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Thermosetting environment-friendly resin material used for sealing

A thermosetting, environmentally friendly resin technology, applied in the direction of electrical solid devices, semiconductor/solid device components, electrical components, etc., can solve the problems of high dielectric loss, low tensile strength, high weight loss rate, etc., and achieve good performance , good sealing effect, excellent comprehensive performance effect

Inactive Publication Date: 2016-11-02
黄宇
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The invention provides a heat-curable environmental protection resin material for sealing to solve the problems of the existing semiconductor chip sealing materials such as low dielectric constant, low tensile strength, high dielectric loss, and high weight loss rate.

Method used

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Examples

Experimental program
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Effect test

preparation example Construction

[0029] The preparation method of the thermosetting environment-friendly resin material for sealing comprises the following steps:

[0030] S1: Combine 2,2'-[(1-methylethylene)bis(4,1-phenylenecarbaldehyde)]dioxirane and methylene-bis(1,3-benzenediol) -Tetraglycidyl ether, tributoxyethyl phosphate, o-cresol novolac epoxy resin A, dioctyl phthalate, maleic anhydride grafted EPDM rubber, and polysiloxane are mixed at a temperature of Stir at 240-255°C for 6-8min at a rotational speed of 300-400r / min to obtain mixture A;

[0031] S2: Under nitrogen protection, add oleyl amino acid potassium, sodium silicate, paraffin, carbon fiber, polymaleimide, phthalic acid, silicon dioxide, N-2- (Aminoethyl)-3-aminopropylmethyldimethoxysilane coupling agent, modified polyacrylate compatibilizer, 2,2'-methylene-bis-(4-ethyl-6- tert-butylphenol), anhydrous gypsum stabilizer, DCP bridging agent, acrylate regulator, azobisisobutyric acid (ethylene glycol acrylate) ester initiator, di-tert-butylp...

Embodiment 1

[0036] A thermosetting environment-friendly resin material for sealing, which is made of the following raw materials by weight: 2,2'-[(1-methylethylene)bis(4,1-phenyleneformaldehyde)]bis 220 parts of ethylene oxide and methylene-bis(1,3-benzenediol)-tetraglycidyl ether, 65 parts of tributoxyethyl phosphate, 50 parts of o-cresol novolac epoxy resin A, phthalic acid Dioctyl ester 25 parts, maleic anhydride grafted EPDM rubber 42 parts, polysiloxane 27 parts, oleyl amino acid potassium 23 parts, sodium silicate 19 parts, paraffin wax 30 parts, carbon fiber 20 parts, polymalay 17 parts of imide, 20 parts of phthalic acid, 20 parts of silicon dioxide, 4 parts of N-2-(aminoethyl)-3-aminopropylmethyldimethoxysilane coupling agent, modified poly 4 parts of acrylate compatibilizer, 1.2 parts of 2,2'-methylene-bis-(4-ethyl-6-tert-butylphenol), 0.9 parts of anhydrite stabilizer, 0.9 parts of DCP bridging agent, 0.8 parts of acrylate regulator, 0.5 parts of 701 powder strengthening agent...

Embodiment 2

[0046] A thermosetting environment-friendly resin material for sealing, 2,2'-[(1-methylethylene)bis(4,1-phenylene formaldehyde)]dioxirane and ethylene oxide in units of weight 168 parts of methyl-bis(1,3-benzenediol)-tetraglycidyl ether, 54 parts of tributoxyethyl phosphate, 44 parts of o-cresol novolac epoxy resin A, 25 parts of dioctyl phthalate, Maleic anhydride grafted EPDM rubber 35 parts, polysiloxane 22 parts, oleyl amino acid potassium 20 parts, sodium silicate 16 parts, paraffin wax 26 parts, carbon fiber 14 parts, polymaleimide 15 parts, 14 parts of phthalic acid, 14 parts of silicon dioxide, 3 parts of N-2-(aminoethyl)-3-aminopropylmethyldimethoxysilane coupling agent, 3 parts of modified polyacrylate compatibilizer 2,2'-methylene-bis-(4-ethyl-6-tert-butylphenol) 0.8 parts, anhydrite stabilizer 0.6 parts, DCP bridging agent 0.6 parts, acrylate regulator 0.5 parts 0.4 parts, 0.4 parts of 701 powder strengthening agent, 0.4 parts of polyaluminum chloride coagulant, 0...

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Abstract

The invention discloses a thermosetting environment-friendly resin material used for sealing, which is prepared from the raw materials including: 2,2'-[(1-methylethylidene)bis(4,1-phenyleneformaldehyde)]dioxirane, methylene-bis(1,3-benzenediol)-tetraglycidyl ether, tributoxyethyl phosphate, o-cresol formaldehyde epoxy resin A, dioctyl phthalate, maleic anhydride grafted ethylene propylene diene monomer, polysiloxane, oil-based amino acid potassium, sodium silicate, paraffin, carbon fibers, polymaleimide, o-phenylenediacetic acid, silicon dioxide, and an additive. The resin material has excellent comprehensive performance, can be applied in the technical field of electronic components well, and has excellent sealing effect.

Description

technical field [0001] The invention belongs to the technical field of electronic components and the technical field of packaging material preparation, and in particular relates to a thermosetting environment-friendly resin material for sealing. Background technique [0002] Semiconductor packaging generally uses resin as packaging material to isolate semiconductor devices such as diodes, transistors, integrated circuits, large-scale integrated circuits, and ultra-large-scale integrated circuits from the external environment to protect semiconductor devices from damage caused by external forces or environmental factors. Since epoxy resin can provide excellent plasticity, adhesion, insulation properties, mechanical properties and waterproof properties compared with other thermosetting resins, epoxy resin is widely used as a packaging material for semiconductor devices. For example, US Patent No. 6,342,309 discloses an epoxy resin composition, which includes a novolac type epo...

Claims

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Application Information

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IPC IPC(8): C08L63/00C08L63/04C08L51/06C08L83/04C08L91/06C08L79/08C08L33/04C08K13/04C08K7/06C08K3/36C08K3/22C08K3/34H01L23/29
CPCC08L63/00C08L2203/206C08L2205/02C08L2205/035C08L2205/08C08L2205/16C08L2207/04H01L23/293C08L63/04C08L51/06C08L83/04C08L91/06C08L79/085C08L33/04C08K13/04C08K7/06C08K3/36C08K3/2279C08K3/346
Inventor 黄宇
Owner 黄宇
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