Preparation method of glass ceramic with good thermal conductivity
A glass ceramic, thermal conductivity technology, applied in glass manufacturing equipment, glass molding, manufacturing tools, etc., can solve problems such as poor thermal conductivity, and achieve the effects of low dielectric constant, low sintering temperature, and high atomic magnetic moment.
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Embodiment 1
[0035] Mix alumina fibers and N, N-dimethylformamide at a mass ratio of 1:5, and ultrasonically disperse them for 2 hours at an ultrasonic power of 250W to obtain a dispersion. Mix the dispersion with diphenyl Mix methane diisocyanate, in a nitrogen atmosphere, ultrasonically react at a temperature of 100°C for 20 hours, then filter with suction to obtain a filter residue, wash the filter residue with deionized water for 3 times, and dry it in an oven at a temperature of 60°C until constant Mix the modified fiber with bisphenol A epoxy resin E-51 at a mass ratio of 1:5, stir for 5 minutes at a stirring speed of 500 r / min, and then ultrasonically disperse for 20 minutes , to obtain modified epoxy resin; by weight, respectively weigh 40 parts of 100 mesh waste glass powder, 20 parts of silicon dioxide, 5 parts of aluminum nitride, 1 part of diamond, 5 parts of copper powder, 30 parts of 100 Mesh waste ceramic powder, 1 part of lanthanum oxide, 40 parts of modified epoxy resin, 1...
Embodiment 2
[0037] Mix alumina fibers and N, N-dimethylformamide at a mass ratio of 1:5, and ultrasonically disperse them for 2 hours at an ultrasonic power of 275W to obtain a dispersion. Mix the dispersion with diphenyl Mix methane diisocyanate, in a nitrogen atmosphere, ultrasonically react at a temperature of 105°C for 22 hours, then suction filter to obtain a filter residue, wash the filter residue 4 times with deionized water, and dry it in an oven at a temperature of 70°C until constant Mix the modified fiber with bisphenol A epoxy resin E-51 at a mass ratio of 1:5, stir for 8 minutes at a stirring speed of 550 r / min, and then ultrasonically disperse for 25 minutes , to obtain modified epoxy resin; by weight, respectively weigh 45 parts of 110 mesh waste glass powder, 25 parts of silicon dioxide, 10 parts of aluminum nitride, 3 parts of diamond, 8 parts of copper powder, 35 parts of 110 Mesh waste ceramic powder, 5 parts of lanthanum oxide, 50 parts of modified epoxy resin, 3 parts...
Embodiment 3
[0039] Mix alumina fibers and N,N-dimethylformamide at a mass ratio of 1:5, and ultrasonically disperse them for 3 hours at an ultrasonic power of 300W to obtain a dispersion. Mix the dispersion with diphenyl Mix methane diisocyanate, in a nitrogen atmosphere, ultrasonically react at a temperature of 110°C for 24 hours, then filter with suction to obtain a filter residue, wash the filter residue 5 times with deionized water, and dry it in an oven at a temperature of 80°C until constant Mix the modified fiber with bisphenol A epoxy resin E-51 at a mass ratio of 1:5, stir for 10 minutes at a stirring speed of 600 r / min, and then ultrasonically disperse for 30 minutes , to obtain modified epoxy resin; by weight, respectively weigh 50 parts of 120 mesh waste glass powder, 30 parts of silicon dioxide, 15 parts of aluminum nitride, 5 parts of diamond, 10 parts of copper powder, 40 parts of 120 Mesh waste ceramic powder, 10 parts of lanthanum oxide, 60 parts of modified epoxy resin, ...
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