Low-temperature solder alloy powder and preparation method thereof

A solder alloy and low-temperature solder technology, applied in the field of alloys, can solve the problems of brittleness due to atmospheric oxidation, poor corrosion resistance, and high welding temperature, so as to improve brittleness, enhance strength and corrosion resistance, and enhance wettability and resistance. The effect of impact performance

Active Publication Date: 2019-01-08
EUNOW ELECTRONICS TECH CO LTD SUZHOU
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Currently commercially available tin alloy powder has the problems of high soldering temperature, poor corrosion resistance, easy oxidation by the atmosphere and high brittleness. Therefore, it is urgent to develop a low-temperature solder alloy powder that can solve these problems at the same time.

Method used

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  • Low-temperature solder alloy powder and preparation method thereof
  • Low-temperature solder alloy powder and preparation method thereof
  • Low-temperature solder alloy powder and preparation method thereof

Examples

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preparation example Construction

[0049] In some embodiments, the preparation method of the low-temperature solder alloy powder includes the following steps:

[0050] S1: Add Sn and Ag to a vacuum frequency induction melting furnace, heat up to 700-900°C, melt and magnetically stir until uniform, stand still, and air-cool to obtain a Sn-Ag master alloy;

[0051] S2: Add Sn and P into the vacuum frequency induction melting furnace, wait for the molten pool to form in the crucible, fill the furnace with inert gas, raise the temperature to 360-400°C, add P into the molten pool from the hopper, and wait for the tin-phosphorus alloy liquid After alloying, magnetically stir until uniform, stand still, and air-cool to obtain a Sn-P master alloy;

[0052] S3: Add Sn, Cu and RE into a vacuum frequency induction melting furnace, heat up to 500-800°C, melt and magnetically stir until uniform, stand still, and air-cool to obtain a Sn-Cu-RE master alloy;

[0053] S4: Add Sn, Co and Pd into a vacuum frequency induction mel...

Embodiment 1

[0072] The first aspect of Example 1 provides a low-temperature solder alloy powder, which comprises the following components in terms of weight percentage: Ag 3.25%, P 0.45%, RE 0.55%, Co 1.25%, Pd 2.5%, Bi 50%, Mg 0.1%, Al 0.1%, Cu 0.95%, Zr 0.65%, In 0.35%, and the rest is Sn. Among them, the RE component is a combination of Ga and Ce at a ratio of 1:1. The average particle size of the solder alloy is 35 microns.

[0073] The second aspect of embodiment 1 provides a kind of preparation method of low-temperature solder alloy powder, comprises the following steps:

[0074] S1: Add Sn and Ag into a vacuum frequency induction melting furnace, heat up to 780°C, melt and magnetically stir until uniform, stand still, and air-cool to obtain a Sn-Ag master alloy;

[0075] S2: Add Sn and P into the vacuum frequency induction melting furnace, wait for the molten pool to form in the crucible, fill the furnace with inert gas, raise the temperature to 380°C, add P into the molten pool ...

Embodiment 2

[0081] The first aspect of Example 2 provides a low-temperature solder alloy powder, which comprises the following components in terms of weight percentage: Ag 3%, P 0.02%, RE 40%, Co 1%, Pd 2%, Bi 40%, Mg 0.05%, Al 0.05%, Cu 0.8%, Zr 0.5%, In 0.3%, and the rest is Sn. Among them, the RE component is a combination of Ga and Ce at a ratio of 1:1. The average particle size of the solder alloy is 35 microns.

[0082] The second aspect of embodiment 2 provides a preparation method of low-temperature solder alloy powder, and the specific preparation method is the same as that of embodiment 1.

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Abstract

The invention provides low-temperature solder alloy powder. The low-temperature solder alloy powder is characterized by comprising the following components of, by weight, 3-3.5% of Ag, 0.02-1% of P, 0.02-1% of RE, 1-1.5% of Co, 2-3% of Pd, 40-60% of Bi and the balance Sn.

Description

technical field [0001] The invention belongs to the field of alloys, and more specifically relates to a low-temperature solder alloy powder and a preparation method thereof. Background technique [0002] With the needs of production and life, tin alloys are widely used because of their excellent connection strength and good process performance. Solder is one of the main uses of tin alloys, and more than 60,000 tons of solder alloys based on tin alloys are consumed globally every year. [0003] Tin can interact with lithium, sodium, potassium, copper, silver, and gold in group I of the periodic table, beryllium, magnesium, calcium, strontium, barium, zinc, cadmium, mercury in group II, and aluminum in group III , gallium, indium, thallium, ytterbium, lanthanum, uranium, and silicon, germanium, lead, titanium, zirconium, hafnium of group IV, and phosphorus, arsenic, antimony, bismuth, vanadium, niobium of group V, and group VI Selenium, tellurium, chromium of group VII and m...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/26B23K35/40
CPCB23K35/262B23K35/40
Inventor 陈钦罗登俊徐衡陈旭徐华侨张义宾梁少杰
Owner EUNOW ELECTRONICS TECH CO LTD SUZHOU
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