, 0.38 parts of triphenylphosphine, and 0.12 parts of p-hydroxyanisole, and heat to 100°C for 7 hours to obtain a novolac epoxy acrylate resin;

[0029] (2) Synthesis of bisphenol epoxy acrylate resin: 550 parts of bisphenol A epoxy resin (Guodu Chemical Industry, YD-020) and 120 parts of trimethylolpropane triacrylate are heated to 70 ° C to dissolve, and then slowly Add dropwise a mixture of 7.2 parts of acrylic acid, 2.5 parts of N,N-dimethylbenzylamine, and 0.2 parts of hydroquinone, and heat to 115°C for 7 hours to obtain a bisphenol epoxy acrylate resin;

[0030] (3) Gained novolak epoxy acrylate resin, bisphenol epoxy acrylate resin and photoinitiator, unsaturated monomer, inorganic filler...

Embodiment 2

[0032](1) Synthesis of novolac epoxy acrylate resin: 177 parts of novolac epoxy resin (manufactured by Changchun Artificial Resin, PNE-177) and 30 parts of trimethylolpropane triacrylate, heated to 75 ° C to dissolve, and then slowly drop Add a mixture of 72 parts of acrylic acid, 0.38 parts of triphenylphosphine, and 0.12 parts of p-hydroxyanisole, and heat to 105 ° C for 6 hours to obtain novolac epoxy acrylate resin;

[0033] (2) Synthesis of bisphenol epoxy acrylate resin: 550 parts of bisphenol A epoxy resin (Guodu Chemical Industry, YD-020) and 120 parts of trimethylolpropane triacrylate are heated to 80 ° C to dissolve, and then slowly Add dropwise a mixture of 7.2 parts of acrylic acid, 2.5 parts of N,N-dimethylbenzylamine, and 0.2 parts of hydroquinone, and heat to 110°C for 5 hours to obtain a bisphenol epoxy acrylate resin;

[0034] (3) Gained novolak epoxy acrylate resin, bisphenol epoxy acrylate resin and photoinitiator, unsaturated monomer, inorganic filler mater...

Embodiment 3

[0036] (1) Synthesis of novolac epoxy acrylate resin: 177 parts of novolac epoxy resin (manufactured by Changchun Artificial Resin, PNE-177) and 30 parts of trimethylolpropane triacrylate were heated to 77°C to dissolve, and then slowly dripped Add a mixture of 72 parts of acrylic acid, 0.38 parts of triphenylphosphine, and 0.12 parts of p-hydroxyanisole, and heat it to 102 ° C for 8 hours to obtain a novolac epoxy acrylate resin;

[0037] (2) Synthesis of bisphenol epoxy acrylate resin: 550 parts of bisphenol A epoxy resin (Guodu Chemical Industry, YD-020) and 120 parts of trimethylolpropane triacrylate were heated to 75 ° C to dissolve, and then slowly Add dropwise a mixture of 7.2 parts of acrylic acid, 2.5 parts of N,N-dimethylbenzylamine, and 0.2 parts of hydroquinone, and heat to 112°C for 6 hours to obtain a bisphenol epoxy acrylate resin;

[0038] (3) Gained novolak epoxy acrylate resin, bisphenol epoxy acrylate resin and photoinitiator, unsaturated monomer, inorganic ...

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Abstract

The invention discloses an ultraviolet-cured resin composition. The composition is prepared from the following raw materials in parts by weight: 100 parts of phenolic epoxy acrylate resin, 20-90 parts of bisphenol epoxy acrylate, 1-10 parts of photoinitiator, 1-30 parts of unsaturated monomer, 5-60 parts of inorganic filler material, 0.5-5 parts of pigment and 0.1-2 parts of auxiliaries; all the raw materials are mixed proportionally, stirred thoroughly and mixed evenly, and then ground by use of a three-roll grinder until the fineness is less than or equal to 15 microns; the obtained powder is applied to the surface of a printed circuit board in a silk-screen printing, spraying or curtain coating, and then cured under ultraviolet source irradiation to form a solder resist coating. The ultraviolet-cured resin composition has both tenacity and heat resistance; the form film has such characteristics as excellent heat resistance and high hardness.

Description

technical field [0001] The invention relates to the field of ultraviolet light curing materials, in particular to a composition comprising novolac epoxy acrylate resin and bisphenol epoxy acrylate resin as the main resin, and a solder resist prepared by using the composition. Background technique [0002] The surface permanent protective coating required in the PCB manufacturing process is generally called a solder resist coating. Most of the industry uses ultraviolet curing type, alkaline water developable ultraviolet heat curing two-component type, heat curing type and self-drying type. Among them, the ultraviolet curing type is widely used because of its high production efficiency and low pollution. However, because it mostly uses phenolic modified resin as the main component, it shrinks greatly after being cured by ultraviolet rays, and the paint film is brittle. In the process, it is easy to be subjected to instantaneous thermal shock, which will cause the paint film an...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09D163/10G03F7/027
CPCC09D163/10C08L2201/08C08L2205/025C09D7/61G03F7/027
Inventor 安丰磊朱民刘仁包晗刘伟龙冯玉进
Owner JIANGSU KUANGSHUN PHOTOSENSITIVITY NEW MATERIAL
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