Preparation method for hydrophobic nanometer modified resin composite paint used for LED base plate

Abstract

The invention relates to preparation of paint, and aims at providing a preparation method for hydrophobic nanometer modified resin composite paint used for an LED base plate. The method comprises: firstly uniformly dispersing nanometer alpha-Al2O3 and butanol; then adding a silane coupling agent KH560 and ageing, so as to obtain a modified alpha-Al2O3 sol, and performing concentration distillation; uniformly mixing 1H,1H,2H,2H-perfluorooctyltriethoxysilane, n-butanol and formic acid, then adding deionized water, and ageing to obtain a silicon fluoride oligomer sol; and dispersing the former two products, an epoxy resin monomer, 2-butanone, xylene and 2,2,4-trimethyl-1,3-pentanediolmono(2-methylpropanoate), so as to obtain the paint. By introducing alpha-Al2O3 nano-particle into a conventional epoxy resin coating, the heat conductivity of resin is improved, also the excellent coating property and the workability of resin are maximumly kept, and the price is relatively appropriate. The hydrophobicity is substantially improved, and the short circuit problem caused by air moist is reduced. The prepared hydrophobic nanometer modified resin composite paint is suitable for production processing on a conventional production line, and is beneficial improvement on the basis of a conventional epoxy-resin-coated aluminium base plate.

Description

technical field [0001] The invention relates to coating technology, in particular to a method for preparing a hydrophobic nano-modified resin composite coating for LED substrates. Background technique [0002] The LED substrate is a bridge connecting the LED and the heat dissipation mechanism, and is the main channel through which heat is transferred from the chip to the outside world. Therefore, it is very important for the safe operation of the LED. Since the circuit wires of the LED are directly wired on the substrate, the thermal conductivity and insulation of the substrate are affected. Sexual demands are high. At the same time, since the LED circuit is directly wired on the substrate, when the surrounding air is humid, the substrate is easy to absorb water vapor, causing short circuits and other phenomena in the circuit. Traditional LED substrate materials are generally made of a pure aluminum substrate coated with a layer of resin insulating layer. In a typical LED s...

AI Technical Summary

Problems solved by technology

The resin insulation layer has high coating and adhesion on the aluminum plate, but most of the aluminum substrate resin insulation layer has little or no thermal conductivity, which prevents heat from being conducted from the LED to the heat sink (metal Substrate), unable to achieve the smooth flow of the entire heat dissipation channel

In this way, the heat accumulation of the LED will quickly cause the LED to fail

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