A polyphenol-modified hydrocarbon composition-based prepreg and its prepared copper-clad laminate

Abstract

The invention relates to a hydrocarbon composition-based prepreg modified by polyphenol and a copper-clad laminate prepared therefrom. The invention selects polyarylether or polyolefin resin modified by hydroxyl-terminated, amino-terminated or mercapto-terminated as matrix resin, and epoxy resin as main curing agent to construct a hydrocarbon composition with excellent dielectric properties. At the same time, the present invention also modifies polypolyphenols on the surface of reinforcing materials and fillers, because polypolyphenols are rich in hydroxyl functional groups, and can participate in the cross-linking and curing reaction of terminal-modified polyarylethers or polyolefins with epoxy resins In this way, the matrix resin is directly bonded to the surface of the reinforcement and filler, enhancing their compatibility and adhesion. Further, the high-frequency copper-clad laminate made of the prepreg and copper foil has good thermal-mechanical properties, excellent dielectric properties, good overall performance stability, good uniformity, high copper foil peel strength, and can meet high-frequency, high-speed Various comprehensive performance requirements for substrate materials in the communication field.

Description

technical field [0001] The invention belongs to the field of communication materials, and in particular relates to a polyphenol-modified hydrocarbon composition-based prepreg and a copper-clad laminate prepared therefrom. Background technique [0002] Copper clad laminate is one of the key materials in the information electronics industry, and has been widely used in many fields such as communication base stations, satellites, unmanned vehicles, drones and intelligent robots. Polyphenylene ether and polyolefin resins can be used to make copper clad laminates due to their excellent dielectric properties. Nowadays, polyphenylene ether-based and polydiene-based thermosetting CCLs have been developed. Among them, thermosetting polyphenylene ether resins mainly include side vinyl modification and terminal vinyl modification. The preparation process of pendant vinyl-modified polyphenylene ether requires the use of highly reactive, dangerous, and toxic substances such as butyllit...

AI Technical Summary

Problems solved by technology

However, except for polystyrene, polyphenylene ether generally has poor compatibility with other resins, resulting in serious phase separation of the resin in the prepreg composite matrix.

[0003] In addition, glass fiber cloth and inorganic fillers (such as silicon oxide, aluminum oxide, etc.) commonly used in the production of copper clad laminates have abundant hydrophilic functional groups on the surface - hydroxyl groups, while vinyl-modified polyphenylene ether groups and polydiene It does not contain hydrophilic functional groups such as oxygen and nitrogen, and has poor compatibility with glass fiber cloth and inorganic fillers. The dielectric properties and uniformity of different parts of the copper-clad laminate prepared by this method are not perfect, so it is not suitable for The production of multi-layer copper clad laminates is difficult to meet the requirements of the current high frequency and high speed communication fields for the diversification and complexity of the functions of copper clad laminate materials, and the high density of circuit layout.

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