High-entropy alloy connection silicon carbide ceramic connecting part as well as preparation method and application thereof

A technology of silicon carbide ceramics and high-entropy alloys, which is applied in the field of non-oxide ceramic connections, can solve problems such as internal stress concentration, lower working temperature of connectors, and weakened ceramic properties, and achieve good high-temperature stability, good high-temperature performance, and improved The effect of connection efficiency

Active Publication Date: 2019-11-15
GUANGDONG UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The limitation of the existing brazing method is that the thermal expansion coefficient of the solder used for the connection matches that of the base metal, resulting in internal stress conc

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0029] Example 1

[0030] 1. Preparation:

[0031] (1) Put high-entropy alloy powder AlCoCrFeNi and SiC (wherein SiC is 5wt% of the total mass of AlCoCrFeNi and SiC) into a wide-mouth beaker, select absolute ethanol as solvent, press high-entropy alloy powder: alcohol=2:1 The mass ratio was mixed, put into an ultrasonic instrument for ultrasonic, and stirred with a glass rod at the same time, and the stirring time was 10min to make a paste brazing filler metal.

[0032] (2) Cut the SiC ceramic into 10mm*10mm*3mm ceramic sheets, polish with polishing paste, polish to mirror effect, and there are no obvious scratches under the microscope.

[0033] (3) Use a brush to apply the paste brazing filler metal prepared in (1) to the SiC ceramic block prepared in (2) evenly, add about 5 mg, and then superimpose another SiC ceramic block on it to prepare a sandwich shape.

[0034] (4) Put the sandwich-shaped sample (3) into the mold, then put it into the SPS and pressurize it for 20Mpa...

Example Embodiment

[0036] Example 2

[0037] 1. Preparation:

[0038] (1) Put high-entropy alloy powder AlCoCrFeNi and SiC (wherein SiC is 10wt% of the total mass of AlCoCrFeNi and SiC) into a wide-mouth beaker, select alcohol as a solvent, press high-entropy alloy powder: alcohol=2:1 mass ratio Mix, put it into an ultrasonic instrument to sonicate, and use a glass rod to stir at the same time. After stirring for 15 minutes, a paste solder is formed.

[0039] (2) Cut the SiC ceramic into 10mm*10mm*3mm ceramic sheets, polish with polishing paste, polish to mirror effect, and there are no obvious scratches under the microscope.

[0040] (3) Use a brush to apply the brazing filler metal prepared in (1) evenly to a SiC ceramic block prepared in (2), add about 5 mg, and then superimpose another SiC ceramic block on it to prepare a sandwich sample.

[0041] (4) Put the (3) sandwich-shaped sample into a special mold and then put it into SPS together to press 20Mpa, heat it up to 1200°C at 200°C / min,...

Example Embodiment

[0043] Example 3

[0044] 1. Preparation:

[0045] (1) Put high-entropy alloy powder AlCoCrFeNi and SiC (wherein SiC is 20wt% of the total mass of AlCoCrFeNi and SiC) into a wide-mouth beaker, select alcohol as a solvent, press high-entropy alloy powder: alcohol=2:1 mass ratio Mix, put it into an ultrasonic instrument to sonicate, and use a glass rod to stir at the same time. After stirring for 10 minutes, it becomes a paste brazing filler metal.

[0046] (2) Cut the SiC ceramic into 10mm*10mm*3mm ceramic sheets, polish with polishing paste, polish to mirror effect, and there are no obvious scratches under the microscope.

[0047] (3) Use a brush to apply the brazing filler metal prepared in (1) evenly to a piece of SiC ceramic block prepared in (2), add about 5 mg, and then superimpose another SiC ceramic block on it to prepare a sandwich shape sample.

[0048](4) Put the (3) sandwich-shaped sample into a special mold and then put it into SPS together to press 5Mpa, heat i...

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PUM

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Abstract

The invention belongs to the technical field of non-oxide ceramic connection and discloses a high-entropy alloy connection silicon carbide ceramic connecting part as well as a preparation method and application thereof. The high-entropy alloy connection silicon carbide ceramic connecting part is prepared by mixing high-entropy alloy AlCoCrFeNi powder with SiC powder, performing stirring and ultrasonic treatment by using absolute ethyl alcohol as a solvent so as to obtain a uniform brazing filler metal, uniformly smearing the brazing filler metal to a SiC surface after polishing, and performingthermal treatment through SPS (spark plasma sintering) sintering at 1000-1400 DEG C at connection pressure of 5-30MPa, wherein the structure of the connecting part is SiC/AlCoCrFeNi-SiC/SiC. When thehigh-entropy alloy is used as a connecting layer, not only is low-temperature connection of a silicon carbide ceramic achieved, but also the internal stress of the ceramic connector can be reduced, and the connecting part can be applied to harsh working environments at high temperatures and high pressure, and particularly can be widely applied to the nuclear industry.

Description

technical field [0001] The invention belongs to the technical field of non-oxide ceramic connection, and more specifically relates to a high-entropy alloy connection silicon carbide ceramic connection piece and its preparation method and application. Background technique [0002] SiC ceramic has excellent oxidation resistance, high hardness, excellent wear resistance and corrosion resistance, and has high thermal conductivity. It is a structural material with wide application prospects. It is used in petroleum, chemical, aircraft, Nuclear energy and many other fields have been widely used. The reliable connection of ceramic itself provides necessary technical support for its wider application. Due to the brittleness and poor toughness of the ceramic material itself, which cannot be overcome, resulting in poor processing performance, it is temporarily impossible to manufacture large-sized or complex-shaped ceramic parts. Therefore, it is necessary to prepare ceramic products...

Claims

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Application Information

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IPC IPC(8): C04B37/00
CPCC04B37/003C04B2237/121C04B2237/122C04B2237/123C04B2237/365
Inventor 郭伟明牛文彬吴利翔朱林林车金涛林华泰
Owner GUANGDONG UNIV OF TECH
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