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Polyimide composite film and preparation method and application thereof

A technology of polyimide and composite film, which is applied in the field of polyimide composite film and its preparation, can solve the problem of high-frequency and high-speed communication materials, low dielectric properties, low hygroscopicity and thermal properties, and low dielectric constant. Dielectric loss, low moisture absorption and other issues, to achieve excellent dimensional stability, stable dielectric constant, and excellent dielectric properties

Active Publication Date: 2020-05-19
ZHONGSHAN POLYTECHNIC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, the cost of this method is high, and it is difficult to be applied to actual production. Moreover, from the analysis of the molecular structure provided by this method, the thermal expansion coefficient of the polyimide film is very high, and it cannot meet the needs of high-frequency and high-speed communication materials.
Chinese patent CN201910530616.2 provides a method for preparing a polyimide film that meets the requirements of advanced electronic material packaging. The polyimide film prepared by this method has the advantages of high dielectric properties, low moisture absorption and stable thermal performance. But the toughness of the film is not enough
Although the flexible dielectric material polyimide reported in the above patent literature has outstanding heat resistance, excellent dielectric properties, and excellent dimensional stability, the overall performance of the product is not high and the cost is high
That is to say, the polyimide film in the prior art is still not able to meet the requirements of high-frequency high-speed communication dielectric materials for low dielectric constant (Dk), low dielectric loss (Df), low hygroscopicity and compatibility with copper foil. Matching low coefficient of thermal expansion (CTE) and other comprehensive performance requirements

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  • Polyimide composite film and preparation method and application thereof
  • Polyimide composite film and preparation method and application thereof
  • Polyimide composite film and preparation method and application thereof

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preparation example Construction

[0048] The present invention also provides the preparation method of the polyimide composite film described in above-mentioned technical scheme, comprises the following steps:

[0049] Mix aromatic diamine, aromatic dianhydride, polyphenylene ether, homogeneous accelerator and organic solvent, perform copolymerization and blending, add end-capping agent for end-capping, and obtain polyimide-polyphenylene ether homogeneous slurry ;

[0050] Mix the polyimide-polyphenylene ether homogeneous slurry with an imidization agent for chemical imidization to obtain a partially imidized polyamic acid-polyphenylene ether homogeneous solution; the partial imidization The imidization rate of polyamic acid-polyphenylene ether homogeneous solution is 20% to 50%;

[0051] After casting and coating the partially imidized polyamic acid-polyphenylene ether homogeneous solution, it is dried to obtain a partially imidized polyimide composite film; the partially imidized polyimide The imidization ...

Embodiment 1

[0110] 4,4'-biphenyldianhydride (13.97g), p-phenylenediamine (5.14g), polyphenylene ether (1.01g), 3-aminopropyltrimethoxysilane (1.34g) and N,N' - Dimethylacetamide (193mL, 181.08g) was mixed, and after copolymerization and blending (room temperature, nitrogen atmosphere) for 16h, 0.02g of maleic anhydride was added for capping to obtain a polyamic acid-polyphenylene ether homogeneous solution;

[0111] Mix the polyamic acid-polyphenylene ether homogeneous solution, 4-picoline (8.85g) and acetic anhydride (12.13g) for chemical imidization (10°C, 25min) to obtain partially imidized Polyamic acid-polyphenylene ether homogeneous solution;

[0112] At room temperature, the partially imidized polyamic acid-polyphenylene ether homogeneous solution was cast-coated on a 3mm thick silicate glass, and dried (65°C, 45min) to obtain a partially imidized Polyimide composite film;

[0113] The partially imidized polyimide composite film is thermally imidized (heating at a rate of 12°C / mi...

Embodiment 2

[0117] 4,4'-biphenyldianhydride (13.24g), p-phenylenediamine (4.87g), polyphenylene ether (2.01g), 3-aminopropyltrimethoxysilane (1.34g) and N,N' - Dimethylacetamide (193mL, 181.08g) was mixed, and after copolymerization and blending (room temperature, nitrogen atmosphere) for 16h, 0.02g of maleic anhydride was added for capping to obtain a polyamic acid-polyphenylene ether homogeneous solution;

[0118] Mix the polyamic acid-polyphenylene ether homogeneous solution, 4-picoline (8.39g) and acetic anhydride (11.49g) for chemical imidization (10°C, 25min) to obtain partially imidized Polyamic acid-polyphenylene ether homogeneous solution;

[0119] At room temperature, the partially imidized polyamic acid-polyphenylene ether homogeneous solution was cast-coated on a 3mm thick silicate glass, and dried (65°C, 45min) to obtain a partially imidized Polyimide composite film;

[0120] The partially imidized polyimide composite film is thermally imidized (heating at a rate of 13°C / mi...

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Abstract

The invention relates to the technical field of communication materials and flexible microelectronic packaging, in particular to a polyimide composite film and a preparation method and application thereof. The polyimide composite film provided by the invention has the characteristics of low dielectric constant, low hygroscopicity, excellent dimensional stability and the like, the dielectric constant temperature of the polyimide composite film fluctuates little along with temperature and humidity, and the comprehensive performance is high. The polyimide composite film can completely meet the requirements of a high-frequency copper-clad plate on a base material, the quality of the high-frequency copper-clad plate can be improved, and the copper-clad plate prepared from the polyimide composite film has excellent dielectric properties, hygroscopicity and dimensional stability. According to the record of the embodiment, the minimum dielectric constant of the polyimide composite film provided by the invention can reach 2.55 (10GHz), the minimum dielectric loss can reach 0.003 (10GHz), the minimum thermal expansion coefficient can reach 13.5 ppm / DEG C, and the minimum moisture absorptionrate can reach 0.1%.

Description

technical field [0001] The invention relates to the technical field of communication materials and flexible microelectronic packaging, in particular to a polyimide composite film and its preparation method and application. Background technique [0002] At present, polyimide film has been widely used in electronic packaging materials, because of its excellent thermal stability, excellent mechanical properties and dimensional stability, low dielectric constant and electrical insulation properties in a wide temperature range, Polyimide films are mainly used as passivation layers, insulating materials, flexible printed circuit substrates, and high-speed integrated circuit interconnection insulating layers. Although the above-mentioned excellent properties of polyimide meet the needs of ordinary electronic packaging, it does not have the low dielectric constant and low moisture absorption of polyphenylene ether and polytetrafluoroethylene, and the two cannot replace them due to t...

Claims

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Application Information

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IPC IPC(8): C08L79/08C08L71/12C08G73/10C08J5/18
CPCC08J5/18C08G73/1067C08G73/1007C08G73/1039C08G73/1042C08G73/1064C08J2379/08C08J2471/12
Inventor 赵文华马鹏常泊依晴戴春桃彭绍鸿庄雨琪邱志东梁静怡
Owner ZHONGSHAN POLYTECHNIC