Compensation doping stopping impurity belt terahertz detector chip and preparation method thereof
A terahertz detector and impurity blocking technology, applied in semiconductor devices, final product manufacturing, sustainable manufacturing/processing, etc., can solve the problems of low resistivity of the barrier layer and large dark current, so as to reduce dark current and improve resistance rate, and the effect of improving sensitivity
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Embodiment 1
[0037] The structure of the compensated doping barrier impurity band terahertz detector provided by the present invention is as follows: figure 1 and figure 2 As shown, the high-conductivity Si substrate 1 used in the detector of this embodiment is doped with P, and the doping concentration is 5×10 19 cm -3 , with a thickness of 450 μm; a silicon-doped phosphorus absorber layer 2 is grown on a high-conductivity Si substrate 1 by chemical vapor deposition, and the doping ion is P, and the doping concentration is 6×10 17 cm -3 , with a thickness of 20 μm; a high-resistivity barrier layer 3 was epitaxially grown on the absorber layer 2 by doping B ions with a doping concentration of 6.5×10 14 cm -3 , with a thickness of 6 μm; then, the barrier layer 3 is implanted with P ions using an ion implantation process, the implantation energy is 30keV, and the implantation dose is 3×10 14 cm -2 The implanted ions are activated by a rapid thermal annealing process to repair the impl...
Embodiment 2
[0039] The manufacturing method of the compensating doping and blocking impurity band terahertz detector provided by the present invention comprises the following steps:
[0040] 1. Substrate material cleaning: Clean the high-conductivity Si substrate with carbon tetrachloride, acetone, MOS grade ethanol, and deionized water in sequence, and dry it with nitrogen;
[0041] 2. Epitaxial growth absorbing layer: grow absorbing Si:P absorbing layer 2 on high conductivity Si substrate 1 by chemical vapor deposition process, doped ion P, doping concentration 6×10 17 cm -3 , thickness 20μm; (see Figure 4 );
[0042] 3. Compensatory doping growth barrier layer: On the absorber layer 2, a high-resistivity barrier layer 3 is epitaxially grown by a compensatory doping process, and the doping ion B is compensated, and the doping concentration is 6.5×10 14 cm -3 , with a thickness of 6 μm (see Figure 5 );
[0043] 4. The first photolithography: cast a positive resist on the surface ...
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