A Method for Eliminating Photoresponse of Organic Field Effect Transistor
A technology of transistors and organic fields, applied in the field of eliminating the photoresponse of organic field effect transistors, can solve the problem that excitons are not easily separated into free electrons and holes, and achieve the effects of various preparation methods, simple preparation, and convenient processing
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Embodiment 1
[0078] In this embodiment, to the silicon dioxide (300nm) / silicon substrate with insulating layer and gate electrode, the dielectric layer modification material selected is OTS (contrast modification layer) and PS, PMMA, CYTOP (thickness is in the range of 20-500nm) ), the semiconductor is based on 2,6-diphenylanthracene (DPA for short) film (comparative test).
[0079] Step 1: Cleaning of the substrate with the gate electrode
[0080] For organic field effect transistors, the silicon oxide / silicon substrate with a surface oxide layer (thickness 300nm) is washed with deionized water, concentrated sulfuric acid: hydrogen peroxide (7:3), deionized water, isopropyl After ultrasonic cleaning with alcohol, dry with nitrogen gas.
[0081] For organic light-emitting diodes, commercially purchased ITO glass (with an oxide layer of 150 nm) was washed with deionized water, acetone, and isopropanol in sequence, and then blown dry with nitrogen.
[0082] Step 2: Preparation and processi...
Embodiment 2
[0098] In this embodiment, to the silicon dioxide (300nm) / silicon substrate with insulating layer and gate electrode, the polymer film layer material selected is OTS (contrast modification layer) and PS, PMMA, CYTOP (thickness is in the range of 20-500nm) ), the active semiconductor layer is based on 2,6-diphenylanthracene single crystal (thickness in the range of 20-100 nm).
[0099] Step 1: Cleaning of the substrate with the gate electrode
[0100] For organic field effect transistors, the silicon oxide / silicon substrate with a surface oxide layer (thickness 300nm) is washed with deionized water, concentrated sulfuric acid: hydrogen peroxide (7:3), deionized water, isopropyl After ultrasonic cleaning with alcohol, dry with nitrogen gas.
[0101] Step 2: Preparation and processing of polymer insulating layer
[0102] On the surface of the cleaned substrate in the first step, vacuum heat at 90°C, keep it for 90min, cool to room temperature, drop a drop of OTS in the petri di...
Embodiment 3
[0116] The method adopted in this embodiment is the same as that in Embodiment 2, and the material of the active semiconductor layer used is copper perfluorophthalocyanine with a thickness of 40-60 nm.
[0117] Figure 7 Demonstrated perfluorophthalocyanine copper single crystal transistors on different substrates in dark state and 0.6mW cm -2 The transfer curve under light intensity shows that the photoresponse of the device is effectively eliminated on the polymer insulating layer.
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