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A kind of conductive phenolic foam/polyaniline composite board and preparation method thereof

A technology of phenolic foam and composite board, which is applied in the field of chemical materials, can solve the problems of lack of compressive strength, bending strength and impact toughness, high conductive phenolic foam/polyaniline composite board, etc., and achieve simple formula and equipment, large service temperature range, Effect of Bending Strength Improvement

Active Publication Date: 2016-10-19
NANJING UNIV OF AERONAUTICS & ASTRONAUTICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] At present, there is a lack of a conductive phenolic foam / polyaniline composite board with high compressive strength, flexural strength and impact toughness and its preparation method

Method used

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  • A kind of conductive phenolic foam/polyaniline composite board and preparation method thereof
  • A kind of conductive phenolic foam/polyaniline composite board and preparation method thereof
  • A kind of conductive phenolic foam/polyaniline composite board and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0042] Such as figure 1 As shown, the present invention provides a kind of conductive phenolic foam / polyaniline composite board, and described conductive phenolic foam / polyaniline composite board comprises three layers, are respectively transparent conductive polyaniline film layer, modified phenolic resin substrate layer and transparent conductive A polyaniline film layer; the upper and lower surfaces of the modified phenolic resin substrate layer are respectively provided with a transparent conductive polyaniline film layer.

[0043] The modified phenolic foam substrate layer consists of the following components by mass percentage:

[0044]

[0045] Described modified phenolic resin is made up of the component of following parts by weight:

[0046] Modifier 1 part

[0047] Resole phenolic resin 100 parts.

[0048] The modifying agent is selected from the combination of polyvinyl butyral PVB, nitrile rubber, natural rubber, styrene-butadiene rubber, cashew nut shell oil...

Embodiment 2

[0068] The difference between Example 2 and Example 1 is that the modified phenolic foam substrate layer consists of the following components by mass percentage:

[0069]

[0070] Described modified phenolic resin is made up of the component of following parts by weight:

[0071] Modifier 3 parts

[0072] Resole phenolic resin 100 parts.

[0073] The modifier is selected from one or a combination of polyvinyl butyral PVB, nitrile rubber, natural rubber, styrene-butadiene rubber, cashew nut shell oil CNSL, tung oil, unsaturated fatty acid or acrylic acid.

[0074] Described resole phenolic resin is made up of following components by mass percentage:

[0075] Phenol 37%

[0076] Formaldehyde 68%

[0077] Catalyst 4%.

[0078] The reinforcing fiber is glass fiber; the emulsifier is selected from CGY-1 methyl silicone oil and DC193.

[0079] The foaming agent is selected from the combination of n-pentane, n-hexane and methylene chloride; the curing agent is phosphoric aci...

Embodiment 3

[0091] The difference between embodiment 3 and embodiment 1 is:

[0092] The modified phenolic foam substrate layer consists of the following components by mass percentage:

[0093]

[0094] Described modified phenolic resin is made up of the component of following parts by weight:

[0095] Modifier 4 parts

[0096] Resole phenolic resin 100 parts.

[0097] The modifier is selected from one or a combination of polyvinyl butyral PVB, nitrile rubber, natural rubber, styrene-butadiene rubber, cashew nut shell oil CNSL, tung oil, unsaturated fatty acid or acrylic acid.

[0098] Described resole phenolic resin is made up of following components by mass percentage:

[0099] Phenol 47%

[0100] Formaldehyde 78%

[0101] Catalyst 5%.

[0102] The reinforcing fiber is a combination of carbon fiber, aramid fiber and boron fiber; the emulsifier is selected from the combination of DC193, Tween 80 and Tween 60.

[0103] The foaming agent is dichloromethane; the curing agent is se...

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Abstract

The invention discloses a conductive phenolic foam / polyaniline composite board and a preparation method thereof. The preparation method comprises the following steps: (1) putting a phenolic foam composite board into acetone to be soaked, and placing a mixed solution in an ethanol solution, soaking in hydrogen peroxide, and then drying the phenolic foam composite board; (2) weighing aniline An and fixing the volume with 1M hydrochloric acid, pouring a stabilizer into a container, pouring the mixed solution into the container of the stabilizer and uniformly stirring; (3) weighing ammonium persulfate, and fixing the volume with a 1M hydrochloric acid solution; (4) taking out the container with the mixed solution of aniline hydrochloride and the stabilizer and putting in ice water, putting the phenolic foam composite board and stirring, and pouring cooled ammonium persulfate; (5) washing the phenolic foam composite board with 1M hydrochloric acid, and putting in the 1M hydrochloric acid to be soaked and dried to obtain the phenolic foam / polyaniline composite board. The phenolic foam board provided by the invention has high compressive strength, flexural strength and impact toughness.

Description

technical field [0001] The invention relates to the field of chemical materials, in particular to a conductive phenolic foam / polyaniline composite board and a preparation method thereof. Background technique [0002] It has been hundreds of years since the advent of phenolic resin as the first industrially produced resin. This kind of resin is widely used in construction, shipbuilding, transportation and other fields because of its simple synthesis process, stable structure, excellent mechanical properties and excellent fire resistance. The phenolic foam produced by foaming phenolic resin has a series of advantages such as simple processing technology, flame retardant, low smoke, and high temperature creep resistance. Due to the continuous improvement of the country's fire protection requirements for building insulation materials in recent years, the previously widely used polyurethane foam has far failed to meet the safety standards. As its most likely substitute material,...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B32B27/08B32B27/42B32B27/00B32B33/00C08L61/10C08L29/14C08L9/02C08L7/00C08L9/06C08L77/10C08K13/04C08K7/14C08K7/06C08J9/14C08G73/02
CPCB32B27/00B32B27/08B32B27/42B32B33/00B32B2307/212C08G73/02C08J9/14C08K7/06C08K7/14C08K13/04C08L7/00C08L9/02C08L9/06C08L29/14C08L77/10
Inventor 周金堂左玉鑫姚正军李天明李琳姚芮
Owner NANJING UNIV OF AERONAUTICS & ASTRONAUTICS