Method for chemically plating copper on carbon fiber surface by utilizing sodium hypophosphite as reducing agent

A technology of sodium hypophosphite and surface chemistry, which is applied in the direction of liquid chemical plating, metal material coating technology, coating, etc., can solve problems such as environmental pollution, human hazards, toxicity, etc., and achieve increased surface roughness, plating solution Stabilization, effect of increased deposition rate

Active Publication Date: 2019-04-26
SHENYANG POLYTECHNIC UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The technical problem to be solved in the present invention is to overcome the unstable use of formaldehyde as a reducing agent in the traditional carbon fiber surface electroless copper plating bath, which will cause self-redox reaction and loss in alkaline solu

Method used

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  • Method for chemically plating copper on carbon fiber surface by utilizing sodium hypophosphite as reducing agent
  • Method for chemically plating copper on carbon fiber surface by utilizing sodium hypophosphite as reducing agent
  • Method for chemically plating copper on carbon fiber surface by utilizing sodium hypophosphite as reducing agent

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Embodiment 1

[0038] A kind of method utilizing sodium hypophosphite to do reducing agent carbon fiber surface electroless copper plating, comprises the following steps:

[0039] (1) Pretreatment: carbon fiber pretreatment is followed by degreasing treatment, coarsening treatment, neutralization treatment, sensitization treatment, activation treatment and reduction treatment; degreasing treatment: sodium hydroxide 10g / L, sodium carbonate 15g / L, Sodium phosphate 15g / L; roughening treatment: potassium dichromate 10g / L; neutralization treatment: sodium hydroxide 8g / L; sensitization treatment: stannous chloride 20g / L; activation treatment: palladium chloride 0.2g / L L; reduction treatment: sodium hypophosphite 5g / L; preferably, 8ml / L concentrated sulfuric acid needs to be added for roughening treatment; 40ml / L concentrated hydrochloric acid needs to be added for sensitization treatment; 8ml / L concentrated hydrochloric acid needs to be added for activation treatment . The temperature of degreasi...

Embodiment 2

[0044] A kind of method utilizing sodium hypophosphite to do reducing agent carbon fiber surface electroless copper plating, comprises the following steps:

[0045] (1) Pretreatment: Carbon fiber pretreatment is followed by degreasing treatment, coarsening treatment, neutralization treatment, sensitization treatment, activation treatment and reduction treatment; degreasing treatment: sodium hydroxide 30g / L, sodium carbonate 30g / L, Sodium phosphate 30g / L; coarsening treatment: potassium dichromate 30g / L; neutralization treatment: sodium hydroxide 15g / L; sensitization treatment: stannous chloride 25g / L; activation treatment: palladium chloride 0.5g / L L; reduction treatment: sodium hypophosphite 20g / L; preferably, 12ml / L concentrated sulfuric acid needs to be added for roughening treatment; 50ml / L concentrated hydrochloric acid needs to be added for sensitization treatment; 12ml / L concentrated hydrochloric acid needs to be added for activation treatment . The temperature of degr...

Embodiment 3

[0050] A kind of method utilizing sodium hypophosphite to do reducing agent carbon fiber surface electroless copper plating, comprises the following steps:

[0051] (1) Pretreatment: carbon fiber pretreatment is followed by degreasing treatment, coarsening treatment, neutralization treatment, sensitization treatment, activation treatment and reduction treatment; degreasing treatment: sodium hydroxide 20g / L, sodium carbonate 22g / L, Sodium phosphate 23g / L; coarsening treatment: potassium dichromate 20g / L; neutralization treatment: sodium hydroxide 10g / L; sensitization treatment: stannous chloride 22g / L; activation treatment: palladium chloride 0.3g / L L; reduction treatment: sodium hypophosphite 12g / L; preferably, 10ml / L concentrated sulfuric acid needs to be added for roughening treatment; 45ml / L concentrated hydrochloric acid needs to be added for sensitization treatment; 10ml / L concentrated hydrochloric acid needs to be added for activation treatment . The temperature of degr...

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Abstract

The invention relates to a method for chemically plating copper on a carbon fiber surface by utilizing sodium hypophosphite as a reducing agent. The method comprises the following steps: (1) preprocessing, namely, sequentially carrying out oil removing, roughening, neutralizing, sensitizing, activating and reducing on carbon fibers; (2) preparing a plating solution, namely, treating deionized water as a solvent to prepare the following components: cupric sulfate pentahydrate, sodium hypophosphite, sodium citrate, boric acid, nickel sulfate, thiourea and sodium hydroxide; (3) chemically platingand coating the preprocessed carbon fibers in a prepared plating solution; and (4) flushing the plated and coated copper plated carbon fibers through deionized water; drying in a vacuum drying box; moving out from the vacuum drying box; and sealing and storing. The method overcomes the damage that formaldehyde is treated as the reducing agent in a traditional chemical copper plating solution of the carbon fiber surface; and the method is a novel nontoxic, environmentally-friendly and stable technology for chemically plating copper on the carbon fiber surface.

Description

technical field [0001] The invention belongs to the technical field of carbon fiber reinforced metal matrix composite materials, and relates to a method for electroless copper plating on the surface of carbon fiber using sodium hypophosphite as a reducing agent. Background technique [0002] Carbon fiber reinforced metal matrix composites have received more attention in the automobile manufacturing and aerospace industries due to their excellent properties such as high specific strength, high specific stiffness, and high tensile strength. However, carbon fiber is a microcrystalline graphite material obtained by carbonization and graphitization of organic fibers. Due to its graphite-like structure, its surface is inert and lacks active functional groups, so it has poor adhesion to the substrate and a series of interface problems. To a certain extent, its application is limited; in addition, carbon fiber and metal are difficult to infiltrate, and the density is small, and it i...

Claims

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Application Information

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IPC IPC(8): C23C18/40C23C18/18
CPCC23C18/1886C23C18/40
Inventor 曲迎东周启文李广龙刘希仕王一王光磊尤俊华苏睿明
Owner SHENYANG POLYTECHNIC UNIV
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