Dielectric composite material and preparation method thereof and flat-plate type capacitor

A technology of composite materials and capacitors, applied in the direction of fixed capacitor dielectric, fixed capacitor parts, electrospinning, etc., can solve the application limitations of high dielectric loss, low dielectric constant, intelligent and miniaturized electronic components etc. to achieve high dielectric properties, low dielectric loss, and low manufacturing cost

Inactive Publication Date: 2019-07-16
SHENZHEN INST OF ADVANCED TECH
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  • Abstract
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Problems solved by technology

[0004] In order to solve the problems of low dielectric constant and high dielectric loss in the above-mentioned prior art dielectric composite materials, which are limited in the application of intelligent and miniaturized electronic components, the present invention provides a low The preparation method of the dielectric composite material with simple cost and process provides a dielectric composite material with high dielectric constant (greater than 30) and low dielectric loss (less than 0.1), and further applies the dielectric composite material to flat plate in capacitor

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  • Dielectric composite material and preparation method thereof and flat-plate type capacitor
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  • Dielectric composite material and preparation method thereof and flat-plate type capacitor

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preparation example Construction

[0041] The present invention also provides the preparation method of above-mentioned dielectric composite material, such as figure 1 Shown, described preparation method comprises:

[0042] Step S1, preparing ceramic fibers having a perovskite structure or a perovskite-like structure. Such as figure 2 As shown, step S1 specifically includes:

[0043] In step S11, organic acid metal salt and titanium source material are used as raw materials, dissolved in an organic solvent and reacted to prepare a perovskite structure precursor or a perovskite-like structure precursor. The role of the organic solvent is to provide an environment for the reaction of the raw materials, while protecting the titanium source from hydrolysis.

[0044] The organic acid metal salt is at least one of strontium acetate, barium acetate, zirconium acetate, copper acetate and calcium acetate.

[0045] The titanium source material is titanate, titanium isopropoxide or titanium tetrachloride. Among them...

Embodiment 1

[0075] Preparation of ceramic fiber: Weigh 2.04328g of barium acetate and 0.82248g of strontium acetate, add 10mL of acetic acid and stir until the solution is clear and transparent to obtain solution A. In addition, 4.04328 g of tetrabutyl titanate and 2.40264 g of acetylacetone were weighed and stirred until the solution was clear and yellow and transparent, and solution B was obtained.

[0076] After mixing the two solutions of A and B, 1 g of polyvinylpyrrolidone (PVP) was added and stirred until the PVP was completely dissolved to obtain a perovskite-like structure precursor. Among them, the role of PVP is to increase the viscosity of the solution.

[0077] Under normal temperature conditions, the perovskite-like structure precursor solution was vacuum filtered for 10 minutes, and then treated by electrospinning process to obtain a mixed film. The parameters of the electrospinning process were: rotation speed 100r / min, voltage 8kV, The advancing speed is 0.02mm / min.

[...

Embodiment 2

[0088] Preparation of ceramic fiber: Weigh 2.04328g of barium acetate and 0.82248g of strontium acetate, add 10mL of acetic acid and stir until the solution is clear and transparent to obtain solution A. In addition, 4.04328 g of tetrabutyl titanate and 2.40264 g of acetylacetone were weighed and stirred until the solution was clear and yellow and transparent, and solution B was obtained. After mixing the two solutions of A and B, 1g of PVP was added and stirred until the PVP was completely dissolved to obtain a perovskite-like structure precursor.

[0089] Under normal temperature conditions, after vacuum filtration of the perovskite-like structure precursor solution for 10 minutes, the electrospinning process was used to obtain a mixed film. The parameters of the electrospinning process were: the rotational speed was 2800r / min, the voltage was 20kV, The advancing speed is 0.4mm / min.

[0090] After drying the mixed film formed by electrospinning, put it into a muffle furnace...

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Abstract

The invention discloses a dielectric composite material and a preparation method thereof and a flat-plate type capacitor. The preparation method of the dielectric composite material includes the following steps that S1, ceramic fiber having a perovskite structure or perovskite-like structure, conductive particles and polymers are dissolved with a solvent, and a mixture is obtained; S2, after the mixture is subjected to electrostatic spinning, the dielectric composite material is obtained. The invention further discloses the dielectric composite material. The dielectric composite material includes the polymers, the conductive particles and the ceramic fiber, wherein the polymers are filled with the conductive particles and ceramic fiber. The invention further discloses the flat-plate type capacitor based on the dielectric composite material, and the capacitor includes a metal electrode-dielectric composite material-metal electrode sandwich structure. The defects are overcome that in theprior art, the dielectric constant of a composite material is low, the dielectric loss is high, and the application of the composite material in field of intellectualization and miniaturization of electronic components is limited. The invention provides the composite material with a high dielectric constant and low dielectric loss, and the material can be applied to the flat-plate type capacitor.

Description

technical field [0001] The invention relates to the technical field of preparation of dielectric materials, in particular to a dielectric composite material, a preparation method thereof and a flat-plate capacitor. Background technique [0002] With the rapid development of electronic integration technology and the huge demand growth in the electronics industry, how to prepare dielectric materials with excellent performance and industrial value has become the focus of researchers. The current new dielectric materials are mainly polymer-based composite materials, and polymer composite materials include polymer-polymer composite materials and polymer-inorganic composite materials. Since the dielectric constant of polymer materials is usually not high, conductive particles with high dielectric constant are generally selected for filling. Conductive particles have high electron mobility, and the dielectric material formed after compounding with polymer materials can obtain high...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): D01D5/00D04H1/728H01G4/018
CPCD01D5/003D04H1/728H01G4/018
Inventor 于淑会徐鹏鹏罗遂斌孙蓉
Owner SHENZHEN INST OF ADVANCED TECH
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