A kind of preparation method of high-efficiency IBC battery
A battery and high-efficiency technology, applied in the field of solar cells, can solve the problems of unguaranteed A-grade product rate, increased production cost, cumbersome production process, etc., and achieves excellent surface flatness, improved tightness, and good corrosion effect.
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Embodiment 1
[0030] A preparation method of high-efficiency IBC battery, comprising the following steps:
[0031] a. A 2 μm pyramid is formed on the surface of the n-type silicon wafer after texturing, and one side is polished with lye, the concentration of lye is 25wt%, and the polishing temperature is 70°C;
[0032] b. Boron diffusion is performed on both sides of the polished silicon wafer. After boron diffusion, the surface resistance of the silicon wafer is 110Ω / sq, and the surface concentration of boron is 1e19cm -3 , the junction depth of the pn junction is 1.5 μm, a silicon nitride film is grown on the polished surface, the thickness of the silicon nitride film is 120 nm, and the refractive index is 2.7;
[0033] c. Laser removal of borosilicate glass and silicon nitride film on the polished surface, with a line width of 150 μm;
[0034] d. After the silicon nitride film is removed by laser, the silicon wafer is etched in lye and auxiliaries, the volume ratio of auxiliaries and ly...
Embodiment 2
[0042] A preparation method of high-efficiency IBC battery, comprising the following steps:
[0043] a. A 1 μm pyramid is formed on the surface of the n-type silicon wafer after texturing, and one-sided polishing is performed with lye, the concentration of lye is 5wt%, and the polishing temperature is 60°C;
[0044] b. Boron diffusion is performed on both sides of the polished silicon wafer. After boron diffusion, the surface resistance of the silicon wafer is 80Ω / sq, and the surface concentration of boron is 1e19cm -3 , the junction depth of the pn junction is 500nm, a silicon nitride film is grown on the polished surface, the thickness of the silicon nitride film is 60nm, and the refractive index is 1.8;
[0045] c. Laser removal of borosilicate glass and silicon nitride film on the polished surface, with a line width of 100 μm;
[0046] d. After the silicon nitride film is removed by laser, the silicon wafer is etched in lye and auxiliaries, the volume ratio of auxiliaries...
Embodiment 3
[0054] A preparation method of high-efficiency IBC battery, comprising the following steps:
[0055] a. After the n-type silicon wafer is textured, a 3 μm pyramid is formed on the surface, and one side is polished with lye, the concentration of lye is 35wt%, and the polishing temperature is 80°C;
[0056] b. Boron diffusion is performed on both sides of the polished silicon wafer. After boron diffusion, the surface resistance of the silicon wafer is 130Ω / sq, and the surface concentration of boron is 1e19cm -3 , the junction depth of the pn junction is 1.5 μm, a silicon nitride film is grown on the polished surface, the thickness of the silicon nitride film is 140 nm, and the refractive index is 3.1;
[0057] c. Laser removal of borosilicate glass and silicon nitride film on the polished surface, with a line width of 250 μm;
[0058] d. After the silicon nitride film is removed by laser, the silicon wafer is etched in lye and auxiliaries, the volume ratio of auxiliaries and ly...
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