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High-barrier polyimide composite film with shell-like dense structure and preparation method and application thereof

A technology of polyimide film and polyimide, which is applied in semiconductor/solid-state device manufacturing, coating, electrical components, etc., can solve the problems of not meeting OLED packaging requirements, and achieve improved gas barrier performance and good barrier performance , excellent barrier properties

Active Publication Date: 2020-08-07
SUN YAT SEN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The water vapor transmission rate of PI is 1~60g / m 2 / day, the oxygen transmission rate is 1~60g / m 2 / day, relatively low compared to other polymers, but still not meeting OLED packaging requirements

Method used

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  • High-barrier polyimide composite film with shell-like dense structure and preparation method and application thereof
  • High-barrier polyimide composite film with shell-like dense structure and preparation method and application thereof
  • High-barrier polyimide composite film with shell-like dense structure and preparation method and application thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0038] This example is a preparation example of a high-barrier polyimide composite film imitating a shell-like layered dense structure, and the high-barrier polyimide composite material imitating a shell-like layered dense structure is prepared according to the following steps:

[0039] (1) Preparation of nano-montmorillonite colloid: take 6g of sodium-based montmorillonite and 500mL of ultrapure water in a 1000mL single-mouth bottle, stir it with a mechanical stirrer at 800rpm for 24 hours, and separate the suspension obtained by a high-speed centrifuge The montmorillonite that has not been peeled off into a single layer is taken out (the set speed of the centrifuge is 9000rpm, and the centrifugation time is 6min), the supernatant is collected in a 500mL eggplant-shaped bottle, and part of the water is evaporated by rotary evaporation, and finally the concentration Be the montmorillonite colloid of 3.3% (mass fraction);

[0040] (2) Preparation of polyamic acid solution: Take...

Embodiment 2

[0046] This example is a preparation example of a high-barrier polyimide composite film imitating a shell-like layered dense structure, and the high-barrier polyimide composite material imitating a shell-like layered dense structure is prepared according to the following steps:

[0047] (1) Preparation of nano-montmorillonite colloid: Take 6g of sodium-based montmorillonite and 500mL of ultrapure water in a 1000mL one-mouth bottle, and use high-power ultrasound (900W) to continue ultrasonication for 50min. The resulting suspension was separated by a high-speed centrifuge to separate the montmorillonite that was not peeled off into a single layer (the set speed of the centrifuge was 9000rpm, and the centrifugation time was 6min). Part of the water is evaporated to finally obtain the montmorillonite colloid with a concentration of about 3.3% (mass fraction);

[0048] (2) Preparation of polyamic acid solution: Take 1.9044g (9.5112mmol) of ODA and 35mL of N,N'-dimethylformamide DM...

Embodiment 3

[0054] This example is a preparation example of a high-barrier polyimide composite film imitating a shell-like layered dense structure, and the high-barrier polyimide composite material imitating a shell-like layered dense structure is prepared according to the following steps:

[0055] (1) Preparation of nano-montmorillonite colloid: Take 6g of sodium-based montmorillonite and 500mL of ultrapure water in a 1000mL one-mouth bottle, and use high-power ultrasound (900W) to continue ultrasonication for 50min. The resulting suspension was separated by a high-speed centrifuge to separate the montmorillonite that was not peeled off into a single layer (the set speed of the centrifuge was 9000rpm, and the centrifugation time was 6min). Part of the water is evaporated to finally obtain the montmorillonite colloid with a concentration of about 3.3% (mass fraction);

[0056] (2) Preparation of polyamic acid solution: Take 1.9044g (9.5112mmol) of ODA and 35mL of N,N'-dimethylformamide DM...

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Abstract

The invention discloses a high-barrier polyimide composite film with a shell-like dense structure and a preparation method and application thereof, and belongs to the field of flexible electronic device film packaging. The preparation method comprises the following steps: filling a polyimide base material with a high-mass-fraction layered nano material; to prepare the polyimide composite materialwith good gas barrier property; carrying out polycondensation or copolymerization on one or more diamine monomers and one or more dianhydride monomers; preparing a polyimide substrate film with an alkali treatment surface, reacting with an organic alkali to prepare a polyamic acid salt solution, adding the polyamic acid salt solution into a uniformly dispersed nano layered material with a requiredmass concentration to obtain a composite material glue solution, coating the polyimide substrate film with the alkali treatment surface with the composite material glue solution, and carrying out thermal imidization treatment to obtain the film material with good barrier properties. The preparation method is a solution state process and does not involve a vacuum process. The added nanosheet layermaterial is wide in source, low in price and suitable for large-scale industrial manufacturing. The prepared polyimide composite film has good barrier property to gases such as water vapor and the like.

Description

technical field [0001] The invention relates to the technical field of thin film packaging of flexible electronic devices, in particular to a high-barrier polyimide composite film imitating a shell-like dense structure, a preparation method and an application. Background technique [0002] Barrier materials are materials that have a barrier effect on gases and liquids. In the current society, barrier materials have been widely used in daily life, such as packaging of food, medicine, precision instruments, packaging of various display devices, etc., packaging of display devices The barrier performance of materials is more stringent. The barrier performance requirements of packaging materials in common application scenarios are shown in Table 1. [0003] Table 1 Barrier performance requirements of materials in different application scenarios [0004] [0005] In recent decades, high-tech instruments and equipment have been widely used, bringing rapid development to the wor...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08J7/048C08J7/12C09D179/08C09D7/61C08G73/10H01L23/29H01L51/52C08L79/08
CPCC08J7/0427C08J7/12C09D179/08C09D7/61C09D7/70C08G73/1071H01L23/295C08J2379/08C08J2479/08C08K2201/011H10K50/844C08K7/00C08K3/346
Inventor 张艺余桥溪朱龙基刘腾蒋星刘四委池振国许家瑞
Owner SUN YAT SEN UNIV
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