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Manufacturing method of composite tungsten oxide nanoparticle, infrared absorbing material and infrared shielding body

A manufacturing method and nanoparticle technology, applied in radiation-absorbing coatings, tungsten oxide/tungsten hydroxide, nanotechnology, etc., can solve the problems of high cost and low production efficiency

Inactive Publication Date: 2015-08-12
KAMIKAWA PHOTONICS & MATERIALS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

This method equipment has the defects of high cost and low production efficiency

Method used

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  • Manufacturing method of composite tungsten oxide nanoparticle, infrared absorbing material and infrared shielding body
  • Manufacturing method of composite tungsten oxide nanoparticle, infrared absorbing material and infrared shielding body
  • Manufacturing method of composite tungsten oxide nanoparticle, infrared absorbing material and infrared shielding body

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preparation example Construction

[0035] Further, the present invention also proposes an infrared shielding body, which is made by mixing a nano-slurry formed by mixing the above-mentioned infrared absorbing material and a dispersant with a resin. In this embodiment, the preparation method of the infrared shielding body may include the following steps: First, mix the above-mentioned external ray absorbing material and a dispersant in an appropriate solvent, wherein the dispersant can be polymeric acidic, polymeric basic or A polymer neutral dispersant; then, apply wet pulverization to the mixture obtained in the previous step to form a nano-slurry; afterward, mix the nano-slurry with a media resin, and apply it to a substrate For the surface, the medium resin can be used alone or in combination with thermosetting resins, ultraviolet curing resins, electron beam curing resins, room temperature curing resins, thermoplastic resins, etc.

[0036] In order to enable those skilled in the art to easily understand the...

experiment example 1

[0037] Experimental Example 1: Directly dissolve tungsten hexachloride, cesium hydroxide, and potassium hydroxide in aqueous ethanol solution, and add an appropriate amount of water dropwise until precipitation occurs. Its chemical reaction formula is as follows:

[0038] wCl 6 +H 2 O+CsOH+KOH→WOCl 4 +K + +Cs + +HCl+H 2 o

[0039] WOCl 4 +Cs + +K + +HCl→WO 3 (↓)+Cs + +K + +6HCl

[0040] Then use supergravity to separate most of the solution from the precipitate to obtain a muddy precipitate (gel) and then use a vacuum oven to extract the solvent into a dry powder, place the dried cesium tungsten oxychloride powder in a high-temperature furnace, and A certain proportion of inert gas and hydrogen gas can reduce the composite potassium cesium tungsten oxychloride to potassium cesium tungsten oxide. The process conditions are as follows: in a high-temperature furnace, the temperature is raised from room temperature to 580° C. at a rate of 3-5° C. per minute, and sinter...

Embodiment 2

[0043] Example 2: directly dissolve tungsten hexachloride, cesium hydroxide, and rubidium hydroxide in an aqueous ethanol solution, and add an appropriate amount of water in a dropwise manner until precipitation occurs. Its chemical reaction formula is as follows:

[0044] wCl 6 +H 2 O+CsOH+RbOH→WOCl 4 +Rb + +Cs + +HCl

[0045] WOCl 4 +Cs + +Rb + +HCl→WO 3 (↓)+Cs + +Rb + +6HCl

[0046] Then, use supergravity to separate most of the solution from the precipitate, obtain the muddy precipitate, and then use a vacuum oven to extract the solvent into a dry powder, place the dry cesium tungsten oxychloride powder in a high-temperature furnace, and gas and hydrogen to reduce the complex potassium cesium tungsten oxychloride to potassium cesium tungsten oxide. The process conditions are as follows: in a high-temperature furnace, the temperature is raised from room temperature to 580° C. at a rate of 3-5° C. per minute, and sintered at a constant temperature of 580° C. for...

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Abstract

A method of manufacturing a composite tungsten oxide nanoparticles, and infrared-shielding infrared absorbing material body, the use of the infrared-absorbing material comprises a composite tungsten oxide nanoparticles are manufactured by sol-gel method, the manufacturing method for the first reaction in the sol-gel process the proportion of the desired composite element directly added to the solution and allowed rapid precipitation, drying and then heat-treated after special atmosphere to obtain a composite tungsten oxide nanoparticle material, or the general formula M1xM2yWO M1xM2yWORz or M1xWORySz, wherein M1 is IA - Group IIIA or a transition metal element, M2 of Group IA - IIIA or a transition metal elements, W is tungsten, O is oxygen, R, S of IVA - VIIA elements, specifically, R, S may be in sol-gel when you import or atmosphere heat treatment during synthesis. This material is used in the field of infrared-absorbing material, and thus the production method can improve the tungsten oxide nanoparticles molecular absorption wavelength greater than 1200nm infrared.

Description

technical field [0001] The invention relates to an infrared absorbing material particle and a manufacturing method thereof, and in particular to a manufacturing method of a composite tungsten oxide nano particle, an infrared absorbing material and an infrared shielding body. Background technique [0002] By the way, in addition to visible rays, the sunlight incident from the windows or doors of various buildings and vehicles also includes ultraviolet rays and infrared rays. Among them, near-infrared rays with a wavelength between 800 and 2500 are also called heat rays, which cause the indoor temperature to rise. the main reason. [0003] In order to prevent this from happening, in recent years, a shield that can sufficiently absorb visible light and block infrared rays has been actively developed in order to suppress the rise in indoor temperature while maintaining brightness. For example, early infrared blocking glass was mainly coated with metal oxides or metals such as s...

Claims

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Application Information

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IPC IPC(8): C01G41/02C09D7/12C09D5/32B82Y30/00
Inventor 沈铭基杨英家杨政祐沈璧中
Owner KAMIKAWA PHOTONICS & MATERIALS
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