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Plasma-Assisted Microstructure Alignment and Prebonding Method for Glass or Quartz Chips

A plasma and pre-bonding technology, applied in the fields of glass or quartz chip microstructure alignment and pre-bonding, chip micromachining and bonding, can solve the problems of reducing the success rate, increasing the difficulty of the alignment process, etc. It is very easy to fit, realize the full utilization of resources, and avoid the effect of financial loss.

Active Publication Date: 2017-12-08
BEIJING UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the substrate and cover sheet cleaned by Piranha solution are very easy to fit, which increases the difficulty of the alignment process and reduces the success rate

Method used

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  • Plasma-Assisted Microstructure Alignment and Prebonding Method for Glass or Quartz Chips
  • Plasma-Assisted Microstructure Alignment and Prebonding Method for Glass or Quartz Chips
  • Plasma-Assisted Microstructure Alignment and Prebonding Method for Glass or Quartz Chips

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0030] S1 Plasma Assisted Microstructure Alignment and Pre-bonding of Sodium Glass Substrate Chips:

[0031] 1) After wet etching, first use acetone to dissolve the photoresist on the surface of the 2.3mm thick sodium glass substrate, then use isopropanol to wash away the excess acetone, and after fully cleaning with a large amount of water, put the glass substrate into the Complete chromium removal is carried out in the chromium removal solution composed of ammonium cerium nitrate, acetic acid and ultrapure water.

[0032] 2) Fully clean the soda glass substrate and cover slip treated in step 1) with detergent, and use a large amount of ultrapure water to clean to remove organic matter, solid particles and dust on the surface.

[0033] 3) After drying most of the water with a high-pressure air gun, use air to stimulate plasma, and perform surface cleaning and activation in a plasma cleaner for 3-10 minutes to form a highly hydrophilic surface. The instrument used is a plasma...

Embodiment 2

[0043] S1 Plasma-assisted microstructure alignment and pre-bonding of boron glass chips:

[0044] 1) After wet etching, use acetone to dissolve the photoresist on the surface of the boron glass substrate with a thickness of 1.1 mm, then use isopropanol to wash away excess acetone, and after fully cleaning with a large amount of water, put the boron glass substrate into Complete chromium removal is carried out in a chromium removal solution composed of cerium ammonium nitrate, acetic acid and ultrapure water.

[0045] 2) Fully clean the boron glass substrate and cover sheet treated in step 1) with detergent, and use a large amount of ultrapure water to clean and remove organic matter, solid particles and dust on the surface.

[0046] 3) After drying most of the water with a high-pressure air gun, use air to stimulate plasma, and perform surface cleaning and activation in a plasma cleaner for 3-10 minutes to form a highly hydrophilic surface. The instrument used is a plasma cle...

Embodiment 3

[0055] S1 Plasma Assisted Microstructure Alignment and Pre-bonding of Quartz Chips:

[0056] 1) After wet etching, first use acetone to dissolve the photoresist on the surface of the 1.1mm thick quartz substrate, then use isopropanol to wash away the excess acetone, and after fully cleaning with a large amount of water, put the quartz substrate into the nitric acid The chromium removal is completely carried out in the chromium removal solution composed of ammonium cerium, acetic acid and ultrapure water.

[0057] 2) Fully clean the quartz substrate and cover sheet treated in step 1) with detergent, and use a large amount of ultrapure water to clean and remove organic matter, solid particles and dust on the surface.

[0058] 3) After drying most of the water with a high-pressure air gun, use air to stimulate plasma, and perform surface cleaning and activation in a plasma cleaner for 3-10 minutes to form a highly hydrophilic surface. The instrument used is a plasma cleaner prod...

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Abstract

The invention relates to a plasma-assisted microstructure alignment and pre-bonding method of a glass or quartz chip, which belongs to chip microprocessing and bonding technology. The steps are as follows: completely remove the photoresist layer and chrome layer of the glass or quartz chip, and use detergent and a large amount of ultrapure water to fully clean the surface. Use a plasma cleaner to clean and activate the surface to make the surface highly hydrophilic; under anhydrous conditions, use a microscope to observe and move the cleaned substrate and cover to complete precise alignment. Drop a very small amount of ultra-pure water into the edge gap for bonding, and after fully applying pressure to squeeze out excess water, rely on the vacuum function of the plasma cleaner to discharge all the water in the chip to complete the microstructure alignment and pre-treatment of glass or quartz chips. Bond. The permanent bonding of the chip is further completed by thermal bonding. This method enables alignment and pre-bonding, and the overall operation time can be completed within 30 minutes. Fast and efficient, easy to implement, safe to operate, and widely applicable.

Description

technical field [0001] The invention relates to a glass or quartz chip microstructure alignment and pre-bonding method, which can realize simple and fast pre-bonding of chips, avoid the use of some dangerous cleaning reagents, and further significantly increase the thermal bonding of glass or quartz chips The success rate is achieved, and the chip can be permanently bonded, and the chip can be used for chemical analysis, biological analysis, etc. It belongs to chip micromachining and bonding technology. Background technique [0002] In the 1990s, Manz and Widmer proposed a micro-total analysis system or lab-on-a-chip. Due to its high analysis efficiency, low reagent consumption, miniaturization and integration of analysis devices, and high-throughput analysis of various substances, it has become a One of the research hotspots in the field of analytical chemistry. Commonly used materials for making chips include glass, quartz, and high molecular polymers. Among them, glass...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/60H01L21/68
CPCH01L21/68H01L21/682H01L24/03H01L24/04H01L2221/67B81C2203/051B81C3/001B81C1/00928B81C3/002B81C2201/0102B81C2201/0128B81C2201/0133B81C2201/019H01L21/67028
Inventor 郭广生王思雨蒲巧生汪夏燕
Owner BEIJING UNIV OF TECH