Modified silicon oxide resin grinding wheel and preparing method thereof

A resin grinding wheel and silicon oxide technology, applied in the field of grinding wheels, can solve the problems of high brittleness of pure phenolic resin, affecting the performance of friction materials, insufficient heat resistance, etc., and achieve the effects of less volatile substances, improving comprehensive performance and reducing porosity.

Inactive Publication Date: 2016-03-09
WUHU HONGKUN AUTO PARTS
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AI Technical Summary

Problems solved by technology

However, pure phenolic resin has defects such as high brittleness, poor toughness, high hardness, insufficient heat resistance, low strength, and high noise during use, which greatly affect the performance of friction materials. Therefore, modifying phenolic resin is to improve its comprehensive performance. effective method

Method used

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Embodiment Construction

[0024] A modified silicon oxide resin emery wheel, which is made up of the following raw materials in parts by weight:

[0025] 25wt% ammonia water 0.2, sp800.1, CBN abrasive 570, phenol 90, 35% formaldehyde solution 96, boric acid 5, hexamethylenetetramine 2, aniline 13, tributyl citrate 4, styrene 10, divinyl Benzene 0.3, methacrylic acid 0.8, potassium persulfate 0.2, tetraethyl orthosilicate 60.

[0026] A kind of preparation method of described modified silica resin emery wheel, comprises the following steps:

[0027] (1) Add the above potassium persulfate to 10 times of water and stir evenly;

[0028] (2) Mix the above-mentioned styrene, divinylbenzene, and methacrylic acid, add them to 4 times the weight of distilled water, stir evenly, put them into an oil bath at 106°C, heat to boiling, keep boiling for 3 minutes, add the above Potassium persulfate solution was stirred and reacted for 120 minutes to obtain polystyrene latex;

[0029] (3) Add the above sp80 to 20 ti...

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Abstract

The invention discloses a modified silicon oxide resin grinding wheel. The modified silicon oxide resin grinding wheel comprises, by weight, 0.2-0.35 part of 25-28 weight percent of ammonium hydroxide, 0.1-0.2 part of sp800, 570-600 parts of CBN abrasive, 90-100 parts of phenol, 96-110 parts of 35-40% of formaldehyde solution, 5-7 parts of boric acid, 2-6 parts of hexamethylenetetramine, 13-20 parts of aniline, 4-5 parts of tributyl citrate, 10-13 parts of styrene, 0.3-0.6 part of divinyl benzene, 0.8-2 parts of methacrylic acid, 0.2-0.3 part of potassium persulfate and 60-76 parts of tetraethoxysilane. According to the modified silicon oxide resin grinding wheel, the tetraethoxysilane is adopted as the precursor, polystyrene latex is used for modifying, and modified silicon oxide particles are obtained. The particles have very high strength and very high bonding strength, and the comprehensive performance of the finished grinding wheel is effectively improved.

Description

technical field [0001] The invention relates to the technical field of grinding wheels, in particular to a modified silicon oxide resin grinding wheel and a preparation method thereof. Background technique [0002] With the continuous improvement of the speed of automobiles and airplanes, the requirements for friction materials such as transmission and braking are more stringent, and the matrix, as an important part of friction materials, has always been the focus of development and research. Phenolic resin, epoxy resin, styrene-butadiene rubber and polytetrafluoroethylene can be used as the matrix of friction materials, but epoxy resin, styrene-butadiene rubber and polytetrafluoroethylene have poor wear resistance, heat resistance and Adhesive properties limit its application in friction materials. The advantages of phenolic resin in heat resistance, bonding performance, mechanical properties, molding performance and cost make it the most commonly used binder matrix materi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24D3/28B24D3/34B24D18/00C08G8/28
CPCB24D3/285B24D3/342B24D18/0009C08G8/28
Inventor 黄浩
Owner WUHU HONGKUN AUTO PARTS
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