High-toughness low expansion coefficient aluminum nitride-silicon carbide composite circuit board substrate material and preparation method thereof

Abstract

The invention discloses a high-toughness low expansion coefficient aluminum nitride-silicon carbide composite circuit board substrate material, which mixes aluminum nitride and silicon carbide powder to use, has high thermal conductivity and safety, has lower surface tension compared with traditional organic solvents by adopting quaternary ammonium salt Ionic liquids, absolute ethyl alcohol and hexylene glycol to prepare a composite solvent, is better in wettability to power, enables composite alcohol base flow slurries to have less bubble, tightly and uniformly mixes materials, is excellent in mobility and easy to mold, enables debonding and sintering stability of prepared green bodies to be better, is obvious in toughening reinforcing effect of added nanometer zirconia, enables sintering activity of prepared materials to be high by being bonded with sintering aids and other materials, is detailed and compact in structure, less in content of harmful impurities and high in thermal efficiency, and can be widely used for various circuit board substrates.

Description

technical field [0001] The invention relates to the technical field of ceramic substrate materials for circuit boards, in particular to an aluminum nitride-silicon carbide composite circuit board substrate material with high toughness and low expansion coefficient and a preparation method thereof. Background technique [0002] As the power and density of electronic components increase, the calorific value per unit volume also increases, and the requirements for the comprehensive performance of circuit substrates are getting higher and higher. Among them, ceramic substrates have good comprehensive performance in terms of insulation, thermal conductivity and Thermal expansion, chemical stability and other aspects are outstanding, and are gradually widely used in substrate materials. Among them, aluminum oxide and beryllium oxide are mainly used as substrate materials for a long time. However, these two materials have low thermal conductivity and are toxic. And other defects, t...

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Problems solved by technology

[0003] Although the application prospects of aluminum nitride and silicon carbide ceramic substrates are broad, in the actual production process, there are relatively expensive raw materials, low high-temperature sintering density, cumbersome production process, low raw material utilization rate, and unsatisfactory actual thermal conductivity, etc. The problem restricts the large-scale use of this kind of material, and it is urgent to make further improvements in raw material preparation and production technology.