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Low-melting-point SnBi alloy-copper composite electronic slurry and preparing and printing methods

An electronic paste, low melting point technology, used in cable/conductor manufacturing, equipment for manufacturing conductive/semiconductor layers, conductive materials dispersed in non-conductive inorganic materials, etc., can solve the problem of poor conductivity and high sintering temperature , copper powder is easily oxidized, etc., to achieve the effect of low production cost, simple process route, and easy availability of raw materials

Active Publication Date: 2019-07-09
扬州虹运电子材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The purpose of the present invention is to provide a low-melting point SnBi alloy-copper composite electronic paste, which solves the problems of poor electrical conductivity, poor sintering adhesion, wettability and mechanical properties, and excessively high sintering temperature of the copper composite electronic paste in the prior art. , Copper powder is easy to oxidize

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0055] Step 1. Prepare a copper sulfate solution with a mass-to-volume ratio of 10 g / L at room temperature, add trisodium citrate, sodium tetraborate and EDTA to the copper sulfate solution for a total of 10 g / L, stir and mix to obtain a gel-like mixture A; Then add NaOH solution to the gel mixture A to adjust the pH to 10, stir to obtain the main salt mixed solution B; then add the catalyst nickel sulfate 0.8g / L to the main salt mixed solution B, and the reducing agent sodium hypophosphite 30g / L, buffering agent boric acid 30g / L, using NaOH solution to adjust the pH to 10, to obtain the plating solution mixed solution C;

[0056] Step 2: Put the graphene nanosheets into the prepared bath mixture solution C, and then add the additives polyethylene glycol 0.6g / L and potassium ferrocyanide 0.2g / L; the temperature is controlled at 40°C, pH Controlled to 10, magnetically stirred, ultrasonically dispersed, filtered to take out the graphene nanosheets; washed with deionized water for ...

Embodiment 2

[0062] Prepare a copper sulfate solution with a mass-volume ratio of 13g / L at room temperature, add trisodium citrate, sodium tetraborate and EDTA to the copper sulfate solution for a total of 13g / L, stir and mix to obtain a gel mixture A; Add NaOH solution to the colloidal mixture A to adjust the pH to 13, and stir to obtain the main salt mixed solution B; then add the catalyst nickel nitrate 1g / L, the reducing agent sodium hypophosphite 33g / L, and the buffer to the main salt mixed solution B. Boric acid is 33g / L, and the pH is adjusted to 13 with NaOH solution to obtain plating solution mixture C;

[0063] Step 2: Put the graphene nanosheets into the prepared bath mixture solution C, and then add the additives polyethylene glycol 0.8g / L and potassium ferrocyanide 0.4g / L; the temperature is controlled at 50°C, pH Controlled to 13, magnetic stirring, ultrasonic dispersion, filtering out the graphene nanosheets; using deionized water to wash repeatedly to neutral, and finally dryi...

Embodiment 3

[0069] Prepare a copper sulfate solution with a mass-volume ratio of 15g / L at room temperature, add trisodium citrate, sodium tetraborate and EDTA to the copper sulfate solution for a total of 15g / L, stir and mix to obtain a gel-like mixture A; Add NaOH solution to the colloidal mixture A to adjust the pH to 15, and stir to obtain the main salt mixed solution B; then add the catalyst nickel sulfate 1.2g / L to the main salt mixed solution B, the reducing agent sodium hypophosphite 35g / L, and buffer Boric acid is 35g / L, and the pH is adjusted to 15 with NaOH solution to obtain plating solution mixture C;

[0070] Step 2. Put the graphene nanosheets into the prepared bath mixture solution C, and then add the additives polyethylene glycol 1g / L and potassium ferrocyanide 0.6g / L; the temperature is controlled at 60°C, and the pH is controlled At 15, magnetic stirring, ultrasonic dispersion, filtering out the graphene nanosheets; using deionized water to wash to neutrality several times,...

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PUM

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Abstract

The invention discloses low-melting-point SnBi alloy-copper composite electronic slurry, which comprises the following components by weight: 55-85% of mixed conductive phase, 5-15% of tin-bismuth alloy powder, 10-25% of organic carrier, and additives consisting of 0-0.5% of La and 0-4.5% of Ga, with the total percent being 100%. The invention also discloses a preparing method of the low-melting-point SnBi alloy-copper composite electronic slurry and a printing method of the low-melting-point SnBi alloy-copper composite electronic slurry. The low-melting-point SnBi alloy-copper composite electronic slurry and the preparing and printing applications thereof have the advantages of simple process route, easy availability of raw materials, low production cost, no lead and cadmium components, and no pollution.

Description

Technical field [0001] The invention belongs to the technical field of electronic pastes, and relates to a low melting point SnBi alloy-copper composite electronic paste. The invention also relates to a preparation method of the low melting point SnBi alloy-copper composite electronic paste, and the low melting point SnBi alloy -Printing method of copper composite electronic paste. Background technique [0002] Electronic paste, as a kind of thick film paste, is an important part of electronic information materials. As a high-tech electronic functional material, it is widely used in thick film integrated circuits, surface packaging, microelectronics, solar cells, printing and high-tech Electronic industries such as resolution conductors. With the continuous development of modern electronic information technology in the direction of high integration, miniaturization, intelligence and greenness, the requirements for the performance of electronic pastes are getting higher and highe...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01B1/22H01B13/00
CPCH01B1/22H01B13/0026
Inventor 屈银虎梅超左文婧刘晓妮周思君张学硕何炫袁建才
Owner 扬州虹运电子材料有限公司
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