Flame-retardant microcapsule as well as preparation method and application thereof

A microcapsule and flame-retardant technology, applied in the direction of microcapsule preparation, microsphere preparation, adhesive additives, etc., can solve the problems of reducing the physical and mechanical properties of materials, affecting the life of electronic components, and reducing the adhesion of potting adhesives, etc., to achieve Good coating effect, low saturated vapor pressure, good thermoplasticity and thermal stability

Inactive Publication Date: 2016-01-06
浙江中天东方氟硅材料股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

The metal hydroxide flame retardant itself has the advantages of good stability, low smoke generation, no toxic gas, abundant sources, and low price. However, the compatibility of metal hydroxide flame retardants with polymer organic materials is poor. It is easy to absorb moisture and agglomerate, and has poor dispersibility. When it is added in a large amount during use, it will

Method used

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  • Flame-retardant microcapsule as well as preparation method and application thereof

Examples

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Effect test

Embodiment 1

[0028] A flame-retardant microcapsule, whose core material is liquid heptafluoropropane, and whose cladding layer is polymethyl methacrylate polymer. Its preparation method is as follows:

[0029] a, 600g gaseous heptafluoropropane is passed into the pressurized reactor at room temperature, and the pressurized pressure is controlled to 4Mpa, so that heptafluoropropane is converted into a liquid state;

[0030] b. Add 300g of water, 150g of polyvinyl alcohol solution with a mass fraction of 1%, and 8g of sodium dodecylsulfonate to the liquid heptafluoropropane in the pressurized reactor, stir and heat to 50°C to 55°C;

[0031] c. Add 0.6g initiator BPO to 100g methyl methacrylate to dissolve, then slowly drop into the reaction solution of step b; after the dropwise addition, adjust the stirring speed to 200rmp / min, after constant stirring speed, control the suspension polymerization reaction The temperature is 78±2°C, and the polymerization reaction time is 2 hours; then absor...

Embodiment 2

[0034] A flame-retardant microcapsule, whose core material is liquid hexafluoropropane, and whose cladding layer is polymethyl methacrylate polymer. Its preparation method is as follows:

[0035] a. Pass 800g of gaseous hexafluoropropane into the pressurized reactor at room temperature, and control the pressurized pressure to 5Mpa to make heptafluoropropane into liquid state;

[0036] b. Add 400g of water, 160g of polyvinyl alcohol solution with a mass fraction of 1%, and 9g of OP-10 emulsifier to the liquid hexafluoropropane in the pressurized reactor, stir and heat to 50°C-55°C;

[0037] c. Add 0.8g of initiator BPO to 100g of methyl methacrylate to dissolve, then slowly drop into the reaction solution of step b; after the dropwise addition, adjust the stirring speed to 200rmp / min, after constant stirring speed, control the suspension polymerization reaction The temperature is 78±2°C, and the polymerization reaction time is 2 hours; then absorb a small amount of beads, hard...

Embodiment 3

[0040]A flame retardant microcapsule, the core material is liquid heptafluoropropane, and the coating layer is polymethacrylic acid polymer. Its preparation method is as follows:

[0041] a, 700g gaseous heptafluoropropane is passed into the pressurized reactor at room temperature, and the pressurized pressure is controlled to 5Mpa, so that heptafluoropropane is converted into a liquid state;

[0042] b. Add 500 g of water, 180 g of polyvinyl alcohol solution with a mass fraction of 1%, and 8 g of sodium lauryl sulfate into the liquid hexafluoropropane in the pressurized reactor, stir and heat to 60°C to 65°C;

[0043] c, 0.6g of initiator azobisisobutyronitrile is added to dissolve in 100g of methacrylic acid, and then slowly dripped into the reaction solution of step b; Suspension polymerization reaction temperature 85±2℃, polymerization reaction time 3h; then absorb a small amount of beads, harden after cooling, confirm the end of the reaction; stop stirring, end the react...

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Abstract

The invention discloses a flame-retardant microcapsule as well as a preparation method and application thereof. The flame-retardant microcapsule comprises a core material and a coating layer coating at the outer side of the core material, wherein the core material is liquid heptafluoropropane or liquid hexafluoropropane; and the coating layer is a polymethacrylate polymer and is prepared by polymerization by virtue of a suspension polymerization method. The flame-retardant microcapsule can be used as a flame-retardant filler singly, and also can be used as a flame-retardant filler together with magnesium hydroxide/aluminum hydroxide for preparing an electronic-pouring sealant in combination. The flame-retardant microcapsule disclosed by the invention is high in thermal stability and good in penetration resistance, and cannot generate leakage of the core material in a normal state; and only when subjected to high-temperature combustion, the coating layer is softened and the liquid core material is vaporized at the same time so that the internal pressure is increased and results in expansion breakage of the coating layer, and then the core material is released at last to quickly retard inflaming and put out a fire, so that the flame-retardant microcapsule has a broad use prospect in the field of preparation of the electronic-pouring sealant.

Description

technical field [0001] The invention relates to a flame-retardant microcapsule, in particular to a flame-retardant microcapsule suitable for the field of electronic potting glue, a preparation method and application thereof. Background technique [0002] Polymer materials, such as plastics, coatings, fibers, and rubber, generally have a low oxygen index and are flammable materials that are prone to fire safety hazards. Therefore, it is often necessary to consider adding flame retardants to polymer materials to improve their flame retardancy. With the development of the electronics industry, electronic components tend to be more dense and miniaturized, and the substantial increase in the power of electronic equipment also puts forward higher requirements for the flame retardant performance of potting compounds. At present, the flame-retardant and heat-conducting potting compound is usually prepared by adding flame-retardant fillers. [0003] According to whether it contains ...

Claims

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Application Information

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IPC IPC(8): C08F120/14C08F2/20C08F2/44B01J13/14C09J11/06
Inventor 邵向东杨庆红祝爱娟席先锋王文斌吉兰平
Owner 浙江中天东方氟硅材料股份有限公司
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