Teflon-based low-heat resistance heat radiation material for LED light source and preparation method thereof

Abstract

The invention relates to a LED heat radiation material and especially relates to a Teflon-based low-heat resistance heat radiation material for a LED light source and a preparation method thereof. The Teflon-based low-heat resistance heat radiation material is prepared from 2-3 parts by weight of pottery sand micro-powder of 400-600 meshes, 0.1-0.2 parts by weight of copper oxide nanometer line, 4-6 parts by weight of expanded graphite, 1-2 parts by weight of aluminum metaphosphate, 30-40 parts by weight of an ethanol aqueous solution with content of 5%, 3-5 parts by weight of nanometer alumina sol with solid content of 20-25%, 1-2 parts by weight of sodium humate, 3-5 parts by weight of sodium silicate, 20-25 parts by weight of aluminum nitride micro-powder of 400-600 meshes, 40-50 parts by weight of Teflon micro-powder of 200-300 meshes and 2-3 parts by weight of an assistant. The LED heat radiation material has the advantages of high efficiency, uniform and stable thermal conductivity, environment corrosion resistance, light aging resistance, cleanliness, stain resistance, safety, insulation and cutting easiness and is an ideal LED lamp heat radiation material.

Description

technical field [0001] The invention relates to an LED heat dissipation material, in particular to a polytetrafluoroethylene-based heat dissipation material with low thermal resistance for an LED light source, a preparation method and a production method thereof. Background technique [0002] LED is the abbreviation of light-emitting diode. It is a semiconductor electronic component that converts electrical energy into light energy. It has the advantages of small size, long life, low power consumption, fast response, high luminous efficiency, energy saving and environmental protection. It is recognized in the industry As the most competitive product to replace traditional light sources, it has also been widely used in real life. There are still many problems in current LED products, among which heat dissipation has always been the top priority. Common heat dissipation materials are mostly high thermal conductivity metals. , high thermal conductivity inorganic materials, and ...

AI Technical Summary

Problems solved by technology

[0002] LED is the abbreviation of light-emitting diode. It is a semiconductor electronic component that converts electrical energy into light energy. It has the advantages of small size, long life, low power consumption, fast response, high luminous efficiency, energy saving and environmental protection. It is recognized in the industry As the most competitive product to replace traditional light sources, it has also been widely used in real life. There are still many problems in current LED products, among which heat dissipation has always been the top priority. Common heat dissipation materials are mostly high thermal conductivity metals. , high thermal conductivity inorganic materials, and these materials are compounded and sintered. These materials have disadvantages such as difficult cutting and forming, high cost, and easy to be corroded by the environment. Excellent heat dissipation effect, and can improve the environmental adaptability of the material to achieve efficient and stable performance