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An easy-to-process diamond thermally conductive composite material and its preparation method and application

A technology of heat-conducting composite materials and composite materials, which is applied in the field of diamond heat-conducting composite materials and its preparation, can solve the problem of less attention to the performance uniformity of large-scale composite material samples, insufficient attention to the repeatability of high-heat-conduction composite materials, and composite materials. Less attention should be paid to issues such as machinability, so as to avoid rapid changes in heat conduction, ensure mechanical properties and heat conduction properties, and reduce processing costs

Active Publication Date: 2019-07-09
武汉速博酷新材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0011] The above-mentioned patents focus on improving the thermal conductivity, airtightness and other material properties of composite materials, while less attention is paid to the machinability of subsequent composite materials, and less attention is paid to the performance uniformity of large-size composite material samples. , and insufficient attention has been paid to the repeatability of the performance of high thermal conductivity composite samples

Method used

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  • An easy-to-process diamond thermally conductive composite material and its preparation method and application
  • An easy-to-process diamond thermally conductive composite material and its preparation method and application
  • An easy-to-process diamond thermally conductive composite material and its preparation method and application

Examples

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preparation example Construction

[0080] The invention provides a method for preparing an easy-to-process diamond heat-conducting composite material. Preferably, the method includes the following steps:

[0081] (1) Diamond particle surface coating treatment steps:

[0082] Silicon carbide and silicon boron coatings are grown on the surface of diamond particles to form a diamond-silicon carbide-silicon boron composite;

[0083] Preferably, the step (1) includes:

[0084] (1.1) According to the requirements of thermal conductivity, select diamonds of appropriate size and provide a mixture containing diamond particles, silicon powder, amorphous boron powder and calcium chloride;

[0085] (1.2) In vacuum, or in a reducing atmosphere of hydrogen, argon, or a combination thereof, or an inert atmosphere, heat the mixture in step (1.1) to form a diamond-silicon carbide-silicon boron composite.

[0086] In the above heating reaction, the heating reaction is preferably carried out at 1100~1350°C; the heating reaction...

Embodiment 1

[0106] Example 1 Preparation of diamond-copper composite material 1

[0107] 1.1 Pretreatment of diamond particles: 2mm*2mm*1.3mm flake single crystal diamond, calcium chloride powder, silicon powder with a particle size of 1~5μm, and amorphous boron powder in a mass ratio of 10:10:4 : 1 ingredient. Then mix the calcium chloride powder and the silicon powder, and mix the two evenly with a high-speed mixer, then add the weighed boron powder, and mix evenly with a high-speed mixer. Put the evenly mixed powder blend and diamond flakes in a graphite crucible, put them in a vacuum carbon tube furnace, evacuate, and carry out pressure -1 Pa, 1300°C high temperature treatment for 2 hours. After the carbon tube furnace cools down to room temperature, take out the blended powder, soak and rinse with hot water and ultrasonic treatment repeatedly to remove excess calcium chloride, and pass the blend through 80-mesh and 30-mesh sieves to remove excess calcium chloride. Silicon powder an...

Embodiment 2

[0109] Example 2 Diamond-copper composite material 2

[0110] Same as Example 1, the difference is that the diamond size is 3.0mm*3.0mm*1.5mm, four holes of 3.5mm*3.5mm*3mm are processed on the 10mm*10mm*4mm copper plate, and the distance between holes is 1mm .

[0111] The thermal conductivity of the composite material 2 obtained in Example 2 is 1286 W / m·K.

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Abstract

The invention relates to an easily processed diamond heat-conducting composite material and a preparation method and application thereof. The composite material comprises a metal plate substrate and diamond particles distributed inside and / or on the surface of the substrate, wherein part or all of the diamond particles are bonded on the metal substrate through a diamond surface silicon carbide-silicon boron composite coating. The preparation method is simple, and is very suitable for large-scale popularization. The composite material prepared by the method has ultrahigh thermal conductivity and good processing capability, and the composite material has good uniform performance and stability.

Description

technical field [0001] The invention belongs to the field of diamond technology, and in particular relates to an easy-to-process diamond heat-conducting composite material and a preparation method and application thereof. Background technique [0002] At present, the stable operation of high-power and high-heat flow devices in the domestic military and civilian fields is faced with the problem of insufficient heat dissipation of packaging substrate materials, which greatly affects the reliability, efficiency, and life of electronic components. As the operating power of electronic components increases, thermal management becomes particularly important, and even becomes a bottleneck in the development of high-power electronic devices. However, the current general-purpose aluminum, copper, Al / SiC, Cu / W and other materials can no longer meet the needs of high-power electronic devices. [0003] The thermal conductivity of high-quality single crystal diamond can not only reach 20...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B22F7/08B22F3/15B22F5/00
CPCB22F3/15B22F5/006B22F7/08
Inventor 杨明肖美兰张杰
Owner 武汉速博酷新材料科技有限公司
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