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Activator for chemical plating of non-conductive base material and preparation method thereof

An activation solution and non-conductive technology, which is applied in liquid chemical plating, printed circuit manufacturing, electrical components, etc., can solve problems such as uneven coverage, insufficient adhesion between chemical plating and substrate, missing plating, etc., and can be applied to a wide range of plate types performance, good backlight, and uniform thickness

Active Publication Date: 2018-08-24
GUANGDONG TONESET SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the traditional ionic palladium activation process, because palladium ions cannot cover certain materials uniformly and effectively, missing plating occurs, resulting in insufficient adhesion between the final electroless plating layer and the substrate.

Method used

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  • Activator for chemical plating of non-conductive base material and preparation method thereof
  • Activator for chemical plating of non-conductive base material and preparation method thereof
  • Activator for chemical plating of non-conductive base material and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1-7

[0059] Refer to the general synthesis method of polymer regulators, and prepare polymer regulators 1-7 according to the components listed in Table 1, the structure of each monomer and the number of repeating units.

[0060] Table 1

[0061]

[0062]

[0063] Wherein, the preparation method of the polymer regulator in Example 1 includes the following steps:

[0064] Add 1 part of isobutanol to the stainless steel reaction kettle and blow in nitrogen. After the oxygen content in the kettle is less than 100ppm, add an appropriate amount of potassium hydroxide, heat up to 80°C, continue to flow in nitrogen to pressurize, heat up to 110°C, and pressure 0.3 MPa, 10 parts of propylene oxide were continuously added, reacted for 12 hours, cooled, dehydrated, and the obtained intermediate product was directly used in the subsequent reaction.

[0065] Add an appropriate amount of potassium hydroxide to the reaction kettle and blow in nitrogen. After the oxygen content in the kettle is less than ...

Embodiment 8

[0069] Preparation of activation solution: Dissolve 150mg of palladium chloride (calculated based on the palladium ion concentration) and 250mg of acetylacetone in 1L of deionized water, then add 75mg of the polymer regulator prepared in Example 1 and fully stir to dissolve, and finally use 8.4g / Adjust the pH to 7.5 with L sodium bicarbonate aqueous solution.

[0070] Electroless copper plating: The glass fiber through-hole plate with a thickness of 2.5mm and an aperture ratio of 10:1 is expanded, degummed, neutralized, degreasing, micro-etched, and prepreg operations in sequence according to the conventional copper immersion process, and then At room temperature, immerse in the palladium activation solution obtained above for 60 seconds, and finally treat with 0.1% sodium borohydride aqueous solution for 40 seconds for reduction. After washing, immerse in 1L containing 16g / L copper sulfate, 10g / L potassium sodium tartrate, 15g / L EDTA disodium salt, 15mg / L formaldehyde and 13g / L...

Embodiment 9

[0072] Preparation of activation solution: Dissolve 300mg of palladium chloride (calculated based on the palladium ion concentration) and 450mg of acetylsalicylic acid in 1L of deionized water, then add 100mg of the polymer regulator prepared in Example 2 and fully stir to dissolve, and finally use 3.6 Adjust the pH to 12 with g / L potassium hydroxide aqueous solution, and place the solution in a water bath at 45°C for use.

[0073] Electroless copper plating: The resin through-hole plate with a thickness of 2.5mm and an aperture ratio of 10:1 is expanded, degummed, neutralized, degreasing, microetched, and pre-dipped in the usual copper immersion process, and then immersed In the palladium activation solution obtained above for 15 seconds, and then go through the same reduction and electroless copper plating process as in Example 8 to complete copper plating.

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Abstract

The invention relates to an activator for chemical plating of a non-conductive base material. The activator is prepared from a solvent and the following raw materials of soluble transition metal salt,a complexing agent, a polymer regulator and an alkaline pH value regulator, and the structural formula of the polymer regulator is shown in the specification, wherein R1 is selected from C3-C16 alkylor alkenyl, R2, R3 and R4 are separately selected from C2-C6 alkyl, a is equal to 0-10, b is equal to 0-10, c is equal to 0-10, and a, b and c are integers and are not equal to 0 at the same time. The non-conductive base material treated by the activator has the advantages that the adhesive force between a chemical plating layer and the surface of the non-conductive base material is improved, theplating thickness can be uniform, the backlight is good, skip plating can be prevented, and good electrical interconnection of circuit boards is guaranteed.

Description

Technical field [0001] The invention relates to the field of PCB circuit board preparation, in particular to an activation solution for electroless plating of non-conductive substrates and a preparation method thereof. Background technique [0002] In a printed circuit board (Printed Circuit Board, PCB) production process, after drilling the plate, an electroless plating process is required to realize the surface metalization of the non-conductive substrate. In the process of electroless plating, it is necessary to adsorb a certain amount of catalytic active centers on the non-metallic substrate first to induce subsequent electroless plating. The commonly used catalytic active centers in the PCB industry are mainly transition metals such as palladium, silver, copper, nickel, iron or cobalt, among which palladium is the most commonly used. The existing palladium activator products mainly include two systems: colloidal palladium and ion palladium. The stability and service life o...

Claims

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Application Information

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IPC IPC(8): C23C18/18C23C18/30H05K3/18
CPCC23C18/1882C23C18/28H05K3/181
Inventor 李龙斌黄远提李卫明宋兴文
Owner GUANGDONG TONESET SCI & TECH
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