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Ultra-low loss high temperature resistant low intermodulation cable and its preparation process

A high temperature resistant and cable technology, applied in the direction of cable/conductor manufacturing, insulated cables, cables, etc., can solve the problems of increased cable loss, large loss, discount, etc., and achieve the effect of improving shielding, reducing loss, and good conductivity

Active Publication Date: 2016-05-11
JIANGSU HENGXIN TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] High-temperature cables are high-performance cables made of special materials, which are widely used in the field of communication, especially in 4G antennas, but the characteristics and processing technology of PTFE materials (solid core push, no foaming) lead to the The overall loss is large
For this reason, in the prior art, in order to achieve higher shielding performance, the weaving density has reached more than 99.5%, and it needs to be immersed in tin to ensure the stability of the structure, but there are still small holes that cause signal leakage; in addition, the conductivity of tin The electrical conductivity is worse than that of bare copper, resulting in a greatly increased cable loss; due to the fineness of the cable, the conventional longitudinal wrapping mold cannot achieve flat and tight wrapping, and there are quality problems such as discounting and turning over the tape

Method used

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  • Ultra-low loss high temperature resistant low intermodulation cable and its preparation process
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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0016] Example 1 About Copper Foil Longitudinal Clad

[0017] In this embodiment, the copper foil used for the copper foil longitudinal cladding has been passivated, which not only provides excellent corrosion resistance, but also has a good anti-tarnish effect, can maintain the metallic luster of copper, and does not affect Subsequent hot dip tin process.

[0018] In this embodiment, the passivation solution used is composed of 0.05-0.30wt% benzotriazole, 0.05-0.15wt% hydroxysuccinimide, 0.10-0.20wt% oxalic acid, and the balance water composition. The passivation treatment temperature is 60-80° C., and the treatment time is 4-20 seconds. Table 1 gives several non-limiting specific examples and comparative examples.

[0019] Table 1

[0020]

[0021] In Table 1, the passivation treatment temperature is 65° C., and the treatment time is 10 seconds. Among them, " / " means that this component is not added, and EDTA means ethylenediaminetetraacetic acid.

[0022] Place t...

Embodiment 2

[0025] Example 2 About Hot Dip Tin Plating

[0026] Conventional immersion tin usually uses pure tin or tin-lead alloy. However, the pure tin immersion coating has poor corrosion resistance at high temperatures, and its adhesion to copper becomes poor at sub-zero low temperatures, and it is prone to peeling off and even powdering. For environmental reasons, the use of lead is restricted or even banned. In this embodiment, adding a small amount of Ge and Ni to tin can not only prevent powdering or coating peeling at low temperature, but also improve the uniformity of the coating, and also improve its high temperature resistance. Specifically, hot-dip tin is operated in a tin-dipping furnace. In order to prevent oxidation, it is carried out under nitrogen conditions. The hot-dip plating temperature is controlled at 280-285°C; the hot-dip plating bath is: 0.05-0.50wt% Ge , 0.15-0.50wt% Ni, and the remainder Sn; the thickness of the tin plating layer is 10 μm.

Embodiment 3

[0028] In the present invention, a halogen-free insulating sheath is used to ensure its stability and durability under high and low temperature conditions. The invention adopts ABS resin modified polyethylene sheath. The raw material composition of the sheath in this embodiment is: 8.0-10.0wt% ABS resin, 3.0-5.0wt% Et-MAH-acrylic resin, 2.5-3.5wt% styrene-butadiene-mass Anhydride copolymer, 12-15wt% calcium carbonate, 2.0-2.5wt% antimony trioxide, 1.0-1.5wt% magnesium oxide, 0.5-1.0wt% acetoxysilane, 0.5-1.0wt% Triallyl isocyanurate, 1.5-2.0 wt% of lubricant, 0.10-0.30 wt% of antioxidant, and the balance of high-density polyethylene. In this embodiment, by adding a small amount of triallyl isocyanurate and acetoxysilane, the compatibility of polyethylene and ABS is ensured, and good mechanical properties and high and low temperature resistance properties are endowed to it. Put the above components into the mixer according to the ratio and mix them evenly, and then send the m...

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Abstract

The invention relates to an ultralow-loss low-intermodulation cable with high temperature resistance, and belongs to the technical field of coaxial cables. The cable is in a coaxial structure, and the cable is sequentially provided with an internal conductor, an insulating layer, a copper foil longitudinal wrapping layer, a copper braiding layer, a tinned layer and a sheath layer from the inside to the outside. The cable employs naked copper strips to achieve longitudinal wrapping, so the cable not only is good in corrosion resistance, but also improves the shielding performance. The cable can maintain a good conductivity of naked copper, and greatly reduces the loss.

Description

technical field [0001] The invention relates to the technical field of coaxial cables, more specifically, the invention relates to an ultra-low loss high temperature resistant low intermodulation cable and a preparation process thereof. Background technique [0002] High-temperature cables are high-performance cables made of special materials, which are widely used in the field of communication, especially in 4G antennas, but the characteristics and processing technology of PTFE materials (solid core push, no foaming) lead to the The overall loss is large. For this reason, in the prior art, in order to achieve higher shielding performance, the weaving density has reached more than 99.5%, and it needs to be immersed in tin to ensure the stability of the structure, but there are still small holes that cause signal leakage; in addition, the conductivity of tin The electrical conductivity is worse than that of bare copper, which leads to a great increase in cable loss; due to t...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01B7/29H01B7/17H01B7/28H01B13/00H01B13/26
Inventor 陈永健沈江华刘中华潘照红范伟聪
Owner JIANGSU HENGXIN TECH CO LTD
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