Nickel-plated copper material and preparation method and application thereof
A nickel-plated copper and nickel-plated technology, which is applied to electrical components, circuits, battery pack components, etc., can solve the problems that cannot meet the requirements of high-rate lithium-ion battery negative electrode tabs, reduce the corrosion resistance of materials, and have no clear indications, etc. , to achieve the effective recovery of metal ion concentration, enhance the bonding strength, and improve the corrosion resistance of electrolyte
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[0068] Example 1
[0069] The preparation method of nickel-plated copper material of the present invention is used for high-rate lithium-ion battery tab material. Semi-hard pure copper is used as the base material. The low-current electrodeposition thickness is 0.4 μm on both sides of the substrate. The grain size is 50-100 nm. The dark nickel coating is then electro-deposited on the dark nickel coating with a thickness of 1.4μm and a high solderability nickel coating with a grain size of 0.4~1.0μm. Finally, the material is heat treated in a reducing atmosphere at 550°C for 2h and removed at 200°C for 4h. Hydrogen heat treatment process to form a 0.3μm copper-nickel alloy layer.
Example Embodiment
[0070] The specific implementation includes the following steps:
[0071] (1) Pre-treatment: The pure copper strip is subjected to ultrasonic degreasing, electric degreasing and activation treatment. The ultrasonic degreasing temperature is 45℃, the ultrasonic frequency is 20kHz, the degreasing time is 1min, the degreasing liquid formula is sodium carbonate 30g / L, trisodium phosphate 20g / L, and sodium hydroxide 30g / L. Electrolytic oil temperature is 55℃, current density is 5A / dm 2 , Degreasing time 1.5min, degreasing formula sodium carbonate 30g / L, trisodium phosphate 20g / L, sodium hydroxide 30g / L. The sulfuric acid concentration of the activation treatment is 8%, the solution temperature is 25°C, and the treatment is about 1 min.
[0072] (2) Electrodeposited nickel coating: including electrodeposited dark nickel layer and electroplated high solderability nickel coating. The dark nickel solution formula is nickel sulfate 300g / L, nickel chloride 40g / L, boric acid 40g / L, the bath ...
Example Embodiment
[0084] Example 2
[0085] The preparation method of nickel-plated copper material of the present invention is used for high-rate lithium-ion battery tab materials, using soft pure copper as the base material, and low-current electrodeposition on both sides of the substrate with a thickness of 0.2 μm and a grain size of 50-100 nm Dark nickel plating, and then electrodepositing a high solderability nickel plating with a thickness of 1μm and a grain size of 0.4~1.0μm on the dark nickel layer. Finally, the material is subjected to 2.5h 650℃ reducing atmosphere heat treatment and 260℃4h to remove hydrogen Heat treatment process to form a 0.5μm copper-nickel alloy layer.
[0086] The specific implementation includes the following steps:
[0087] (1) Pre-treatment: The pure copper strip is subjected to ultrasonic degreasing, electric degreasing and activation treatment. The ultrasonic degreasing temperature is 50℃, the ultrasonic frequency is 30kHz, the degreasing time is 1min, the degrea...
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