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High-adhesion-strength low-temperature curing conductive silver adhesive used for piezoelectric composite material and preparation method of adhesive

A technology of piezoelectric composite materials and conductive silver glue, applied in the direction of conductive adhesives, applications, adhesives, etc., can solve the problem that the bonding strength and welding adhesion cannot be maximized, and the bonding strength between the silver layer and the solder joint Poor bonding strength, long curing time and other problems, to achieve the effect of low cost, high bonding strength of silver layer and solder joint, and short curing time

Inactive Publication Date: 2018-03-09
BEIJING INFORMATION SCI & TECH UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The most common methods of electrode technology are ion sputtering, nano-plating, chemical plating and electroplating. Although these processes are used for instrument operation, the process is simple, the appearance is beautiful and the conductivity is good, but the gap between the silver layer and the composite material matrix Poor bond strength and bond strength between silver layer and solder joint
Conductive silver glue is widely used as a conductive adhesive between objects in the fields of electronics and materials. When using conductive silver glue to coat silver wires on composite materials, the bonding strength between the silver layer and the composite material and the silver layer and solder joints The bonding strength between them is much stronger than that of the above process, but the current conductive silver adhesive has a high curing temperature, a long curing time, and its bonding strength and welding adhesion still cannot maximize to meet the needs of composite silver-plated wires

Method used

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  • High-adhesion-strength low-temperature curing conductive silver adhesive used for piezoelectric composite material and preparation method of adhesive
  • High-adhesion-strength low-temperature curing conductive silver adhesive used for piezoelectric composite material and preparation method of adhesive

Examples

Experimental program
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Effect test

example 1

[0025] Step 1: Stir the epoxy resin, curing agent and other additives in proportion at room temperature for 5-10 minutes to make them fully mixed, and place them in a vacuum incubator for defoaming treatment to obtain the corresponding resin matrix solution. According to relevant theoretical analysis and a large number of experimental verification comparisons, it is found that when epoxy resin: curing agent: other additives = 100:150:10 (mass ratio), the conductivity and adhesion are better.

[0026] Step 2: First preheat the weighing bottle, then add a certain amount of solvent dropwise, then take a certain amount of prepared resin matrix solution, then add nano-silver powder in batches, and stir for 20-30 minutes until a silver-white slurry is formed . According to relevant theoretical analysis and a large number of experimental verification comparisons, the amount of solvent taken accounts for 8-15% of the total, the resin matrix solution accounts for 17-37% of the total, a...

example 2

[0030] Example two: Take epoxy resin: curing agent: other additives = 100:200:10, the implementation of steps and the use of reagents are all unchanged according to example one.

example 3

[0031] Example three: take epoxy resin: curing agent: other additives = 100:180:10, the implementation of steps and the use of reagents are all unchanged according to example one.

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Abstract

The invention relates to a high-adhesion-strength low-temperature curing conductive silver adhesive used for a piezoelectric composite material and a preparation method of the adhesive. The conductivesilver adhesive includes a conductive filler, basic resin, a curing agent and a solvent, wherein the conductive filler is conductive silver powder, the basic resin is epoxy resin, and the curing agent is an organic polyamine curing agent. The additive can further include an additive, and the additive is one or more selected from a diluent, a dispersant, a toughening agent, a coupling agent, a catalyst, a conductive accelerator, a curing accelerator, and an adhesion accelerator. The organic polyamine curing agent is one selected from ethylenediamine, tetraethylenepentamine, triethanolamine, diethylenetriamine, and triethylenetetramine of fatty amines of single polyamines. The conductive silver adhesive provided by the invention has the advantages of low costs, a low curing temperature, short curing time, good electrical conductivity, and high adhesion strength between a silver layer and a composite material as well as high adhesion strength between the silver layer and a welding spot compared with that of a market, and can be widely used in the field of welding of the composite material.

Description

technical field [0001] The invention relates to designing an epoxy resin conductive silver glue with low curing temperature, short curing time, high bonding strength and good electrical conductivity and a preparation method thereof, belonging to the field of epoxy resin adhesives. Background technique [0002] The transducer is an essential key part of the detection equipment, and it is one of the signs that the underwater acoustic detection equipment differs from other detection equipment (such as radar). Piezoelectric composite materials have gradually replaced piezoelectric ceramics as the core material in transducers due to their advantages such as high electromechanical coupling coefficient, low acoustic impedance, broadband, and easy matching with water. Piezoelectric composite materials are new materials with a certain piezoelectric effect formed by combining piezoelectric phase materials and non-piezoelectric phase materials according to a certain connection method. ...

Claims

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Application Information

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IPC IPC(8): C09J9/02C09J163/00C09D11/04C09D11/06
CPCC08K2201/001C08K2201/011C08L2203/20C09D11/04C09D11/06C09J9/02C09J163/00C08L13/00C08K7/00C08K5/12
Inventor 廖擎玮闫超王丽坤秦雷
Owner BEIJING INFORMATION SCI & TECH UNIV
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