Method for preparing hollow alumina ball and silicon carbide reinforced copper base composite material

A technology of copper-based composite materials and hollow alumina, applied in ceramic products, applications, household appliances, etc., can solve the problems of high density, low mechanical strength, high thermal expansion coefficient, etc., and achieve improved mechanical strength, high strength, and increased volume fraction Effect

Active Publication Date: 2017-08-11
西安明科微电子材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide a preparation method of hollow alumina ball/silicon carbide reinforced copper matrix composite material, whi

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0031] first step,

[0032] Using hollow alumina balls with a ball diameter of 0.01-0.05mm to mix evenly with silicon carbide powder to obtain a mixed powder M1, wherein, in the mixed powder M1, the mass ratio of the silicon carbide is 20%;

[0033] Wherein, the silicon carbide powder is composed of a mixture of silicon carbide powders with particle sizes of 12um, 50um and 90um respectively;

[0034] In the second step, γ-alumina, bentonite, kaolin and Suzhou clay are added to the mixed powder M1 obtained in the first step to obtain a mixture M2, wherein the content of the mixed powder M1 in the obtained mixture is 90%, γ-alumina The content of the clay is 3%, the content of bentonite is 1%, the content of kaolin is 3% and the content of Suzhou soil is 3%;

[0035] The third step is to prepare a mixed solution M3 of sodium hydroxymethylpropyl cellulose, silicone oil, polyvinyl alcohol, cetyltrimethylammonium bromide and tributyl phosphate, and the concentration of the resulti...

Embodiment 2

[0041] Identical with embodiment 1 method, difference is:

[0042] In the first step, the hollow alumina ball with a ball diameter of 0.05-0.1 mm is uniformly mixed with silicon carbide powder to obtain a mixed powder M1, wherein, in the mixed powder M1, the mass ratio of the silicon carbide is 25 %;

[0043] Wherein, the silicon carbide powder is composed of a mixture of silicon carbide powders with particle sizes of 13um, 50um and 90um respectively;

[0044] The third step is to prepare a mixed solution M3 of sodium hydroxymethylpropyl cellulose, silicone oil, polyvinyl alcohol, cetyltrimethylammonium bromide and tributyl phosphate, and the concentration of the resulting mixed solution M3 is 1%; Wherein, the mass ratio of the sodium hydroxymethylpropyl cellulose, silicone oil, polyvinyl alcohol, cetyltrimethylammonium bromide and tributyl phosphate is 1:1:1:1:1;

[0045] In the fifth step, when preparing the green body M5, the pressure used is 35MPa;

Embodiment 3

[0047] The method is the same as in Example 1, the difference is:

[0048] In the first step, the hollow alumina balls with a ball diameter of 0.1-0.15 mm are uniformly mixed with silicon carbide powder to obtain a mixed powder M1, wherein, in the mixed powder M1, the mass ratio of the silicon carbide is 30 %;

[0049] Wherein, the silicon carbide powder is composed of a mixture of silicon carbide powders with particle sizes of 14um, 53um and 95um;

[0050] The third step is to prepare a mixed solution M3 of sodium hydroxymethylpropyl cellulose, silicone oil, polyvinyl alcohol, cetyltrimethylammonium bromide and tributyl phosphate, and the concentration of the resulting mixed solution M3 is 5%; Wherein, the mass ratio of the sodium hydroxymethylpropyl cellulose, silicone oil, polyvinyl alcohol, cetyltrimethylammonium bromide and tributyl phosphate is 1:1:1:1:1;

[0051] In the fifth step, when preparing the green body M5, the pressure used is 40MPa;

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Abstract

The invention provides a method for preparing a hollow alumina ball and silicon carbide reinforced copper base composite material. A hollow alumina ball and micron-sized silicon carbide different in size are adopted as reinforcing bodies, and on the premise that the mechanical property and low expansion coefficient are ensured, the overall density of the composite material is reduced. Since alumina ceramic used in the hollow alumina ball is high strength and the hollow alumina ball has a hollow structure, the hollow alumina ball is adopted so as to reduce the density of the overall composite material to the utmost extent, moreover, the wettability of alumina and copper is poor, after silicon carbon particles are added, the compound interface activation energy can be enhanced, and therefore the mechanical property of the composite material is more excellent. Through size matching of different particles, the volume fractions of the reinforcing bodies can be improved to the maximum, the mechanical strength of the composite material is thus improved, and the toughness of copper and the rigidity of the reinforcing bodies can be optimally matched.

Description

technical field [0001] The invention relates to a method for preparing a hollow alumina ball / silicon carbide composite reinforced copper-based composite material. Background technique [0002] High-strength and lightweight ultra-light materials have always been the focus of many weight-sensitive industries, and play an important role in applications such as aviation, aerospace, drones, high-speed trains, new energy vehicles, boats, robots, and exoskeletons. The invention mainly prepares a new-generation product of a new aluminum oxide / silicon carbide synergistically reinforced copper-based composite material. It is a special material designed for structural parts. It mainly refers to the combination of copper and hollow alumina balls / silicon carbide ceramics into a packaging material with low density, high strength and low expansion coefficient to solve the contradiction between high strength and light weight of structural parts. [0003] Studies have shown that different k...

Claims

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Application Information

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IPC IPC(8): C04B38/08C04B35/10C04B35/636C04B41/88
CPCC04B35/10C04B35/6365C04B38/009C04B38/08C04B41/5127C04B41/88C04B2235/349C04B2235/3826
Inventor 刘昌涛王云涛刘波波
Owner 西安明科微电子材料有限公司
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