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Silicone resin composition for die-bonding, cured product and optical semiconductor device

A technology of optical semiconductors and silicone resins, applied in semiconductor devices, electrical components, circuits, etc., can solve the problems that the light transmittance of 400nm is not necessarily high, cannot fully meet the performance of optical components, and cannot be bonded, etc., to achieve Excellent transparency and die shear strength, high reliability, and improved productivity

Active Publication Date: 2020-08-25
SHIN ETSU CHEM IND CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, the die-bonding materials made of these conventional silicone resin materials are mainly composed of methyl-based silicone resin compositions, which cannot fully satisfy the performance of optical elements, especially the transmittance of light at 400 nm is not necessarily high.
[0004] On the other hand, Patent Document 4 proposes an addition-curable silicone composition in which an elastomer having a low refractive index, good transparency, and excellent light extraction efficiency is imparted by a fluorine-containing silicone composition, and The encapsulant for an optical element made of this composition, especially for a die bonding material, if the resin is too soft, failure may occur in the wire bonding (wire bonding) process performed after the die bonding process. Bad Situations for Bonding

Method used

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  • Silicone resin composition for die-bonding, cured product and optical semiconductor device
  • Silicone resin composition for die-bonding, cured product and optical semiconductor device

Examples

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Embodiment

[0140] Hereinafter, although an Example is used and this invention is demonstrated concretely, this invention is not limited to these Examples at all. In addition, molecular weight is the weight average molecular weight of standard polystyrene conversion in gel permeation chromatography (GPC). The viscosity at 25° C. is a measured value obtained by a rotational viscometer.

[0141] In addition, the meaning of the abbreviation symbol of each siloxane unit is as follows.

[0142] M: (CH 3 ) 3 SiO 1 / 2

[0143] m vi : (CH 2 =CH)(CH 3 ) 2 SiO 1 / 2

[0144] D: (CH 3 ) 2 SiO 2 / 2

[0145] D. H : H(CH 3 ) SiO 2 / 2

[0146] D. Vi : (CH 2 =CH)(CH 3 ) SiO 2 / 2

[0147] D. F1 : (CF 3 -CH 2 -CH 2 )(CH 3 ) SiO 2 / 2

[0148] D. F2 : [CF 3 -(CF 2 ) 3 -CH 2 -CH 2 ](CH 3 ) SiO 2 / 2

[0149] T F1 : (CF 3 -CH 2 -CH 2 ) SiO 3 / 2

[0150] T F3 : [CF 3 -(CF 2 ) 5 -CH 2 -CH 2 ] SiO 3 / 2

[0151] Q: SiO 4 / 2

[0152]

Synthetic example 1

[0154] Add 152.6 g of 3,3,3-trifluoropropyl-trimethoxysilane, 35.3 g of tetramethoxysilane, 10.5 g of Hexamethyldisiloxane, 20.9 g of 1,3-divinyltetramethyldisiloxane, 32 g of isopropanol, and 2.8 g of methanesulfonic acid were stirred and mixed. 34.8 g of water was added dropwise thereto, 220 g of hexafluoro-m-xylene was added, and then a hydrolysis reaction was performed at 70° C. for 5 hours. 4.6 g of 50% potassium hydroxide aqueous solution was added there, the temperature was raised, low boiling point components were distilled off, and condensation reaction was performed at 120° C. for 5 hours. 1.5 g of methanesulfonic acid was added as a neutralizing agent, and neutralization treatment was performed at 120° C. for 2 hours. Filter after cooling to obtain a weight-average molecular weight of 2,200 and an average unit formula M 1.8 m Vi 3.2 Q 4.3 T F1 10.0 Represented organopolysiloxane (B-1).

Synthetic example 2

[0156] Add 280.8g (3,3,4,4,5,5,6,6,7,7,8,8,8- Tridecafluorooctyl)trimethoxysilane, 47.0g tetramethoxysilane, 10.5g hexamethyldisiloxane, 20.9g 1,3-divinyltetramethyldisiloxane, 32g isopropyl Alcohol and 4.6 g of methanesulfonic acid were stirred and mixed. 33.6 g of water was added dropwise thereto, 360 g of hexafluoro-m-xylene was added, and then a hydrolysis reaction was performed at 70° C. for 5 hours. 7.5 g of 50% aqueous potassium hydroxide solution was added thereto, the temperature was raised, low boiling point components were distilled off, and condensation reaction was performed at 120° C. for 5 hours. 2.4 g of methanesulfonic acid was added as a neutralizing agent, and neutralization treatment was performed at 120° C. for 2 hours. Filter after cooling to obtain a weight-average molecular weight of 2,900 and an average unit formula M1.3 m Vi 2.3 Q 3.9 T F3 5.9 Represented organopolysiloxane (B-2).

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Abstract

The present invention provides a silicone resin composition for die bonding that provides a cured product with a low refractive index, high hardness, and excellent transparency and chip shear strength. The silicone resin composition for die bonding is characterized in that the composition contains: (A) linear organopolysiloxane having, in one molecule, two or more alkenyl groups bonded to Si atomsand one or more CF3(CF2)m(CH2)n groups bonded to Si atoms, and having viscosity of 1,000 mPa.s or less; (B) branched organopolysiloxane having, in one molecule, two or more alkenyl groups bonded to Si atoms and one or more CF3(CF2)o(CH2)p groups bonded to Si atoms, and having Q units and / or T units, accounting for 60 to 90 parts by mass with respect of 100 parts by mass of the sum of the component (A) and the component (B); (C) an organosilicon compound having two or more SiH groups in one molecule, with the mole ratio of the SiH groups in the (C) component to the alkenyl in the (A) and (B) components being 0.5 to 5.0; and (D) a platinum group metal catalyst.

Description

technical field [0001] The present invention relates to a silicone resin composition useful for die bonding of light-emitting diode elements and the like, its cured product, and an optical semiconductor device. Background technique [0002] The use of silicone resins has been proposed as a die-bonding material for light-emitting diode (hereinafter referred to as "LED") elements (Patent Documents 1 to 3). Silicone resins are mainly used for blue LEDs and white LEDs because they are superior in heat resistance, weather resistance, and discoloration resistance compared to conventional epoxy resins. [0003] However, the die-bonding materials made of these conventional silicone resin materials are mainly composed of methyl-based silicone resin compositions, which cannot fully satisfy the performance of optical elements, especially the transmittance of light at 400 nm is not necessarily high. . [0004] On the other hand, Patent Document 4 proposes an addition-curable silicone ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L83/08C08L83/05
CPCC08L83/08C08L2205/025C08L2205/03C08L2201/10C08L83/04C08G77/442C08G77/04H01L33/56
Inventor 小林之人小内谕木村真司
Owner SHIN ETSU CHEM IND CO LTD